Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2006
05/18/2006DE10202701B4 Vorrichtung zum Polieren eines Wafers An apparatus for polishing a wafer
05/18/2006DE102005048860A1 Schutzfilmmittel zum Laservereinzeln und Waferverarbeitungsverfahren unter Verwendung des Schutzfilmmittels Means for Laservereinzeln protective film and wafer processing method using the protective film by means of
05/18/2006DE102005048380A1 Vorrichtung zum Belichten eines Substrats, Photomaske und modifiziertes Beleuchtungssystem der Vorrichtung und Verfahren zum Bilden eines Musters an einem Substrat unter Verwendung der Vorrichtung An apparatus for exposing a substrate, photomask and modified illumination system of the apparatus and method for forming a pattern on a substrate using the apparatus
05/18/2006DE102005030338A1 Thin film etching for liquid crystal display device comprises forming layer on substrate, aligning mask having pattern above layer, and removing portion of layer by irradiating substrate with femtosecond laser through mask
05/18/2006DE102005001163B3 Semiconductor wafers` testing method, involves testing wafer by probes, and reducing heating energy with constant cooling efficiency, under consideration of detected increase of temperature of fluids flowing via tempered chuck device
05/18/2006DE102004058305B3 Semiconductor component with polymer cover layer over electrical linkages leaving contacts exposed
05/18/2006DE102004055061A1 Verfahren zur Anordnung eines Flip-Chips auf einem Substrat A process for the assembly of a flip chip on a substrate
05/18/2006DE102004054658B3 Static megasound cleaning system for cleaning substrates, has outer basin with four side walls with acoustic irradiation surfaces, where each surface is responsible for treatment of only small partial area of entire substrate surface
05/18/2006DE102004053761A1 Halbleitereinrichtung und Verfahren für deren Herstellung Semiconductor device and methods for their preparation
05/18/2006DE102004049667B3 Herstellungsverfahren für einen Grabenkondensator mit einem Isolationskragen, der über einen vergrabenen Kontakt einseitig mit einem Substrat elektrisch verbunden ist, insbesondere für eine Halbleiterspeicherzelle und entsprechender Grabenkondensator Manufacturing method for a grave capacitor with an insulation collar, which is electrically connected through a buried contact on one side with a substrate, in particular for a semiconductor memory cell and corresponding capacitor grave
05/18/2006DE102004015994B4 Vorrichtung zur Vereinzelung und Positionierung von Modulbrücken Apparatus for separating and positioning module bridges
05/18/2006DE10149199B4 Speicherzellenfeld und Verfahren zu seiner Herstellung Memory cell array and process for its preparation
05/18/2006DE10134461B4 Prozess zur Abscheidung von WSix-Schichten auf hoher Topografie mit definierter Stöchiometrie und dadurch hergestelltes Bauelement Process for the deposition of WSi x films on high topography with a defined stoichiometry and thus component produced
05/18/2006DE10131710B4 Verfahren zur gezielten Einstellung der Stufenhöhe bei der STI-Technik zur Herstellung von integrierten Schaltungen Process for the controlled adjustment of the step height in the STI technique for the production of integrated circuits
05/18/2006DE10131668B4 Verfahren zur abrasiven Bearbeitung von Oberflächen, auf Halbleiter-Wafern A method for the abrasive machining of surfaces on semiconductor wafers
05/18/2006DE10066082B4 Gezielte lokale Erzeugung von Öffnungen in einer Schicht Targeted local generation of holes in a layer
05/18/2006DE10065380B4 Verfahren zur Charakterisierung und Simulation eines chemisch-mechanischen Polier-Prozesses A method for characterizing and simulation of a chemical mechanical polishing process
05/18/2006DE10050049B4 Verfahren zur Vorbereitung eines Kondensators mit tiefem Graben zur Strukturanalyse und zugehöriges Strukturanalyseverfahren A process for the preparation of a capacitor with a deep trench for the structural analysis and related structure analysis method
05/18/2006DE10042429B4 Oberflächenstabilisierung bei siliciumreichem Silicaglas unter Verwednung von verlängerter Post-Ablagerungsverzögerungszeit Surface stabilization in silicon-rich silica glass under Verwednung of prolonged post-deposition delay time
05/18/2006CA2708337A1 Amorphous oxide and field effect transistor
05/18/2006CA2708335A1 Amorphous oxide and field effect transistor
05/18/2006CA2587539A1 Compositions exhibiting inhibition of cyclooxygenase-2
05/18/2006CA2586864A1 New hexafluoroalcohol-based monomers and processes of preparation thereof
05/18/2006CA2585190A1 Amorphous oxide and field effect transistor
05/18/2006CA2585071A1 Field effect transistor employing an amorphous oxide
05/17/2006EP1657755A1 Electric power transforming apparatus
05/17/2006EP1657754A2 Compound semiconductor device and method of fabricating the same
05/17/2006EP1657752A1 Integrated circuit and method of manufacturing an integrated circuit on a semiconducting substrate
05/17/2006EP1657746A1 Semiconductor device and method for making the same
05/17/2006EP1657745A1 Integrated circuit and method of manufacturing an integrated circuit on a semiconductive substrate
05/17/2006EP1657744A2 Wafer guide, MOCVD equipment, and nitride semiconductor growth method
05/17/2006EP1657743A1 Transportation apparatus and drive mechanism
05/17/2006EP1657742A1 Flip chip system with organic/inorganic hybrid underfill composition
05/17/2006EP1657741A1 Thermal processing unit and thermal processing method
05/17/2006EP1657740A1 Silicon carbide epitaxial wafer, method for producing such wafer, and semiconductor device formed on such wafer
05/17/2006EP1657739A2 Semiconductor composite apparatus, method for manufacturing it, LED employing it and display employing the LED.
