Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2006
06/27/2006US7066707 Wafer engine
06/27/2006US7066703 Chuck transport method and system
06/27/2006US7066390 Method for manufacturing semiconductor device
06/27/2006US7066377 Ball mounting method
06/27/2006US7066373 Method for aligning the bondhead of a Die Bonder
06/27/2006US7066372 Recognition device, bonding device, and method of manufacturing a circuit device
06/27/2006US7066318 Transporting apparatus
06/27/2006US7066314 replaceable component carriers for retaining components in a modular belt during termination and other processes and during transport to and from processing stations
06/27/2006US7066107 Shielding system for plasma chamber
06/27/2006US7066031 Pressure sensors having spacer mounted transducers
06/27/2006US7065900 Docking-type system and method for transferring and treating substrate
06/27/2006US7065898 Module for transferring a substrate
06/27/2006US7065894 Apparatus for kinematic registration of a reticle
06/27/2006US7065870 Segmented contactor
06/27/2006US7065869 Method for plating of printed circuit board strip
06/27/2006US7065867 Low temperature hermetic sealing method having passivation layer
06/27/2006US7065857 Method of manufacturing electronic device
06/22/2006WO2006066261A2 Ferroelectric capacitor stack etch cleaning
06/22/2006WO2006066211A2 Active and passive semiconductor device package
06/22/2006WO2006066202A2 Active edge grip rest pad
06/22/2006WO2006066194A2 Strained nmos transistor featuring deep carbon doped regions and raised donor doped source and drain
06/22/2006WO2006066164A2 Improved uniformity in batch spray processing using independent cassette rotation
06/22/2006WO2006066100A2 Method and apparatus for laser dicing
06/22/2006WO2006065986A2 Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
06/22/2006WO2006065776A2 Process sequence for doped silicon fill of deep trenches
06/22/2006WO2006065759A2 Dual stressed soi substrates
06/22/2006WO2006065531A2 Cmos nvm bitcell and integrated circuit
06/22/2006WO2006065506A1 In-line fabrication of curved surface transistors
06/22/2006WO2006065444A2 Fabrication of strained heterojunction structures
06/22/2006WO2006065355A1 Process for fabricating a semiconductor device having an rtcvd layer
06/22/2006WO2006065347A2 Polishing solutions
06/22/2006WO2006065346A1 Methods of using sonication to couple a heat sink to a heat-generating component
06/22/2006WO2006065321A1 Method for forming anti-reflective coating
06/22/2006WO2006065274A2 Colloidal silica based chemical mechanical polishing slurry
06/22/2006WO2006065160A1 METHOD OF MANUFACTURING DOPED Inx AlyGa1-x-yN EPITAXIAL LAYERS, DOPED InxAlyGa1-x-yN EPITAXIAL LAYER AND SEMICONDUCTOR MULTI-LAYER STRUCTURE COMPRISING AT LEAST ONE DOPED InxALyGa1-x-yN EPITAXIAL LAYER, WHERE
06/22/2006WO2006065073A1 Apparatus for testing reliability of semiconductor sample
06/22/2006WO2006065054A1 Method for synthesizing semiconductor quantom dots
06/22/2006WO2006065014A1 Apparatus and method for thin film deposition
06/22/2006WO2006064925A1 Board material storing method and apparatus
06/22/2006WO2006064900A1 Exposure method and apparatus, and device manufacturing method
06/22/2006WO2006064898A1 Plasma processing apparatus
06/22/2006WO2006064887A1 Display control substrate, manufacturing method thereof, liquid crystal display panel, electronic information device
06/22/2006WO2006064884A1 Actinic energy ray curable resion composition and use thereof
06/22/2006WO2006064863A1 Printed wiring board
06/22/2006WO2006064859A1 Semiconductor device and manufacturing method thereof
06/22/2006WO2006064851A1 Substrate holding apparatus, exposure apparatus and device manufacturing method
06/22/2006WO2006064831A1 Resin composition for flip-chip packaging and resin composition for forming bump
06/22/2006WO2006064776A1 Method for fabricating organic thin film transistor
06/22/2006WO2006064772A1 Plasma doping method
06/22/2006WO2006064728A1 Projection optical system, exposure apparatus, exposure system, and exposure method
06/22/2006WO2006064714A1 Substrate processing method and film stretching apparatus
06/22/2006WO2006064711A1 Plating device, plating method, semiconductor device, and semiconductor device manufacturing method
06/22/2006WO2006064697A1 Heat treatment plate temperature setting method, heat treatment plate temperature setting apparatus, program, and computer readable recording medium wherein program is recorded
06/22/2006WO2006064679A1 Phase shift mask, phase shift mask manufacturing method, and semiconductor element manufacturing method
