Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2006
05/25/2006US20060108607 Integrated circuit component and mounting method thereof
05/25/2006US20060108602 Field effect transistor and method of manufacturing the same
05/25/2006US20060108595 LED fabrication via ion implant isolation
05/25/2006US20060108590 Group III-V nitride series semiconductor substrate and assessment method therefor
05/25/2006US20060108589 Semiconductor device
05/25/2006US20060108587 Thin film transistor array panel and manufacturing method thereof
05/25/2006US20060108582 Organic field-effect transistor and method of making same based on polymerizable self-assembled monolayers
05/25/2006US20060108576 Layer system comprising a silicon layer and a passivation layer, method for production a passivation layer on a silicon layer and the use of said system and method
05/25/2006US20060108573 Single crystalline gallium nitride thick film having reduced bending deformation
05/25/2006US20060108541 Alignment method, alignment substrate, production method for alignment substrate, exposure method, exposure system and mask producing method
05/25/2006US20060108526 Apparatus for measuring a three-dimensional shape
05/25/2006US20060108524 Dimension measuring SEM system, method of evaluating shape of circuit pattern and a system for carrying out the method
05/25/2006US20060108448 Edge remover having a gas sprayer to prevent a chemical solvent from splashing
05/25/2006US20060108416 Unauthorized access prevention method
05/25/2006US20060108331 Plasma processing apparatus and plasma processing method
05/25/2006US20060108330 Apparatus for dry-surface cleaning using a laser
05/25/2006US20060108326 Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
05/25/2006US20060108324 Process for removing a residue from a metal structure on a semiconductor substrate
05/25/2006US20060108323 Dry etching method
05/25/2006US20060108320 Molecular self-assembly in substrate processing
05/25/2006US20060108259 Carrier tape for containing good therein, and container using the carrier tape
05/25/2006US20060108231 Installation for processing a substrate
05/25/2006US20060108138 Semiconductor chip package having an adhesive tape attached on bonding wires
05/25/2006US20060108068 Substrate processing apparatus and substrate processing method
05/25/2006US20060108067 Controlled use of photochemically susceptible chemistries for etching, cleaning and surface conditioning
05/25/2006US20060107994 Photoelectric conversion element and process for fabricating the same, electronic device and process for fabricating the same
05/25/2006US20060107969 Ozonated water flow and concentration control apparatus and method
05/25/2006US20060107890 One hundred millimeter single crystal silicon carbide wafer
05/24/2006EP1659841A2 Printed circuit board
05/24/2006EP1659640A1 Plastic film supported single crystal silicon photovoltaic cell structure and method of fabrication
05/24/2006EP1659638A1 Power MOS device and corresponding manufacturing method
05/24/2006EP1659637A2 Method of manufacturing a power MOS device
05/24/2006EP1659634A2 Bipolar transistor and method of manufacturing this transistor
05/24/2006EP1659626A1 Lead-on-chip leadframe
05/24/2006EP1659625A2 Semiconductor device and method for manufacturing the same, circuit board, and electronic instrument
05/24/2006EP1659624A2 Method of manufacturing a semiconductor device
05/24/2006EP1659623A1 Method for fabricating a germanium on insulator (GeOI) type wafer
05/24/2006EP1659622A2 Field effect transistor and method of manufacturing the same
05/24/2006EP1659621A1 Substrate including a deformation preventing layer
05/24/2006EP1659620A1 Liquid recovery apparatus, exposure apparatus, exposure method, and device production method
05/24/2006EP1659591A2 Semiconductor memory
05/24/2006EP1659198A1 Single crystal of silicon carbide, and method and apparatus for producing the same
05/24/2006EP1659130A1 Rare earth metal complex, material for thin-film formation, and process for producing thin film
05/24/2006EP1658977A1 Liquid discharge head, liquid discharge device, and method for manufacturing liquid discharge head
05/24/2006EP1658639A2 Bipolar transistor having raised extrinsic base with selectable self-alignment and methods of forming same
05/24/2006EP1658636A1 Chip support of a lead frame for an integrated circuit package
05/24/2006EP1658635A1 A method of forming a TEOS cap layer at low temperature and reduced deposition rate
05/24/2006EP1658634A2 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
05/24/2006EP1658519A2 Solution to thermal budget
05/24/2006EP1658344A1 Microsystem component and method for gluing microcomponents to a substrate
05/24/2006EP1592822A4 Disk coating system
05/24/2006EP1501924A4 Apparatus including ion transport detecting structures and methods of use
05/24/2006EP1483595A4 High resolution scanning magnetic microscope operable at high temperature
05/24/2006EP1433195B1 Method and apparatus for machining substrates
05/24/2006EP1328601B1 Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
05/24/2006EP1247132B1 Microlithographic reduction projection catadioptric objective
05/24/2006EP1211292B1 Use of a crosslinked elastomer composition for sealing a semiconductor production apparatus
05/24/2006EP1129362A4 Method and apparatus for minimizing semiconductor wafer arcing during semiconductor wafer processing
05/24/2006EP1114467B1 Ferroelectric transistor, its use in a storage cell system and its method of production
05/24/2006EP1045433B1 Boron containing fluorocarbon film and method for forming the same
05/24/2006EP0913859B1 Semiconductor device and method for manufacturing the same
05/24/2006EP0838090B1 A method of making a monolithic microwave circuit with thick conductors
