Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2005
09/27/2005US6949429 Semiconductor memory device and method for manufacturing the same
09/27/2005US6949428 Method for fabricating capacitor of semiconductor device
09/27/2005US6949427 Methods of forming a capacitor structure
09/27/2005US6949426 Method of fabricating an X-ray detector array element
09/27/2005US6949425 Semiconductor device includes gate insulating film having a high dielectric constant
09/27/2005US6949424 Single poly-emitter PNP using DWELL diffusion in a BiCMOS technology
09/27/2005US6949423 MOSFET-fused nonvolatile read-only memory cell (MOFROM)
09/27/2005US6949422 Method of crystalizing amorphous silicon for use in thin film transistor
09/27/2005US6949421 Method of forming a vertical MOS transistor
09/27/2005US6949420 Silicon-on-insulator (SOI) substrate having dual surface crystallographic orientations and method of forming same
09/27/2005US6949419 Display device and a method for manufacturing the same
09/27/2005US6949418 Method of manufacturing semiconductor device
09/27/2005US6949417 Liquid crystal display and method of manufacturing the same
09/27/2005US6949416 Method of manufacturing a semiconductor integrated circuit device
09/27/2005US6949415 Module with adhesively attached heat sink
09/27/2005US6949414 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
09/27/2005US6949413 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
09/27/2005US6949411 Method for post-etch and strip residue removal on coral films
09/27/2005US6949410 Flip chip in leaded molded package and method of manufacture thereof
09/27/2005US6949408 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
09/27/2005US6949407 Castellation wafer level packaging of integrated circuit chips
09/27/2005US6949406 Method and apparatus for optically aligning integrated circuit devices
09/27/2005US6949405 Method for producing channels and cavities in semiconductor housings, and an electronic component having such channels and cavities
09/27/2005US6949404 Flip chip package with warpage control
09/27/2005US6949402 Method of forming a non-volatile resistance variable device
09/27/2005US6949401 Semiconductor component and method for producing the same
09/27/2005US6949399 Method of reducing contamination-induced process variations during ion implantation
09/27/2005US6949398 Low cost fabrication and assembly of lid for semiconductor devices
09/27/2005US6949397 Fabrication of silicon micro mechanical structures
09/27/2005US6949391 Method of fabricating bottom-gated polycrystalline silicon thin film transistor
09/27/2005US6949389 Encapsulation for organic light emitting diodes devices
09/27/2005US6949388 CMOS image sensor integrated together with memory device
09/27/2005US6949387 Method of designing a semiconductor device
09/27/2005US6949324 Photosensitive fine pattern; mixture of polysiloxane and photosensitive pattern
09/27/2005US6949323 Using tert-amyloxystyrene polymer; exposure to ultraviolet radiation
09/27/2005US6949320 Preparation method of exposure original plate
09/27/2005US6949319 Method for determining depth of focus
09/27/2005US6949269 starter layer having leaving groups is produced by deposition of a reactive component, after which tris(tert-butoxy)silanol is added to selectively grow SiO2
09/27/2005US6949217 Use of infrared radiation in molding of protective caps
09/27/2005US6949204 Deformation reduction at the main chamber
09/27/2005US6949203 System level in-situ integrated dielectric etch process particularly useful for copper dual damascene
09/27/2005US6949177 System and method for processing semiconductor wafers using different wafer processes
09/27/2005US6949174 Milling apparatus
09/27/2005US6949173 Continuous coating system
09/27/2005US6949165 Plasma processing apparatus
09/27/2005US6949164 Providing termination groups selected from identical-with Si-OH, identical-with Si- (OH)2, -Si-(OH)3, and -O-Si-(OH)3, and combinations thereof on the opposing surfaces and placing the opposing surfaces in contact
09/27/2005US6949158 Using backgrind wafer tape to enable wafer mounting of bumped wafers
09/27/2005US6949147 comprises beams of electromagnetic energy conducted through laser/optical arm
