| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/25/2006 | US20060110889 Method for fabricating a MIM capacitor having increased capacitance density and related structure |
| 05/25/2006 | US20060110888 Phase changeable memory device and method of formation thereof |
| 05/25/2006 | US20060110887 Microelectronic device and a method for its manufacture |
| 05/25/2006 | US20060110886 MOSFET structure and method of fabricating the same |
| 05/25/2006 | US20060110885 Body having angle scaling |
| 05/25/2006 | US20060110884 Method of manufacturing a transistor and a method of forming a memory device |
| 05/25/2006 | US20060110883 Method for forming a memory device |
| 05/25/2006 | US20060110882 Methods of forming gate structure and flash memory having the same |
| 05/25/2006 | US20060110881 Method of manufacturing a select transistor in a NAND flash memory |
| 05/25/2006 | US20060110880 Self-aligned trench filling with high coupling ratio |
| 05/25/2006 | US20060110879 Non-volatile memory and fabricating method thereof |
| 05/25/2006 | US20060110878 Side wall active pin memory and manufacturing method |
| 05/25/2006 | US20060110877 Memory device including resistance change layer as storage node and method(s) for making the same |
| 05/25/2006 | US20060110876 MOS transistor with reduced kink effect and method for the manufacture thereof |
| 05/25/2006 | US20060110875 Trench lateral power mosfet and a method of manufacturing the same |
| 05/25/2006 | US20060110874 Method of forming source contact of flash memory device |
| 05/25/2006 | US20060110873 Method for fabricating CMOS image sensor |
| 05/25/2006 | US20060110872 Method for fabricating a semiconductor structure |
| 05/25/2006 | US20060110871 Methods for fabricating thin film transistors |
| 05/25/2006 | US20060110870 Scalable integrated logic and non-volatile memory |
| 05/25/2006 | US20060110869 Semiconductor device including a TFT having large-grain polycrystalline active layer, LCD employing the same and method of fabricating them |
| 05/25/2006 | US20060110868 Production of lightly doped drain of low-temperature poly-silicon thin film transistor |
| 05/25/2006 | US20060110867 Field effect transistor manufacturing method |
| 05/25/2006 | US20060110866 Method for fabricating thin film transistors |
| 05/25/2006 | US20060110865 Method of forming ultra thin silicon oxynitride for gate dielectric applications |
| 05/25/2006 | US20060110864 Method of fabricating a thin film transistor using dual or multiple gates |
| 05/25/2006 | US20060110863 Semiconductor device, and method for manufacturing the same |
| 05/25/2006 | US20060110862 Method of forming a thin film transistor |
| 05/25/2006 | US20060110861 Integrated circuit with multi-length power transistor segments |
| 05/25/2006 | US20060110860 Self-adjusting serial circuit of thin layers and method for production thereof |
| 05/25/2006 | US20060110859 Electronic device and manufacturing method of the same |
| 05/25/2006 | US20060110858 Ultra-thin semiconductor package device and method for manufacturing the same |
| 05/25/2006 | US20060110857 Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same |
| 05/25/2006 | US20060110856 Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys |
| 05/25/2006 | US20060110855 Leadframe with enhanced encapsulation adhesion |
| 05/25/2006 | US20060110854 Methods and systems for providing MEMS devices with a top cap and upper sense plate |
| 05/25/2006 | US20060110853 Structure of embedded active components and manufacturing method thereof |
| 05/25/2006 | US20060110852 Methods to achieve precision alignment for wafer scale packages |
| 05/25/2006 | US20060110851 Methods for forming co-planar wafer-scale chip packages |
| 05/25/2006 | US20060110850 Method for two-stage transfer molding device to encapsulate MMC module |
| 05/25/2006 | US20060110849 Method for stacking BGA packages and structure from the same |
| 05/25/2006 | US20060110848 Off-width pitch for improved circuit card routing |
| 05/25/2006 | US20060110847 Field effect transistor and its manufacturing method |
| 05/25/2006 | US20060110846 Electrically programmable memory element with improved contacts |
| 05/25/2006 | US20060110845 Method of manufacturing micro-structure element by utilizing molding glass |
| 05/25/2006 | US20060110844 Fabrication of thin film germanium infrared sensor by bonding to silicon wafer |
| 05/25/2006 | US20060110843 Method of manufacturing an external force detection sensor |
| 05/25/2006 | US20060110842 Method and apparatus for preventing metal/silicon spiking in MEMS devices |
| 05/25/2006 | US20060110841 Avalanche photodiode |
| 05/25/2006 | US20060110840 Functional device and method for producing the same |
| 05/25/2006 | US20060110839 Micro-leds |
| 05/25/2006 | US20060110838 Multilayered circuit substrate, semiconductor device and method of producing same |
| 05/25/2006 | US20060110837 Method and system for topography-aware reticle enhancement |
| 05/25/2006 | US20060110836 Eliminating systematic process yield loss via precision wafer placement alignment |
| 05/25/2006 | US20060110693 Exposure method and apparatus, exposure mask, and device manufacturing method |
