Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2006
01/18/2006CN1723551A Semiconductor device and process for producing the same
01/18/2006CN1723550A C implants for improved SiGe bipolar yield
01/18/2006CN1723549A Method for plasma etching performance enhancement
01/18/2006CN1723548A Method for processing nitride semiconductor crystal surface and nitride semiconductor crystal obtained by such method
01/18/2006CN1723547A Method of producing semiconductor single crystal wafer and laser processing device used therefor
01/18/2006CN1723546A Carrier head for chemical-mechanical polishing apparatus
01/18/2006CN1723545A SiGe strain relaxed buffer for high mobility devices and a method of fabricating it
01/18/2006CN1723544A Fast localization of electrical failures on an integrated circuit system and method
01/18/2006CN1723543A Method of producing a complex structure by assembling stressed structures
01/18/2006CN1723542A Exposure apparatus and device manufacturing method
01/18/2006CN1723541A Exposure apparatus and method for producing device
01/18/2006CN1723540A Exposure apparatus and method for producing device
01/18/2006CN1723539A Exposure apparatus, exposure method, and method for producing device
01/18/2006CN1723538A Exposure apparatus and method for producing device
01/18/2006CN1723537A Exposure apparatus and method for producing device
01/18/2006CN1723536A Exposure apparatus and method for producing device
01/18/2006CN1723535A System and method for suppression of wafer temperature drift in cold-well cvd system
01/18/2006CN1723528A Stepped upper electrode for plasma processing uniformity
01/18/2006CN1723482A 发光装置及其制作方法 Light-emitting device and manufacturing method thereof
01/18/2006CN1723423A Method for automatic configuration of a processing system
01/18/2006CN1723418A Composition for forming antireflection film for lithography
01/18/2006CN1723416A Picture dimension correcting unit and method, photomask and test used photomask
01/18/2006CN1723303A A substrate for epitaxy and a method of preparing the same
01/18/2006CN1723302A A substrate for epitaxy and a method of preparing the same
01/18/2006CN1723295A Method for making carbon doped oxide film
01/18/2006CN1723292A High purity nickel/vanadium sputtering components; and methods of making sputtering components
01/18/2006CN1723273A Cleaning agent composition, cleaning and production methods for semiconductor wafer, and semiconductor wafer
01/18/2006CN1723099A Method and apparatus for high volume assembly of radio frequency identification tags
01/18/2006CN1723097A Thermal flux processing by scanning electromagnetic radiation
01/18/2006CN1723091A Ultrsonic washing equipment and ultrasonic washing method
01/18/2006CN1723066A Trapping device, processing system, and method for removing impurities
01/18/2006CN1722948A Semiconductor apparatus and method of manufacturing semiconductor apparatus
01/18/2006CN1722941A Method for providing a layer, wiring substrate, elector-optical device, and electronic equipment
01/18/2006CN1722930A Flexible circuit substrate
01/18/2006CN1722535A Stud bump socket
01/18/2006CN1722480A Nanowire light-emitting element and manufacturing method therefor
01/18/2006CN1722474A Photovoltaic cell, photovoltaic cell module, method of fabricating photovoltaic cell and method of repairing photovoltaic cell
01/18/2006CN1722470A Diode with improved energy impulse rating
01/18/2006CN1722469A Thick film chip diode and its manufacturing method
01/18/2006CN1722468A Portable information terminal
01/18/2006CN1722467A Low-temperature polysilicon thin film transistor and method for manufacturing its channel layer
01/18/2006CN1722466A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
01/18/2006CN1722464A Lateral semiconductor device using trench structure and method of manufacturing the same
01/18/2006CN1722463A Method of forming metal/high-K gate stacks with high mobility
01/18/2006CN1722462A Phase-change memory unit combined by reversible phase-change resistance and transistor and preparing method thereof
01/18/2006CN1722458A Solid state image pickup device
01/18/2006CN1722456A Image sensor package and method of manufacturing the same
01/18/2006CN1722454A Solid-state image sensor and method for fabricating the same
01/18/2006CN1722453A Electronic imaging apparatus