09/27/2005US6949146 Cutting chuck to separation modules; pulsation nozzle; ultrasonic generator
09/27/2005US6949144 Low pressure plasma processing apparatus and method
09/27/2005US6949143 Dual substrate loadlock process equipment
09/27/2005US6949015 Machining apparatus equipped with rotary tool
09/27/2005US6949011 Method and apparatus for cleaning a web-based chemical mechanical planarization system
09/27/2005US6949008 System and method for planarizing a substrate surface having a non-planar surface topography
09/27/2005US6948941 Interconnect assemblies and methods
09/27/2005US6948940 Helical microelectronic contact and method for fabricating same
09/27/2005US6948898 Alignment of semiconductor wafers and other articles
09/27/2005US6948623 Frame for housing plate materials
09/27/2005US6948619 Reticle pod and reticle with cut areas
09/27/2005US6948504 Ozonated water flow and concentration control method
09/27/2005US6948374 Capacitive pressure sensor and its manufacturing method
09/27/2005US6948239 Method for fabricating semiconductor apparatus using board frame
09/27/2005US6948238 Method for dissociating metals from metal compounds
09/22/2005WO2005089034A2 An element for carrying electronic components
09/22/2005WO2005089028A1 Highly efficient organic light-emitting device using substrate or electrode having nanosized half-spherical convex and method for preparing
09/22/2005WO2005088790A1 Semiconductor laser element and manufacturing method thereof
09/22/2005WO2005088746A1 Switching device
09/22/2005WO2005088745A1 Magnetoresistive element and its manufacturing method
09/22/2005WO2005088740A1 Gallium nitride-based compound semiconductor light-emitting device
09/22/2005WO2005088735A1 Ga2O3 SEMICONDUCTOR DEVICE
09/22/2005WO2005088728A1 Pn diode based on silicon carbide and method for the production thereof
09/22/2005WO2005088727A1 Memory gate stack structure
09/22/2005WO2005088726A1 Amorphous oxide and thin film transistor
09/22/2005WO2005088725A2 Trench-gate transistors and their manufacture
09/22/2005WO2005088724A1 Trench field effect transistor and method of making it
09/22/2005WO2005088722A2 Trench field effect transistor and method of making it
09/22/2005WO2005088721A1 A bipolar junction transistor having a high germanium concentration in a silicon-germanium layer and a method for forming the bipolar junction transistor
09/22/2005WO2005088714A1 Cold plate and method of making the same
09/22/2005WO2005088709A1 Housing for an electronic circuit and method for sealing the housing
09/22/2005WO2005088706A1 Semiconductor package with perforated substrate
09/22/2005WO2005088705A1 Eeprom memory cell for high temperatures
09/22/2005WO2005088704A1 Semiconductor device
09/22/2005WO2005088703A1 Semiconductor device, method for manufacturing the semiconductor device and portable electronic device provided with the semiconductor device
09/22/2005WO2005088702A1 Semiconductor device
09/22/2005WO2005088701A1 Semiconductor device
09/22/2005WO2005088700A1 Dicing/die boding sheet
09/22/2005WO2005088699A1 Method of manufacturing an electronic device and a resulting device
09/22/2005WO2005088698A1 A method of fabricating a slip line limited substrate for microelectronics, optoelectronics, and optics, and a corresponding substrate
09/22/2005WO2005088697A1 Ic card and process for producing the same
09/22/2005WO2005088696A1 Semiconductor package with contact support layer and method to produce the package
09/22/2005WO2005088695A1 Trench field effect transistor and method of making it
09/22/2005WO2005088694A1 Process for fabricating semiconductor device
09/22/2005WO2005088693A1 Line edge roughness control
09/22/2005WO2005088692A1 Substrate processing apparatus and method for manufacturing semiconductor device
09/22/2005WO2005088691A1 Substrate processing equipment
09/22/2005WO2005088690A1 Polishing pad and semiconductor device manufacturing method
09/22/2005WO2005088689A1 Method for cutting object to be processed
09/22/2005WO2005088688A1 Substrate processing apparatus and method for manufacturing semiconductor device
09/22/2005WO2005088687A1 Method for manufacturing gallium nitride semiconductor substrate
09/22/2005WO2005088686A1 Step measuring method and apparatus, and exposure method and apparatus
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