05/17/2006EP1657738A2 Capacitor and method for manufacturing the same
05/17/2006EP1657553A2 Method of manufacturing an external force detection sensor
05/17/2006EP1657264A1 Fluorocopolymer, process for producing the same, and resist composition containing the same
05/17/2006EP1657074A1 Method for making a thermal transfer donor element
05/17/2006EP1657043A1 Equipment and method for controlling encapsulating semiconductors with plastics
05/17/2006EP1657002A2 Method of cleaning fluorine-containing rubber molded article for semiconductor production apparatuses and cleaned molded article
05/17/2006EP1656716A1 Electrical connector
05/17/2006EP1656702A1 Vertical nanotransistor, method for producing the same and memory assembly
05/17/2006EP1656698A2 Semiconductor device having electrical contact from opposite sides and method therefor
05/17/2006EP1656697A1 Mems based multi-polar electrostatic chuck
05/17/2006EP1656696A2 Methods of forming a transistor with an integrated metal silicide gate electrode
05/17/2006EP1656695A1 Method for sealing thin film transistors
05/17/2006EP1656694A1 High aspect ratio etch using modulation of rf powers of various frequencies
05/17/2006EP1656693A1 Masking methods
05/17/2006EP1656671A1 Spin coating apparatus and coated substrate manufactured using the same
05/17/2006EP1656473A2 Metal nano-objects, formed on semiconductor surfaces, and methods for making said nano-objects
05/17/2006EP1656467A2 Copper-containing pvd targets and methods for their manufacture
05/17/2006EP1656323A1 Boron nitride agglomerated powder
05/17/2006EP1597328B1 Modular barrier removal polishing slurry
05/17/2006EP1595266B1 Quantum point made of electrically conducting carbon, production method, and application
05/17/2006EP1576072A4 Aqueous phosphoric acid compositions for cleaning semiconductor devices
05/17/2006EP1565268B1 Nozzle arrangement
05/17/2006EP1470528B1 Method for manufacturing rfid labels
05/17/2006EP1468335A4 A cleaning agent composition for a positive or a negative photoresist
05/17/2006EP1432955A4 A thermoplastic heat exchanger and method of making the same
05/17/2006EP1423855B1 Mram with midpoint generator reference
05/17/2006EP1412131A4 Method for fabricating polishing pad using laser beam and mask
05/17/2006EP1360719A4 Molds for wafer scale molding of protective caps
05/17/2006EP1356515A4 Molding assembly for wafer scale molding of protective caps
05/17/2006EP1356514A4 Use of infrared radiation in molding of protective caps
05/17/2006EP1356513A4 Molding of protective caps
05/17/2006EP1251920A4 Method and apparatus for metal removal by ion exchange
05/17/2006EP1193751B1 Electrode and method of manufacturing an electrode
05/17/2006EP0985007B1 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same
05/17/2006CN2781609Y Strip fitting device for cavity surface of seminconductor laser
05/17/2006CN2781573Y Integrated circuit component
05/17/2006CN2781572Y Integrated circuit assembly and three-dimentional integrated circuit assembly
05/17/2006CN2781565Y Structure of wafer probe card
05/17/2006CN2781392Y Avalanche photodiode temp bias voltage tester
05/17/2006CN2780733Y Induction heating sealing linkage device
05/17/2006CN2780407Y Fixed ring on carrier head in polishing device used for chemical machinery
05/17/2006CN1774842A Advanced microelectronic connector assembly and method of manufacturing
05/17/2006CN1774838A Anisotropic conductive connector and circuit-device electrical-inspection device
05/17/2006CN1774817A Adhesive of a silicon and silica composite particularly useful for joining silicon parts
05/17/2006CN1774816A Magnetoresistive random acess memory device structures and methods for fabricating the same
05/17/2006CN1774815A Field effect transistor
05/17/2006CN1774808A Memory cell, memory cell arrangement and method for the production of a memory cell
05/17/2006CN1774807A Cubic memory array
05/17/2006CN1774802A Circuit device with at least partial packaging and method for forming
05/17/2006CN1774799A Shallow trench isolation process
05/17/2006CN1774798A Formation of a relaxed useful layer from a wafer with no buffer layer
05/17/2006CN1774797A Semiconductor device and process for producing the same
05/17/2006CN1774796A A method and apparatus for process control in time division multiplexed TDM etch processes
05/17/2006CN1774795A Manufacturing method of semiconductor device
05/17/2006CN1774794A Susceptor and vapor growth device
05/17/2006CN1774793A Resist stripping method and device
05/17/2006CN1774792A Device and method for thermal treatment
05/17/2006CN1774791A Process and system for laser crystallization processing of film regions on a substrate to provide substantial uniformity, and a structure of such film regions
05/17/2006CN1774790A Integrated system for processing semiconductor wafers
05/17/2006CN1774673A Porous underlayer film and underlayer film forming composition used for forming the same
05/17/2006CN1774671A Photosensitive resin composition
05/17/2006CN1774666A Bonding structure of thin film circuit
05/17/2006CN1774639A System and method for in-situ monitor and control of film thickness and trench depth
05/17/2006CN1774607A Vertical-type heat treating apparatus and workpiece transfer method