| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/18/2006 | US20060105580 Method and apparatus for thermally processing microelectronic workpieces |
| 05/18/2006 | US20060105579 Etchant for etching metal wiring layers and method for forming thin film transistor by using the same |
| 05/18/2006 | US20060105578 High-selectivity etching process |
| 05/18/2006 | US20060105577 Aspect ratio controlled etch selectivity using time modulated DC bias voltage |
| 05/18/2006 | US20060105576 High ion energy and reative species partial pressure plasma ash process |
| 05/18/2006 | US20060105575 Small volume process chamber with hot inner surfaces |
| 05/18/2006 | US20060105574 Process for defining integrated circuits in semiconductor electronic devices |
| 05/18/2006 | US20060105573 Method for selective plasma etch of an oxide layer |
| 05/18/2006 | US20060105572 Via reactive ion etching process |
| 05/18/2006 | US20060105571 Pneumatic method and apparatus for nano imprint lithography |
| 05/18/2006 | US20060105570 Copper interconnect wiring and method of forming thereof |
| 05/18/2006 | US20060105569 Method for manufacturing semiconductor device |
| 05/18/2006 | US20060105568 Plasma treatment for surface of semiconductor device |
| 05/18/2006 | US20060105567 Method for forming a dual-damascene structure |
| 05/18/2006 | US20060105566 Ultraviolet assisted pore sealing of porous low k dielectric films |
| 05/18/2006 | US20060105565 Method and apparatus for copper film quality enhancement with two-step deposition |
| 05/18/2006 | US20060105564 Method and system for reducing inter-layer capacitance in integrated circuits |
| 05/18/2006 | US20060105563 Method of forming a semiconductor device |
| 05/18/2006 | US20060105562 Method to make nano structure below 25 nanometer with high uniformity on large scale |
| 05/18/2006 | US20060105561 Method of manufacturing a self-aligned contact structure |
| 05/18/2006 | US20060105560 Method for forming solder bumps of increased height |
| 05/18/2006 | US20060105559 Ultrathin buried insulators in Si or Si-containing material |
| 05/18/2006 | US20060105558 Inter-metal dielectric scheme for semiconductors |
| 05/18/2006 | US20060105557 Method of making fully silicided gate electrode |
| 05/18/2006 | US20060105556 Semiconductor device and method of manufacturing the same |
| 05/18/2006 | US20060105555 Display apparatus and control method thereof |
| 05/18/2006 | US20060105554 Method for solid phase diffusion of zinc into an InP-based photodiode and an InP photodiode made with the method |
| 05/18/2006 | US20060105553 Reversible oxidation protection of microcomponents |
| 05/18/2006 | US20060105552 Apparatus and method of activating impurity atom in manufacture of semiconductor device |
| 05/18/2006 | US20060105551 Method of manufacturing a polysilicon layer and a mask used therein |
| 05/18/2006 | US20060105550 Method of depositing material on a substrate for a device |
| 05/18/2006 | US20060105549 Manipulation of micrometer-sized electronic objects with liquid droplets |
| 05/18/2006 | US20060105548 Substrate processing apparatus, program for performing operation and control method thereof, and computer readable storage medium storing the program |
| 05/18/2006 | US20060105547 Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking |
| 05/18/2006 | US20060105546 Wafer dividing method |
| 05/18/2006 | US20060105545 Methods for dicing a released CMOS-MEMS multi-project wafer |
| 05/18/2006 | US20060105544 Protective film agent for laser dicing and wafer processing method using the protective film agent |
| 05/18/2006 | US20060105543 CMOS-MEMS process |
| 05/18/2006 | US20060105542 Method for fabricating and separating semiconductor devices |
| 05/18/2006 | US20060105541 Trench isolation method for semiconductor devices |
| 05/18/2006 | US20060105540 Method for manufacturing semiconductor element |
| 05/18/2006 | US20060105539 Method of detecting etching end-point |
| 05/18/2006 | US20060105538 Method for forming semiconductor device capable of preventing bunker defect |
| 05/18/2006 | US20060105537 Method for forming storage electrode of semiconductor device |
| 05/18/2006 | US20060105536 Trench capacitor with hybrid surface orientation substrate |
| 05/18/2006 | US20060105535 Integrated circuit and method for manufacturing an integrated circuit on a semiconductor chip |
| 05/18/2006 | US20060105534 High Q factor integrated circuit inductor |
| 05/18/2006 | US20060105533 Method for engineering hybrid orientation/material semiconductor substrate |
| 05/18/2006 | US20060105532 Integrated circuit and method for manufacturing an integrated circuit on a chip |
| 05/18/2006 | US20060105531 Method of forming notched gate structure |
