| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 05/23/2006 | US7048866 Metal/ceramic bonding article and method for producing same |
| 05/23/2006 | US7048857 Using oxidizer |
| 05/23/2006 | US7048841 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
| 05/23/2006 | US7048837 generating a plasma, sputtering metal material from a target, etching a portiton of the metal from the substrate, monitoring the emitted radiation through a folded radiation path in chamber, and terminating etching in response to monitored radiation |
| 05/23/2006 | US7048824 Device for treating silicon wafers |
| 05/23/2006 | US7048802 CVD reactor with graphite-foam insulated, tubular susceptor |
| 05/23/2006 | US7048801 Chemical pump and method of discharging chemical solution |
| 05/23/2006 | US7048800 Semiconductor substrate processing apparatus |
| 05/23/2006 | US7048798 Silicon carbide single crystal and method and apparatus for producing the same |
| 05/23/2006 | US7048797 Liquid-phase growth process and liquid-phase growth apparatus |
| 05/23/2006 | US7048796 Silicon single crystal wafer fabricating method and silicon single crystal wafer |
| 05/23/2006 | US7048612 Method of chemical mechanical polishing |
| 05/23/2006 | US7048609 Pressure control system and polishing apparatus |
| 05/23/2006 | US7048602 Correcting potential defects in an OLED device |
| 05/23/2006 | US7048548 Interconnect for microelectronic structures with enhanced spring characteristics |
| 05/23/2006 | US7048493 Method of manufacturing a semiconductor integrated circuit device which prevents foreign particles from being drawn into a semiconductor container containing semiconductor wafers |
| 05/23/2006 | US7048488 Apparatus for transferring wafer and ring |
| 05/23/2006 | US7048196 Data communication device |
| 05/23/2006 | US7048127 Lid unit for thin-plate holding container, thin-plate holding container, and simplified attaching/detaching mechanism |
| 05/23/2006 | US7047989 Sonic-energy cleaner system with gasified fluid |
| 05/23/2006 | US7047984 Device and method for cleaning articles used in the production of semiconductor components |
| 05/23/2006 | US7047903 Method and device for plasma CVD |
| 05/23/2006 | US7047637 Method of manufacture of ceramic composite wiring structures for semiconductor devices |
| 05/23/2006 | US7047633 Method of using pre-applied underfill encapsulant |
| 05/23/2006 | US7047632 Method of mounting electronic components |
| 05/23/2006 | US7047620 Method for assembling a scrubber |
| 05/23/2006 | CA2466267C Electrodes, method and apparatus for memory structure |
| 05/23/2006 | CA2218260C 300mm microenvironment pod with door on side |
| 05/18/2006 | WO2006053338A2 System and method for improved dopant profiles in cmos transistors |
| 05/18/2006 | WO2006053331A1 Method for manufacturing a silicon-on-insulator (soi) wafer with an etch stop layer |
| 05/18/2006 | WO2006053258A2 Method to enhance cmos transistor performance by inducing strain in the gate and channel |
| 05/18/2006 | WO2006053257A1 Bipolar transistor with selfaligned silicide and extrinsic base |
| 05/18/2006 | WO2006053249A2 Compositions exhibiting inhibition of cyclooxygenase-2 |
| 05/18/2006 | WO2006053242A2 Copper electrodeposition in microelectronics |
| 05/18/2006 | WO2006053241A2 Ultra-shallow arsenic junction formation in silicon germanium |
| 05/18/2006 | WO2006053213A1 Methods and articles incorporating local stress for performance improvement of strained semiconductor devices |
| 05/18/2006 | WO2006053180A2 Methods for fabricating one or more metal damascene structures in a semiconductor wafer |
| 05/18/2006 | WO2006053096A2 High selectivity slurry compositions for chemical mechanical polishing |
| 05/18/2006 | WO2006052958A2 Copper interconnect wiring and method of forming thereof |
| 05/18/2006 | WO2006052434A1 Cmp composition containing surface-modified abrasive particles |
| 05/18/2006 | WO2006052433A2 Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
| 05/18/2006 | WO2006052379A1 Strained fully depleted silicon on insulator semiconductor device and manufacturing method therefor |
| 05/18/2006 | WO2006051995A1 Field effect transistor employing an amorphous oxide |
| 05/18/2006 | WO2006051993A2 Amorphous oxide and field effect transistor |
| 05/18/2006 | WO2006051909A1 Exposure method, device manufacturing method, and substrate |
| 05/18/2006 | WO2006051896A1 Substrate carrying device, substrate carrying method, and exposure device |
| 05/18/2006 | WO2006051887A1 Ic chip, antenna, and manufacturing method of the ic chip and the antenna |
| 05/18/2006 | WO2006051880A1 Sheet-form probe and probe card and wafer inspection method |