| 05/25/2006 | US20060110684 Photomask for forming small contact hole array and methods of fabricating and using the same |
| 05/25/2006 | US20060110676 Resist material for liquid immersion lithography process and method for forming resist pattern using the resist material |
| 05/25/2006 | US20060110667 Method of fabrication of semiconductor integrated circuit device and mask fabrication method |
| 05/25/2006 | US20060110664 Large pellicle |
| 05/25/2006 | US20060110636 Methods of operating fuel cells |
| 05/25/2006 | US20060110618 Electrodes for photovoltaic cells and methods for manufacture thereof |
| 05/25/2006 | US20060110610 Provided in memory capacitor cell formed between gate electrode and counter electrode formed on silicon wafer; dielectrics with increased mechanical strength and electrical properties; electronic parts which prevent wiring delay |
| 05/25/2006 | US20060110536 Balancing pressure to improve a fluid seal |
| 05/25/2006 | US20060110535 Metal film production apparatus |
| 05/25/2006 | US20060110531 Method for depositing a coating having a relatively high dielectric constant onto a substrate |
| 05/25/2006 | US20060110143 Substrate processing device |
| 05/25/2006 | US20060110095 Optical chip for optical transmission and method of making the same |
| 05/25/2006 | US20060109729 Semiconductor storage device and mobile electronic device |
| 05/25/2006 | US20060109703 Ferroelectric-type nonvolatile semiconductor memory |
| 05/25/2006 | US20060109455 Optical inspection system and radiation source for use therein |
| 05/25/2006 | US20060109449 Reticle-carrying container |
| 05/25/2006 | US20060109443 Optical integrator, illumination optical device, exposure apparatus, and exposure method |
| 05/25/2006 | US20060109435 Lithographic apparatus and device manufacturing method |
| 05/25/2006 | US20060108717 Method for producing a ceramic substrate |
| 05/25/2006 | US20060108698 Microelectronic assemblies and methods of making microelectronic assemblies |
| 05/25/2006 | US20060108696 Structure for reducing stress-induced voiding in an interconnect of integrated circuits |
| 05/25/2006 | US20060108692 Bit line structure and method for the production thereof |
| 05/25/2006 | US20060108689 Method of manufacturing semiconductor device |
| 05/25/2006 | US20060108687 Using zeolites to improve the mechanical strength of low-k interlayer dielectrics |
| 05/25/2006 | US20060108686 Semiconductor device for fingerprint recognition |
| 05/25/2006 | US20060108677 Multi-chip package and method of fabricating the same |
| 05/25/2006 | US20060108676 Multi-chip package using an interposer |
| 05/25/2006 | US20060108675 Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale |
| 05/25/2006 | US20060108667 Method for manufacturing a small pin on integrated circuits or other devices |
| 05/25/2006 | US20060108661 Semiconductor device having STI without divot and its manufacture |
| 05/25/2006 | US20060108658 Functional device and method for producing the same, and image pickup device and method for producing the same |
| 05/25/2006 | US20060108652 Microelectromechanical systems, and methods for encapsulating and fabricating same |
| 05/25/2006 | US20060108650 Method of enlarging contact area of a gate electrode, semiconductor device having a surface-enlarged gate electrode, and method of manufacturing the same |
| 05/25/2006 | US20060108646 NROM semiconductor memory device and fabrication method |
| 05/25/2006 | US20060108643 CMOS on hybrid substrate with different crystal orientations using silicon-to-silicon direct wafer bonding |
| 05/25/2006 | US20060108634 Semiconductor apparatus and method for manufacturing the same |
| 05/25/2006 | US20060108633 Electrically erasable programmable read only memory (EEPROM) cells and methods of fabricating the same |
| 05/25/2006 | US20060108631 Fabrication of conductive lines interconnecting conductive gates in nonvolatile memories, and non-volatile memory structures |
| 05/25/2006 | US20060108630 Semiconductor memory and method for manufacturing the same |
| 05/25/2006 | US20060108625 Methods of programming non-volatile memory devices including transition metal oxide layer as data storage material layer and devices so operated |
| 05/25/2006 | US20060108623 Oxidative top electrode deposition process, and microelectronic device structure |
| 05/25/2006 | US20060108622 Ferroelectric integrated circuit devices having an oxygen penetration path and methods for manufacturing the same |
| 05/25/2006 | US20060108621 Capacitor insulating film, method for fabricating the same, capacitor element, method for fabricating the same, semiconductor memory device, and method for fabricating the same |
| 05/25/2006 | US20060108619 Ferromagnetic IV group based semiconductor, ferromagnetic III-V group based compound semiconductor, or ferromagnetic II-IV group based compound semiconductor, and method for adjusting their ferromagnetic characteristics |
| 05/25/2006 | US20060108610 Method of manufacturing a thin dielectric layer using a heat treatment and a semiconductor device formed using the method |