| 05/18/2006 | US20060105530 Method for fabricating semiconductor device |
| 05/18/2006 | US20060105529 Methods of forming MOS transistors having buried gate electrodes therein |
| 05/18/2006 | US20060105528 High voltage mosfet having Si/SiGe heterojunction structure and method of manufacturing the same |
| 05/18/2006 | US20060105527 Semiconductor device and manufacturing method therefor |
| 05/18/2006 | US20060105526 Method of fabricating a bottle trench and a bottle trench capacitor |
| 05/18/2006 | US20060105525 Method for forming non-volatile memory device |
| 05/18/2006 | US20060105524 Non-volatile device manufactured using ion-implantation and method of manufacture the same |
| 05/18/2006 | US20060105523 Chemical doping of nano-components |
| 05/18/2006 | US20060105522 Method of forming a nanocluster charge storage device |
| 05/18/2006 | US20060105521 Method of manufacturing semiconductor device |
| 05/18/2006 | US20060105520 Structure and method to fabricate a protective sidewall liner for an optical mask |
| 05/18/2006 | US20060105519 DRAM on SOI |
| 05/18/2006 | US20060105518 Ultra-shallow arsenic junction formation in silicon germanium |
| 05/18/2006 | US20060105517 Method in the fabrication of an integrated injection logic circuit |
| 05/18/2006 | US20060105516 Oxidation method for altering a film structure |
| 05/18/2006 | US20060105515 Process options of forming silicided metal gates for advanced CMOS devices |
| 05/18/2006 | US20060105514 Thin film semiconductor device and method of manufacturing the same |
| 05/18/2006 | US20060105513 Device comprising doped nano-component and method of forming the device |
| 05/18/2006 | US20060105512 Method to improve drive current by increasing the effective area of an electrode |
| 05/18/2006 | US20060105511 Method of manufacturing a mos transistor |
| 05/18/2006 | US20060105510 Transistor or semiconductor device and method of fabricating the same |
| 05/18/2006 | US20060105509 Method of forming a semiconductor device |
| 05/18/2006 | US20060105508 Method of forming a semiconductor device |
| 05/18/2006 | US20060105507 Method to form Si-containing SOI and underlying substrate with different orientations |
| 05/18/2006 | US20060105506 Method of manufacturing a thin film transistor |
| 05/18/2006 | US20060105505 Method for producing a semiconductor component and semiconductor component produced by the same |
| 05/18/2006 | US20060105504 Fabrication method of semiconductor integrated circuit device |
| 05/18/2006 | US20060105503 Wafer-level sealed microdevice having trench isolation and methods for making the same |
| 05/18/2006 | US20060105502 Assembly process |
| 05/18/2006 | US20060105501 Electronic device with high lead density |
| 05/18/2006 | US20060105500 Process for fabricating chip embedded package structure |
| 05/18/2006 | US20060105499 Chip packaging systems and methods |
| 05/18/2006 | US20060105497 Forming a stress compensation layer and structures formed thereby |
| 05/18/2006 | US20060105496 Device and method for fabricating double-sided SOI wafer scale package with through via connections |
| 05/18/2006 | US20060105495 Device and method for reshaping the interconnection elements of an electronic module using the stress reflow method and, in particular, for restoring the flatness thereof |
| 05/18/2006 | US20060105494 Method and apparatus for cleaning and sealing display packages |
| 05/18/2006 | US20060105493 Encapsulation of organic devices |
| 05/18/2006 | US20060105492 Organic electronic devices |
| 05/18/2006 | US20060105491 Method for treating a photovoltaic active layer and organic photovoltaic element |
| 05/18/2006 | US20060105490 Microlens manufacturing method |
| 05/18/2006 | US20060105489 Method and apparatus providing CMOS imager device pixel with transistor having lower threshold voltage than other imager device transistors |
| 05/18/2006 | US20060105488 Method of integrating optical devices and electronic devices on an integrated circuit |
| 05/18/2006 | US20060105487 Method and apparatus for fabricating flat panel display |
| 05/18/2006 | US20060105486 Method of fabricating a liquid crystal display device |
| 05/18/2006 | US20060105485 Overmolded lens over LED die |
| 05/18/2006 | US20060105484 Molded lens over LED die |
| 05/18/2006 | US20060105483 Encapsulated light emitting diodes and methods of making |
| 05/18/2006 | US20060105482 Array of light emitting devices to produce a white light source |
| 05/18/2006 | US20060105481 Method of making light emitting device with silicon-containing encapsulant |
| 05/18/2006 | US20060105480 Method of making light emitting device with silicon-containing encapsulant |