Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2005
09/22/2005US20050208756 Method of removing resist, semiconductor device thereby and method of manufacturing a semiconductor device
09/22/2005US20050208755 Nitrogen-free ARC layer and a method of manufacturing the same
09/22/2005US20050208754 Method of growing electrical conductors
09/22/2005US20050208753 Dual-damascene interconnects without an etch stop layer by alternating ILDs
09/22/2005US20050208752 Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby
09/22/2005US20050208751 Solder bump structure and method for forming a solder bump
09/22/2005US20050208750 Method of making cascaded die mountings with springs-loaded contact-bond options
09/22/2005US20050208749 Methods for forming electrical connections and resulting devices
09/22/2005US20050208748 Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
09/22/2005US20050208747 Method of routing an electrical connection on a semiconductor device and structure therefor
09/22/2005US20050208746 Low cost electrically conductive flooring tile manufactured from conductive loaded resin-based materials
09/22/2005US20050208745 Methods of forming a conductive contact through a dielectric
09/22/2005US20050208744 Split gate type nonvolatile semiconductor memory device, and method of fabricating the same
09/22/2005US20050208743 Method for manufacturing semiconductor device
09/22/2005US20050208742 Oxidized tantalum nitride as an improved hardmask in dual-damascene processing
09/22/2005US20050208741 Methods for forming rough ruthenium-containing layers and structures/methods using same
09/22/2005US20050208740 Process for deposition of semiconductor films
09/22/2005US20050208738 Semiconductor device and method of manufacturing the same
09/22/2005US20050208737 Steam oxidation apparatus
09/22/2005US20050208736 Dicing die-bonding film
09/22/2005US20050208735 Semiconductor device and manufacturing method of the same
09/22/2005US20050208734 Thin flip-chip method
09/22/2005US20050208733 Oxygen plasma treatment for a nitride surface to reduce photo footing
09/22/2005US20050208732 Method to form shallow trench isolation with rounded upper corner for advanced semiconductor circuits
09/22/2005US20050208731 Method for fabricating semiconductor integrated circuit device
09/22/2005US20050208730 Methods of forming materials within openings, and methods of forming isolation regions
09/22/2005US20050208729 Methods of forming a double-sided capacitor or a contact using a sacrificial structure and semiconductor device precursor structures to a double-sided capacitor or a contact
09/22/2005US20050208728 Semiconductor component having an integrated capactiance structure and method for producing the same
09/22/2005US20050208727 Method of etching bottle trench and fabricating capacitor with same
09/22/2005US20050208726 Spacer approach for CMOS devices
09/22/2005US20050208725 Semiconductor device having shared contact and fabrication method thereof
09/22/2005US20050208724 Trench power MOSFET fabrication using inside/outside spacers
09/22/2005US20050208723 Semiconductor device including a channel stop structure and method of manufacturing the same
09/22/2005US20050208722 Trench-gate semiconductor device and method of manufacturing
09/22/2005US20050208721 Method for manufacturing NAND flash device
09/22/2005US20050208720 Method of manufacturing a nonvolatile memory cell with triple spacers and the structure thereof
09/22/2005US20050208719 Semiconductor device and method of manufacturing the same
09/22/2005US20050208718 Methods of forming a capacitor using an atomic layer deposition process
09/22/2005US20050208717 Capacitor with enhanced performance and method of manufacture
09/22/2005US20050208716 Semiconductor integrated circuit device and production method thereof
09/22/2005US20050208715 Method of fabricating fin field effect transistor using isotropic etching technique
09/22/2005US20050208714 Method of manufacturing a semiconductor device and manufacturing system thereof
09/22/2005US20050208712 Method of forming a partially depleted silicon on insulator (PDSOI) transistor with a pad lock body extension
09/22/2005US20050208711 Thin film transistor array substrate for a liquid crystal display and the method for fabricating the same
09/22/2005US20050208710 Method of manufacturing a semiconductor device
09/22/2005US20050208708 Adhesive assembly for a circuit board
09/22/2005US20050208707 Method for fabricating window ball grid array semiconductor package
09/22/2005US20050208706 Method of creating multi-layered monolithic circuit structure containing integral buried and trimmed components
09/22/2005US20050208704 Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof
09/22/2005US20050208703 Method of producing an electronic component with flexible bonding pads
09/22/2005US20050208702 Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof
09/22/2005US20050208701 Semiconductor chip packaging method with individually placed film adhesive pieces
09/22/2005US20050208700 Die to substrate attach using printed adhesive
09/22/2005US20050208699 Phase Change Memory Cell On Silicon-On Insulator Substrate
09/22/2005US20050208696 Method for manufacturing a semiconductor pressure sensor
