Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2006
01/19/2006US20060014374 Layer assembly and method for producing a layer assembly
01/19/2006US20060014373 Method for finishing metal line for semiconductor device
01/19/2006US20060014372 Semiconductor device and method for fabricating the same
01/19/2006US20060014371 Method for forming an integrated semiconductor circuit arrangement
01/19/2006US20060014370 Methods for processing integrated circuit packages formed using electroplating and apparatus made therefrom
01/19/2006US20060014369 Stud electrode and process for making same
01/19/2006US20060014368 Method for manufacturing gallium nitride based transparent conductive oxidized film ohmic electrodes
01/19/2006US20060014367 Nucleation and deposition of platinum group metal films using ultraviolet irradiation
01/19/2006US20060014366 Control of strain in device layers by prevention of relaxation
01/19/2006US20060014365 Method for fabricating a semiconductor element from a dispersion of semiconductor particles
01/19/2006US20060014364 Semiconductor device and semiconductor wafer and a method for manufacturing the same
01/19/2006US20060014363 Thermal treatment of a semiconductor layer
01/19/2006US20060014362 Methods of forming shallow trench isolation structures in semiconductor devices
01/19/2006US20060014361 Method for forming device isolation layer of semiconductor device
01/19/2006US20060014360 Semiconductor device and method of fabricating the same
01/19/2006US20060014359 Formation of active area using semiconductor growth process without STI integration
01/19/2006US20060014358 Method for microfabricating structures using silicon-on-insulator material
01/19/2006US20060014357 Structure and method of making an enhanced surface area capacitor
01/19/2006US20060014356 Metal-insulator-metal capacitor and method of fabricating same
01/19/2006US20060014355 Semiconductor device and method of manufacturing the same
01/19/2006US20060014354 Method of making transistor with strained source/drain
01/19/2006US20060014353 Semiconductor device and manufacturing method therefor
01/19/2006US20060014352 Method and apparatus providing CMOS imager device pixel with transistor having lower threshold voltage than other imager device transistors
01/19/2006US20060014351 Low leakage MOS transistor
01/19/2006US20060014350 Method for fabricating a semiconductor transistor device having ultra-shallow source/drain extensions
01/19/2006US20060014349 Planarized and silicided trench contact
01/19/2006US20060014348 Method for fabricating a mask ROM
01/19/2006US20060014347 Semiconductor integrated circuit device having single-element type non-volatile memory elements
01/19/2006US20060014346 Magnetic random access memory array with thin conduction electrical read and write lines
01/19/2006US20060014345 Uniform channel programmable erasable flash EEPROM
01/19/2006US20060014344 Methods of forming semiconductor structures and capacitor devices
01/19/2006US20060014343 Method for forming a capacitor for an integrated circuit and integrated circuit
01/19/2006US20060014342 Method of manufacturing a semiconductor component
01/19/2006US20060014341 Method for fabricating a gate mask of a semiconductor device
01/19/2006US20060014340 Semiconductor device and method of manufacturing the same
01/19/2006US20060014339 Method of detecting one or more defects in a string of spaced apart studs
01/19/2006US20060014338 Method and structure for strained finfet devices
01/19/2006US20060014337 Semiconductor device and method for manufacturing the same
01/19/2006US20060014336 Method of forming double-gated silicon-on-insulator (SOI) transistors with corner rounding
01/19/2006US20060014335 Method of manufacturing a semiconductor device
01/19/2006US20060014334 Method of fabricating heterojunction devices integrated with CMOS
01/19/2006US20060014333 Anchoring, by lateral oxidizing, of patterns of a thin film to prevent the dewetting phenomenon
01/19/2006US20060014332 SOI device having increased reliability and reduced free floating body effects
01/19/2006US20060014331 Floating-body DRAM in tri-gate technology
01/19/2006US20060014330 Method for manufacturing soi wafer
01/19/2006US20060014329 Nanodots formed on silicon oxide and method of manufacturing the same
01/19/2006US20060014328 Resin encapsulation molding for semiconductor device
01/19/2006US20060014327 Method of fabricating PCB including embedded passive chip
01/19/2006US20060014326 Method for fabricating a semiconductor component with contacts situated at the underside