05/24/2006DE4241457B4 P-leitendes floatendes Gate aus Poly-Silizium zur Verwendung bei einem Halbleiterbautransistorelement und daraus hergestelltes Flash-E2PROM P-type floating gate made of poly-silicon for use in a Halbleiterbautransistorelement prepared therefrom and flash E2PROM
05/24/2006DE202006003030U1 Mask for selective plasma surface treatment of component, has meshed metal wire used as output unit, where metal wire is primed with photosensitive material and meshes are filled with plastic
05/24/2006DE19960458B4 Vorrichtung zum Polieren von Scheiben An apparatus for polishing wafers
05/24/2006DE19931694B4 Verfahren zum Herstellen von elektrischen Schaltkreisen oder Modulen sowie elektrischer Schaltkreis oder elektrisches Modul hergestellt nach diesem Verfahren A method of making electrical circuits or modules as well as electrical circuit or electrical module manufactured according to this method
05/24/2006DE19912950B4 Halbleiterbauelement, mit drei aufeinander folgenden Schichten von wechselndem Dotiertyp integrierter Schaltkreis mit einem solchen Halbleiterbauelement und Verfahren zur Herstellung eines solchen Halbleiterbauelements A semiconductor device with three successive layers of alternating doping type integrated circuit with such a semiconductor device and method of manufacturing such a semiconductor device
05/24/2006DE19906224B4 Abzugsvorrichtung Off device
05/24/2006DE19527611B4 Verfahren zum Herstellen eines Substrats für elektrische Schaltkreise A method for producing a substrate for electrical circuits
05/24/2006DE112004001259T5 Vorrichtung zum Ausführen einer Messverteilung auf der Grundlage einer Fehlererkennung Apparatus for performing a measurement on the basis of distribution of an error detection
05/24/2006DE10355187B4 Verfahren und Vorrichtung zur Timinganalyse einer Schaltung Method and device for timing analysis of a circuit
05/24/2006DE10215044B4 Verfahren zum Ätzen und Trocknen von Substraten A method for etching and drying substrates
05/24/2006DE102005052027A1 Abschirmvorrichtung für rückseitige Metallablagerung Screening for rear metal deposition
05/24/2006DE102005042732A1 Semiconductor device manufacturing method, involves depositing metal oxide material over structure, annealing deposited metal oxide material, and etching formation through another structure using etch stop layer as an etch stop
05/24/2006DE102005008516B3 Sense amplifier, has two field effect transistors possessing bulk or substrate connections that are formed in respective wells of substrate, where wells are electrically isolated from each other
05/24/2006DE102004058876B3 Adhesive layer applying method for semiconductor wafer, involves taking off coated semiconductor chips with adhesive layer from non-hardened adhesive of foil under forcing bond bridge of semiconductor wafer material along separation slots
05/24/2006DE102004055656A1 Substrate tempering device e.g. hotplate, cleaning device, has cleaning unit for cleaning substrate-tempering device and turbine vane for producing rotational relative motion between cleaning unit and substrate tempering device
05/24/2006DE102004055649A1 Making insulation trench in semiconductor structure, first forms etching step between filling oxide and oxide layer coating
05/24/2006DE102004055636A1 Production of semiconductor elements for Bragg reflector involves growing epitaxial aluminum indium nitride layers, and changing aluminum-to-indium ratio during growth process
05/24/2006DE102004055213A1 Integrierte Schaltung und Verfahren zur Herstellung einer integrierten Schaltung auf einem Halbleiterplättchen Integrated circuit and method of fabricating an integrated circuit on a semiconductor chip
05/24/2006DE102004054806A1 Bipolar transistor has intrinsic base region with an electronically conductive silicide layer in close contact with base layer
05/24/2006DE102004054566A1 Verfahren und Vorrichtung zum Einebnen einer Halbleiterscheibe sowie Halbleiterscheibe mit verbesserter Ebenheit Method and apparatus for planarizing a semiconductor wafer and semiconductor wafer with improved flatness
05/24/2006DE10136382B4 Phenylverknüpfte Polybenzoxazolcyanate, Verfahren zu ihrer Herstellung und ihre Verwendung als Dielektrikum mit guten Klebe- und Fülleigenschaften und zum Verkleben Phenylverknüpfte Polybenzoxazolcyanate, processes for their preparation and their use as dielectric materials with good adhesion and filling properties, and for bonding
05/24/2006CN2783534Y Laser cleaning device for micro nano grain
05/24/2006CN2782284Y Ultrosonic welding wire appts.
05/24/2006CN1777997A MOSFET device having geometry that permits frequent body contact
05/24/2006CN1777996A High switch speed power device and its manufacturing method
05/24/2006CN1777995A Bipolar transistor and method for the production thereof
05/24/2006CN1777992A 半导体器件 Semiconductor devices
05/24/2006CN1777990A Thermal interconnect systems methods of production and uses thereof
05/24/2006CN1777988A Taped lead frames and methods of making and using the same in semiconductor packaging
05/24/2006CN1777987A High-performance electrostatic clamp comprising a resistive layer, micro-grooves, and dielectric layer
05/24/2006CN1777986A Device for applying semiconductor treatment to treatment subject substrate
05/24/2006CN1777985A Semiconductor manufacturing system
05/24/2006CN1777984A Real-time in-line testing of semiconductor wafers
05/24/2006CN1777983A Mirror assembly with multi-color illumination
05/24/2006CN1777982A Silicon carbide power devices with self-aligned source and well regions and methods of fabricating same
05/24/2006CN1777981A Semiconductor device comprising extensions produced from material with a low melting point
05/24/2006CN1777980A Method for removing silicon oxide film and processing apparatus
05/24/2006CN1777979A CMP polishing method and method for manufacturing semiconductor device