Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2005
09/20/2005US6946397 Chemical mechanical polishing process with reduced defects in a copper process
09/20/2005US6946396 Maleic acid and ethylene urea containing formulation for removing residue from semiconductor substrate and method for cleaning wafer
09/20/2005US6946395 Devices containing zirconium-platinum-containing materials and methods for preparing such materials and devices
09/20/2005US6946394 Methods and systems for determining a characteristic of a layer formed on a specimen by a deposition process
09/20/2005US6946393 Small grain size, conformal aluminum interconnects and method for their formation
09/20/2005US6946392 Filling plugs through chemical mechanical polish
09/20/2005US6946391 Method for forming dual damascenes
09/20/2005US6946390 Photolithographic production of trenches in a substrate
09/20/2005US6946389 Method of forming buried conductors
09/20/2005US6946388 Method for fabricating semiconductor devices
09/20/2005US6946387 Semiconductor device and method for manufacturing the same
09/20/2005US6946385 Production method for semiconductor device
09/20/2005US6946384 Stacked device underfill and a method of fabrication
09/20/2005US6946383 Method for forming wiring structure which includes annealing conductive film before and after removal of a portion of the conductive film
09/20/2005US6946382 Process for making air gap containing semiconducting devices and resulting semiconducting device
09/20/2005US6946381 Method of forming insulating film in semiconductor device
09/20/2005US6946380 Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
09/20/2005US6946378 Methods for fabricating protective structures for bond wires
09/20/2005US6946377 Multiple-gate MOSFET device with lithography independent silicon body thickness and methods for fabricating the same
09/20/2005US6946376 Symmetric device with contacts self aligned to gate
09/20/2005US6946375 Manufacture of probe unit having lead probes extending beyond edge of substrate
09/20/2005US6946374 Methods of manufacturing flash memory semiconductor devices
09/20/2005US6946373 Relaxed, low-defect SGOI for strained Si CMOS applications
09/20/2005US6946372 Method of manufacturing gallium nitride based semiconductor light emitting device
09/20/2005US6946371 Methods of fabricating semiconductor structures having epitaxially grown source and drain elements
09/20/2005US6946369 Method for forming, by CVD, nanostructures of semi-conductor material of homogenous and controlled size on dielectric material
09/20/2005US6946368 Reduction of native oxide at germanium interface using hydrogen-based plasma
09/20/2005US6946367 Methods for forming a semiconductor thin film
09/20/2005US6946366 Method and device for protecting micro electromechanical systems structures during dicing of a wafer
09/20/2005US6946365 Method for producing a thin film comprising introduction of gaseous species
09/20/2005US6946364 Integrated circuit having a device wafer with a diffused doped backside layer
09/20/2005US6946363 Method for bonding substrates
09/20/2005US6946361 Method of peeling off and method of manufacturing semiconductor device
09/20/2005US6946360 Fluid pressure bonding
09/20/2005US6946359 Method for fabricating trench isolations with high aspect ratio
09/20/2005US6946358 Method of fabricating shallow trench isolation by ultra-thin SIMOX processing
09/20/2005US6946357 Conductive container structures having a dielectric cap
09/20/2005US6946356 Capacitor and method for fabricating the same
09/20/2005US6946355 Method for producing a hetero-bipolar transistor and hetero-bipolar transistor
09/20/2005US6946354 Substrate and manufacturing method therefor
09/20/2005US6946353 Low voltage high performance semiconductor devices and methods
09/20/2005US6946352 CMOS image sensor device and method
09/20/2005US6946351 Method for fabricating a semiconductor device
09/20/2005US6946350 Controlled faceting of source/drain regions
09/20/2005US6946349 Method for integrating a SONOS gate oxide transistor into a logic/analog integrated circuit having several gate oxide thicknesses
09/20/2005US6946348 Low voltage high density trench-gated power device with uniformity doped channel and its edge termination technique
09/20/2005US6946346 Method for manufacturing a single electron memory device having quantum dots between gate electrode and single electron storage element
09/20/2005US6946345 Self-aligned buried strap process using doped HDP oxide
09/20/2005US6946344 Method for forming trench capacitor
09/20/2005US6946343 Manufacturing method of an integrated chip
09/20/2005US6946342 Semiconductor device and method for manufacturing the same