01/19/2006US20060014325 Method of assembling a semiconductor component and apparatus therefor
01/19/2006US20060014324 Method and apparatus for cutting away excess synthetic resin from synthetic resin package of electronic component
01/19/2006US20060014323 Thermal interface material with fluid
01/19/2006US20060014322 Methods and apparatuses relating to block configurations and fluidic self-assembly processes
01/19/2006US20060014321 Manufacturing method of semiconductor device and manufacturing method of lead frame
01/19/2006US20060014320 Method of manufacturing semiconductor device
01/19/2006US20060014319 Castellation wafer level packaging of integrated circuit chips
01/19/2006US20060014318 Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same
01/19/2006US20060014317 Integrated circuit package having reduced interconnects
01/19/2006US20060014316 Method of making a semiconductor chip assemby with a metal containment wall and a solder terminal
01/19/2006US20060014314 Image sensor with light guides
01/19/2006US20060014313 Microelectronic imaging units and methods of manufacturing microelectronic imaging units
01/19/2006US20060014312 Method for stripping sacrificial layer in MEMS assembly
01/19/2006US20060014311 Method of manufacturing semiconductor laser element
01/19/2006US20060014310 Resonant cavity III-nitride light emitting devices fabricated by growth substrate removal
01/19/2006US20060014309 Temporary chip attach method using reworkable conductive adhesive interconnections
01/19/2006US20060014308 Procedure for arranging chips of a first substrate on a second substrate
01/19/2006US20060014307 Ferroelectric random access memory capacitor and method for manufacturing the same
01/19/2006US20060014306 Magnetic random access memory array with thin conduction electrical read and write lines
01/19/2006US20060014305 MTJ patterning using free layer wet etching and lift off techniques
01/19/2006US20060014304 Superconductor and process for producing the same
01/19/2006US20060014303 Layered ceramic electronic part and manufacturing method thereof
01/19/2006US20060014271 Fabrication of a completely polymeric microfluidic reactor for chemical synthesis
01/19/2006US20060014100 high resolution, favorable shape, wide depth of focus; acrylic ester copolymer
01/19/2006US20060014098 Process for producing photoresist composition, filter, coater and photoresist composition
01/19/2006US20060014084 Method for providing nano-structures of uniform length
01/19/2006US20060014082 Method of correcting mask pattern
01/19/2006US20060013747 Highly efficient compact capacitance coupled plasma reactor/generator and method
01/19/2006US20060013050 Magnetic memory device having a plurality of magneto-resistance effect elements arranged in a matrix form and method for manufacturing the same
01/19/2006US20060013029 Low cost high density rectifier matrix memory
01/19/2006US20060012940 MEMS RF-switch using semiconductor
01/19/2006US20060012939 Clamp for use in processing semiconductor workpieces
01/19/2006US20060012769 Illumination optical system and exposure apparatus using the same
01/19/2006US20060012764 Exposure apparatus and method
01/19/2006US20060012762 Method for cleaning semiconductor device
01/19/2006US20060012728 Display device and method for repairing line disconnection thereof
01/19/2006US20060012384 Semiconductor substrate and test pattern for the same
01/19/2006US20060012383 Semiconductor substrate and test pattern for the same
01/19/2006US20060012087 Manufacturing method for sintered body with buried metallic member
01/19/2006US20060012050 Semiconductor device, designing method thereof, and recording medium storing semicondcutor designing program
01/19/2006US20060012049 Top layers of metal for high performance IC's
01/19/2006US20060012042 Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same
01/19/2006US20060012039 Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
01/19/2006US20060012038 Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device
01/19/2006US20060012037 Methods for bonding and devices according to such methods
01/19/2006US20060012036 Circuit device with at least partial packaging and method for forming
01/19/2006US20060012035 Method of packaging integrated circuits, and integrated circuit packages produced by the method
01/19/2006US20060012033 Semiconductor device and a method of manufacturing the same
01/19/2006US20060012027 Thermally isolated via structure
01/19/2006US20060012025 Semiconductor device and manufacturing method therefor
01/19/2006US20060012021 Film bulk acoustic resonator package and method of fabricating same