| 05/18/2006 | WO2006051878A1 Sheet-shaped probe, probe card and wafer inspecting method |
| 05/18/2006 | WO2006051866A1 Laser beam machining method and semiconductor chip |
| 05/18/2006 | WO2006051861A1 Laser processing method |
| 05/18/2006 | WO2006051845A1 Probe member for wafer inspection, probe card for wafer inspection and wafer inspection apparatus |
| 05/18/2006 | WO2006051844A1 Resin-sealed mold and resin-sealed device |
| 05/18/2006 | WO2006051816A1 Semiconductor device and method for manufacturing same |
| 05/18/2006 | WO2006051774A1 Method for detecting extraneous matter on thermal treatment plate, thermal treatment device, program, and computer readable recording medium containing the program |
| 05/18/2006 | WO2006051769A1 Method for forming resist pattern |
| 05/18/2006 | WO2006051730A1 Method for producing semiconductor wafer |
| 05/18/2006 | WO2006051727A1 Method for forming hole in crystal substrate, and crystal substrate having hole formed by said method |
| 05/18/2006 | WO2006051689A1 Projection optical system, exposure equipment and exposure method |
| 05/18/2006 | WO2006051684A1 Sheet cutting method and sheet mounting method |
| 05/18/2006 | WO2006051641A1 Method for forming porous semiconductor film, light-emitting device and optical sensor |
| 05/18/2006 | WO2006051534A1 Transistor structure and method of manufacturing thereof |
| 05/18/2006 | WO2006051527A2 Integrated circuit die with logically equivalent bonding pads |
| 05/18/2006 | WO2006051487A1 Flash- and rom- memory |
| 05/18/2006 | WO2006051090A1 Method of making fully silicided gate electrode |
| 05/18/2006 | WO2006051029A1 Method for arranging a flip chip on a substrate |
| 05/18/2006 | WO2006050847A1 Device for the vapour deposition of a coating material |
| 05/18/2006 | WO2006050609A1 New hexafluoroalcohol-based monomers and processes of preparation thereof |
| 05/18/2006 | WO2006050607A1 Etching technique for creation of thermally-isolated microstructures |
| 05/18/2006 | WO2006035377A3 Integrated sicr metal thin film resistors for sige rf-bicmos technology |
| 05/18/2006 | WO2006033673A3 Apparatus and method for transverse characterization of materials |
| 05/18/2006 | WO2006020355A3 Method for etching mesa isolation in antimony based compound semiconductor structures |
| 05/18/2006 | WO2006018762A3 Dual gate cmos fabrication |
| 05/18/2006 | WO2006017847A3 Silicon-insulator thin-film structures for optical modulators and methods of manufacture |
| 05/18/2006 | WO2006008701A3 Assembly and method of placing the assembly on an external board |
| 05/18/2006 | WO2005124829A3 In-line heater for use in semiconductor wet chemical processing and method of manufacturing the same |
| 05/18/2006 | WO2005122270A9 Gated field effect devices and methods of forming a gated field effect device |
| 05/18/2006 | WO2005117121B1 Memory arrays; methods of forming memory arrays; and methods of forming contacts to bitlines |
| 05/18/2006 | WO2005098087A3 Method for selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits |
| 05/18/2006 | WO2005083519A3 Methods of patterning a surface using single and multilayer molecular films |
| 05/18/2006 | WO2005072095A3 Method of treating microelectronic substrates |
| 05/18/2006 | WO2005050715A3 Nitridation of high-k dielectric films |
| 05/18/2006 | WO2005029580A3 Connector |
| 05/18/2006 | WO2005025375A3 Wrist assembly for robotic arm |
| 05/18/2006 | WO2005020291A3 Method for fabricating a nitrided silicon-oxide gate dielectric |
| 05/18/2006 | WO2005017961A3 Plasma etching using dibromomethane addition |
| 05/18/2006 | WO2005012451A3 Slurries and methods for chemical-mechanical planarization of copper |
| 05/18/2006 | WO2004102643A3 Contact opening metrology |
| 05/18/2006 | US20060107248 Generating mask patterns for alternating phase-shift mask lithography |
| 05/18/2006 | US20060107144 Power reduction in module-based scan testing |
| 05/18/2006 | US20060106566 Position detecting method and apparatus |
| 05/18/2006 | US20060106497 Carriage robot system and its controlling method |
| 05/18/2006 | US20060105679 Substrate polishing apparatus |
| 05/18/2006 | US20060105678 Polishing apparatus and polishing method |
| 05/18/2006 | US20060105594 Method for package burn-in testing |
| 05/18/2006 | US20060105585 Autofocus for high power laser diode based annealing system |
| 05/18/2006 | US20060105584 Device and method for thermally treating semiconductor wafers |
| 05/18/2006 | US20060105583 Formation technology of nano-particle films having low dielectric constant |
| 05/18/2006 | US20060105582 Semiconductor device and method for fabricating same |
| 05/18/2006 | US20060105581 Glycol doping agents in carbon doped oxide films |