09/22/2005US20050208695 Electronic device and methods for fabricating an electronic device
09/22/2005US20050208693 Method of fabricating an in-plane switching liquid crystal display device
09/22/2005US20050208692 Image sensor and method for fabricating the same
09/22/2005US20050208691 Method for manufacturing light-emitting diode
09/22/2005US20050208690 Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig
09/22/2005US20050208687 Method of Manufacturing Single-Crystal GaN Substrate, and Single-Crystal GaN Substrate
09/22/2005US20050208686 Nitride semiconductor LED improved in lighting efficiency and fabrication method thereof
09/22/2005US20050208685 Periodic patterns and technique to control misalignment
09/22/2005US20050208684 Manufacturing method of semiconductor device
09/22/2005US20050208683 [method of correcting lithographic process and method of forming overlay mark]
09/22/2005US20050208682 Magnetic memory device and method of manufacturing the same
09/22/2005US20050208681 Method for fabricating a flux concentrating system for use in a magnetoelectronics device
09/22/2005US20050208680 Method for producing a reference layer and an mram memory cell provided with said type of reference layer
09/22/2005US20050208674 Using solution comprising hydrofluoric acid and/or aqueous hydrogen peroxide to remove copper, gold, silver and/or platinum from semiconductor wafers
09/22/2005US20050208646 Bioarray chip reaction apparatus and its manufacture
09/22/2005US20050208531 Biochip substrate and process for its production
09/22/2005US20050208486 Using tumor suppressor gene expression as diagnostic tool in detection of genes associated with cell proliferative disorders
09/22/2005US20050208434 Method and system for treating a hard mask to improve etch characteristics
09/22/2005US20050208433 Pattern forming method, circuit substrate and electronic apparatus
09/22/2005US20050208427 Semiconductor device manufacturing method
09/22/2005US20050208424 (Meth)acrylate polymer comprising (co)monomers having adamantane group such as 2-ethyl-2-adamantyl-methacrylate, 10.0 g of hydroxyadamantyl methacrylate, 15.2 g of 4,8-dioxatricyclo[4.2.1.03,7]nonan-5-on-2-yl methacrylate; sensitive to high energy radiation; resolution; micropatterning
09/22/2005US20050208421 Photosensitive resin composition and use of the same
09/22/2005US20050208417 Cyanoadamantyl compounds and polymers and photoresists comprising same
09/22/2005US20050208400 Organic semiconductor layer and a voltage control layer giving an ambipolar characteristic to the organic semiconductor layer.
09/22/2005US20050208392 An approximated curve to the curve of the actual pattern, mask pattern can be formed based on an individual and specific polygonal approximation in accordance with the shapes
09/22/2005US20050208391 Focus masking structures, focus patterns and measurements thereof
09/22/2005US20050208389 Reflection type mask blank and reflection type mask and production methods for them
09/22/2005US20050208322 Method for treating substrates for microelectronics and substrates obtained by said method
09/22/2005US20050208307 Phenolic resins; polysiloxanes; improved solder heat resistance productivity; lightweight
09/22/2005US20050208296 Hardenable pressure-sensitive adhesive sheet for semiconductor and process for producing semiconductor device
09/22/2005US20050208280 Microelectronic device interconnects
09/22/2005US20050208268 Article with ultraphobic surface
09/22/2005US20050208219 Composite oxide dielectric; sputtering using various pressure; overcoating semiconductor substrate
09/22/2005US20050208217 Apparatus and method for forming thin film using upstream and downstream exhaust mechanisms
09/22/2005US20050208215 TetramethoxySilane is emitted without charging into the plasma, the discharge processed O2 is separately emitted; TMOS and O2 are joined at the surface of a substrate forming an oxide film; excellent in membranous and coverage property at a fast film forming speed; electronic circuits
09/22/2005US20050208209 Ferroelectric film, method for manufacturing ferroelectric film, ferroelectric capacitor, ferroelectric memory, and piezoelectric element
09/22/2005US20050208171 Mold and molding apparatus using the same
09/22/2005US20050208142 Production of nanoparticles having a defined number of ligands
09/22/2005US20050207960 charging and mixing silicon oxide and gallium dopes in a crucible, then melting and cooling to incorporate gallium in the crystals used as substrates for photoelectric cells
09/22/2005US20050207875 Blade of wafer transfer robot, semiconductor manufacturing equipment having a transfer robot comprising the same, and method of aligning a wafer with a process chamber
09/22/2005US20050207697 Method of manufacturing an opto-coupler
09/22/2005US20050207691 Silicon-insulator-silicon thin-film structures for optical modulators and methods of manufacture
09/22/2005US20050207637 Polarization analyzing system, exposure method, and method for manufacturing semiconductor device
09/22/2005US20050207527 Radiation generating apparatus, radiation generating method, exposure apparatus, and exposure method
09/22/2005US20050207264 Method to increase coupling ratio of source to floating gate in split-gate flash
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