06/22/2006WO2006064640A1 Method of selectively disposing ferritin
06/22/2006WO2006064626A1 Polymer compound, positive resist composition and method for forming resist pattern
06/22/2006WO2006064622A1 Positive-working resist composition and method for resist pattern formation
06/22/2006WO2006064606A1 Semiconductor device and manufacturing method thereof
06/22/2006WO2006064595A1 Thermo-compression bonding tool and thermo-compression bonding device
06/22/2006WO2006064592A1 Target for extreme ultraviolet light and x-ray source and process for producing the same
06/22/2006WO2006064570A1 Semiconductor device manufacturing method
06/22/2006WO2006064546A1 Contact pin, probe card using same and electronic device testing apparatus
06/22/2006WO2006064416A1 A semiconductor device having a recess with non-porous walls in a porous dielectric and a method of manufacturing such a semiconductor device
06/22/2006WO2006064394A1 Borderless (etching stop) layer stack for non-volatile memory applications
06/22/2006WO2006064290A1 Bipolar transistor and method of making such a transistor
06/22/2006WO2006064282A2 A method of ion implantation to reduce transient enhanced diffusion
06/22/2006WO2006064124A1 Capacitive junction modulator, capacitive junction and method for making same
06/22/2006WO2006064111A1 Electronic device provided with two assembled components and method for producing said device
06/22/2006WO2006064081A1 Semiconductor substrate, semiconductor device and method of manufacturing a semiconductor substrate
06/22/2006WO2006063958A2 Method for producing an electrode
06/22/2006WO2006063936A1 Apparatus and method for drying disk-shaped substrates
06/22/2006WO2006063893A1 Method for the production of semiconducting or photovoltaically active films
06/22/2006WO2006063652A1 System for multiple removal of microchips from a wafer consisting of a plurality of microchips
06/22/2006WO2006063614A1 Power field effect transistor device and method of manufacture thereof
06/22/2006WO2006063563A1 Flash tube mirror arrangement
06/22/2006WO2006041535A3 Capillary lithography of nanofiber arrays
06/22/2006WO2006036865A3 Deposition of ruthenium metal layers in a thermal chemical vapor deposition process
06/22/2006WO2006034854A3 Semiconductor memory device having charge-trapping memory cells
06/22/2006WO2006031654A3 Hemt device and method of making
06/22/2006WO2006028577A3 Using different gate dielectrics with nmos and pmos transistors of a complementary metal oxide semiconductor integrated circuit
06/22/2006WO2006019871A3 Method of discharging a semiconductor device
06/22/2006WO2006017600A3 Feol/meol metal resistor for high end cmos
06/22/2006WO2006012112A3 Electrochemical plating cell with an auxiliary electrode in an isolated anolyte compartment
06/22/2006WO2006008703A3 Nanoscale fet
06/22/2006WO2005122195A3 Fabrication of interconnect structures
06/22/2006WO2005058133A3 Implantable pressure sensors
06/22/2006WO2005045892A9 Confined spacers for double gate transistor semiconductor fabrication process
06/22/2006WO2005019986A3 Enhanced parimutuel wagering
06/22/2006US20060136862 Pattern data verification method, pattern data creation method, exposure mask manufacturing method, semiconductor device manufacturing method, and computer program product
06/22/2006US20060135705 melting at least a portion of pellets or powder, the portion comprising a mixture of a functionalized polymer and a reactive monomer andflowing the molten portion into contact with the portion of the electronic or optical device
06/22/2006US20060135663 Fluorinated copolymer process for its production and resist composition containing it
06/22/2006US20060135001 Method for low temperature growth of inorganic materials from solution using catalyzed growth and re-growth
06/22/2006US20060134931 Method for forming quantum dots
06/22/2006US20060134930 Method for forming a metal contact in a semiconductor device having a barrier metal layer formed by homogeneous deposition
06/22/2006US20060134929 Heating treatment device, heating treatment method and fabrication method of semiconductor device
06/22/2006US20060134928 Semiconductor manufacturing apparatus, liquid container, and semiconductor device manufacturing method
06/22/2006US20060134927 Method for forming ultra thin oxide layer by ozonated water
06/22/2006US20060134926 Method for increasing polysilicon grain size
06/22/2006US20060134925 Method of forming a gate insulating layer of a semiconductor device using deuterium gas
06/22/2006US20060134924 Method of filling gaps and methods of depositing materials using high density plasma chemical vapor deposition