09/20/2005US6946341 Methods for manufacturing storage nodes of stacked capacitors
09/20/2005US6946340 Method of fabricating ferroelectric memory device with photoresist and capping layer
09/20/2005US6946339 Method for creating a stepped structure on a substrate
09/20/2005US6946338 Method for manufacturing semiconductor device
09/20/2005US6946337 Method of manufacturing semiconductor devices
09/20/2005US6946336 Method of making a nanoscale electronic device
09/20/2005US6946335 Method of manufacturing improved double-diffused metal-oxide-semiconductor device with self-aligned channel
09/20/2005US6946333 Active matrix pixel device construction method
09/20/2005US6946332 Forming nanoscale patterned thin film metal layers
09/20/2005US6946331 Apparatus and method for manufacturing semiconductor device incorporating fuse elements
09/20/2005US6946330 Designing method and manufacturing method for semiconductor display device
09/20/2005US6946328 Method for manufacturing semiconductor devices
09/20/2005US6946327 Semiconductor device and manufacturing method of that
09/20/2005US6946326 Method and device for protecting micro electromechanical systems structures during dicing of a wafer
09/20/2005US6946324 Process for fabricating a leadless plastic chip carrier
09/20/2005US6946323 Semiconductor package having one or more die stacked on a prepackaged device and method therefor
09/20/2005US6946322 Large area printing method for integrating device and circuit components
09/20/2005US6946321 Method of forming the integrated circuit having a die with high Q inductors and capacitors attached to a die with a circuit as a flip chip
09/20/2005US6946320 FBAR based duplexer device and manufacturing method thereof
09/20/2005US6946319 Electrode for an electronic device
09/20/2005US6946318 Method of forming GE photodetectors
09/20/2005US6946317 Method of fabricating heteroepitaxial microstructures
09/20/2005US6946316 Method of fabricating and using an image sensor package
09/20/2005US6946315 Manufacturing methods of MEMS device
09/20/2005US6946314 Method for microfabricating structures using silicon-on-insulator material
09/20/2005US6946313 Method of making an aligned electrode on a semiconductor structure
09/20/2005US6946312 Semiconductor light emitting device and its manufacture
09/20/2005US6946311 Processing apparatus and wafer processing method
09/20/2005US6946310 Display device
09/20/2005US6946308 Method of manufacturing III-V group compound semiconductor
09/20/2005US6946307 Method and system for testing driver circuits of AMOLED
09/20/2005US6946306 Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
09/20/2005US6946305 Apparatus for evaluating amount of charge, method for fabricating the same, and method for evaluating amount of charge
09/20/2005US6946304 Apparatus for and method of manufacturing a semiconductor device, and cleaning method for use in the apparatus for manufacturing a semiconductor device
09/20/2005US6946303 Electronically diagnosing a component in a process line using a substrate signature
09/20/2005US6946302 Synthetic-ferrimagnet sense-layer for high density MRAM applications
09/20/2005US6946235 Radiation transparent; bonding strength; lithography
09/20/2005US6946200 Methods for reducing the curvature in boron-doped silicon micromachined structures
09/20/2005US6946198 A semiconductor device is bonded to a wiring board, using a liquid binder containing epoxy resins and a hydrolyzed silantriol coupling agents, a curing agent, and conductive metallic powder; low viscosity
09/20/2005US6946178 A releasable adhesion layer, thermal transfer element comprising a polymer can be photosensitive, delaminated at low temperature, decomposition, maintaining good adhesion at high temperature; use in electronics, transistors, semiconductors
09/20/2005US6946167 Deposited film forming apparatus and deposited film forming method
09/20/2005US6946161 Method for forming porous silica film
09/20/2005US6946158 Enhancing the deposition of titanium containing materials on a substrate from a titanium containing precursor by the addition of organic amines to the titanium containing precursor
09/20/2005US6946066 Multi step electrodeposition process for reducing defects and minimizing film thickness
09/20/2005US6946055 Method for recovering an organic solvent from a waste stream containing supercritical CO2
09/20/2005US6946054 Modified transfer function deposition baffles and high density plasma ignition therewith in semiconductor processing
09/20/2005US6946052 Separating apparatus and processing method for plate member
09/20/2005US6946046 Method and apparatus for separating member
09/20/2005US6946039 Physical vapor deposition targets, and methods of fabricating metallic materials