01/18/2006CN1722452A Thin film transistor array substrate, display using the same, and fabrication method thereof
01/18/2006CN1722451A Method of manufacturing displays and apparatus for manufacturing displays
01/18/2006CN1722450A Thin film semiconductor device, electrolight device and intermediate mask
01/18/2006CN1722449A Substrate for semiconductor device, method of manufacturing substrate for semiconductor device, and use
01/18/2006CN1722448A Thin film integrated circuit and method for manufacturing the same, CPU, memory, electronic card and electronic device
01/18/2006CN1722447A Nonvolatile semiconductor memory device and method of manufacturing the same
01/18/2006CN1722446A Methods of forming split-gate non-volatile memory cells including raised oxide layers on field oxide regions and split-gate non-volatile memory cells so formed
01/18/2006CN1722445A Charge trapping non-volatile memory and method for operating same
01/18/2006CN1722444A Charge trapping non-volatile memory and method for gate-by-gate erase for same
01/18/2006CN1722443A Semiconductor memory device and method of arranging signal and power lines thereof
01/18/2006CN1722442A Nonvolatile semiconductor memory device and method of manufacturing the same
01/18/2006CN1722438A Low leakage monotonic CMOS logic
01/18/2006CN1722437A Integrated circuit devices including a dual gate stack structure and methods of forming the same
01/18/2006CN1722436A Semiconductor device
01/18/2006CN1722435A Semiconductor device and manufacturing method thereof
01/18/2006CN1722430A Circuit module and method for manufacturing the same
01/18/2006CN1722429A 半导体器件 Semiconductor devices
01/18/2006CN1722428A Semiconductor device having copper wiring and its manufacture method
01/18/2006CN1722427A Interconnection structures for semicondcutor devices and methods of forming the same
01/18/2006CN1722426A Semiconductor unit
01/18/2006CN1722425A Semiconductor structure
01/18/2006CN1722424A Dual damascene wiring and method
01/18/2006CN1722422A Semiconductor package
01/18/2006CN1722421A Semiconductor package including redistribution pattern and method of manufacturing the same
01/18/2006CN1722420A 半导体装置 Semiconductor device
01/18/2006CN1722419A Semiconductor device and manufacturing method of the same
01/18/2006CN1722418A Semiconductor device
01/18/2006CN1722417A Bonding pad and chip structure
01/18/2006CN1722415A Semiconductor chip having polished and ground bottom surface portions
01/18/2006CN1722414A Semiconductor device and method of manufacturing the same
01/18/2006CN1722413A Optical electronic apparatus and method for producing the same
01/18/2006CN1722412A Package circuit board and package including a package circuit board and method thereof
01/18/2006CN1722411A Semiconductor memory device and manufacturing method thereof
01/18/2006CN1722410A Method of manufacturing flash memory device
01/18/2006CN1722409A Method for fabricating semiconductor device capable of decreasing critical dimension in peripheral region
01/18/2006CN1722408A Manufacturing method of grating oxide film
01/18/2006CN1722407A Method of fabricating a semiconductor device with multiple gate oxide thicknesses
01/18/2006CN1722406A Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus
01/18/2006CN1722405A Method of forming metal wiring of semiconductor device
01/18/2006CN1722404A Novel device structure having enhanced surface adhesion and failure mode analysis
01/18/2006CN1722403A Method for manufacturing device isolation film of semiconductor device
01/18/2006CN1722402A Reversible integrated circuit disc and method using it
01/18/2006CN1722401A Manufacturing method of a semiconductor device and apparatus for manufacturing a semiconductor device
01/18/2006CN1722400A Method and apparatus for measuring the size of free air balls on a wire bonder
01/18/2006CN1722399A Method and apparatus for mapping a position of a capillary tool tip using a prism
01/18/2006CN1722398A Method for arraying chip of first lining to second lining
01/18/2006CN1722397A Method for reducing or eliminating semiconductor device wire sweep and a device produced by the method
01/18/2006CN1722396A Capillary for wire bonding
01/18/2006CN1722395A Circuit connection method
01/18/2006CN1722394A Processing method for forming electrode on plate-shape article
01/18/2006CN1722393A Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip