| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/29/2006 | WO2006067344A1 Component for detecting especially infrared electromagnetic radiation |
| 06/29/2006 | WO2006067107A1 Transistor device and method of manufacture thereof |
| 06/29/2006 | WO2006067099A1 Transistor device and method of manufacture thereof |
| 06/29/2006 | WO2006067018A1 Circuit arrangement arranged on a substrate and method for producing said circuit arrangement |
| 06/29/2006 | WO2006066964A2 An electronic device, a chip containing method and a contacting device |
| 06/29/2006 | WO2006066755A1 Method for producing deep trench structures |
| 06/29/2006 | WO2006066659A1 Semiconductor substrate comprising a multi-layer structure and method for producing said substrate |
| 06/29/2006 | WO2006066658A2 Semiconductor substrate comprising a pn-junction and method for producing said substrate |
| 06/29/2006 | WO2006057686A3 Cap layers and/or passivation layers for nitride-based transistors, transistor structures and methods of fabricating same |
| 06/29/2006 | WO2006053242A3 Copper electrodeposition in microelectronics |
| 06/29/2006 | WO2006049848A3 Method of forming isolation trench with spacer formation |
| 06/29/2006 | WO2006044219A3 Wafer level microelectronic packaging with double isolation |
| 06/29/2006 | WO2006041196A8 Polishing apparatus and polishing method |
| 06/29/2006 | WO2006031366A3 Full sequence metal and barrier layer electrochemical mechanical processing |
| 06/29/2006 | WO2006028597A3 Laser separation of encapsulated submount |
| 06/29/2006 | WO2006026765A3 Plasma ashing process for increasing photoresist removal rate and plasma apparatus wuth cooling means |
| 06/29/2006 | WO2006023026A3 Method of forming a semiconductor device and structure thereof |
| 06/29/2006 | WO2006019674A3 A method of manufacturing a plurality of electronic assemblies |
| 06/29/2006 | WO2006007081A3 Method of making a semiconductor device having a strained semiconductor layer |
| 06/29/2006 | WO2005103740A3 Intelligent probe card architecture |
| 06/29/2006 | WO2005101459B1 Method for machining a workpiece on a workpiece support |
| 06/29/2006 | WO2005098917B1 Methods of processing a substrate with minimal scalloping |
| 06/29/2006 | WO2005094299A3 Improved cmos transistors and methods of forming same |
| 06/29/2006 | WO2005086567A3 Silicide formed from ternary metal alloy films |
| 06/29/2006 | WO2005076814A3 Injector for plasma mass filter |
| 06/29/2006 | WO2005065127B1 A method for forming thick dielectric regions using etched trenches |
| 06/29/2006 | WO2005045895A3 Cleaning solutions and etchants and methods for using same |
| 06/29/2006 | WO2005027195A3 Apparatus for carrying reticles and method of using the same to process reticles |
| 06/29/2006 | US20060143586 Synthesis strategies based on the appropriate use of inductance effects |
| 06/29/2006 | US20060143172 Mask processing device, mask processing method, program and mask |
| 06/29/2006 | US20060142971 All surface data for use in substrate inspection |
| 06/29/2006 | US20060142890 Substrate processing apparatus, method of controlling substrate, and exposure apparatus |
| 06/29/2006 | US20060142888 Process monitoring device for sample processing apparatus and control method of sample processing apparatus |
| 06/29/2006 | US20060142424 High molecular weight solid thermoplastic polymer or thermosetting resin and a catalyst; expandable filler(s); solvent; for use in encapsulating electronic components to substrates with a solder; encapsulant expands at a temperature at or above the reflow temperature of the solder |
| 06/29/2006 | US20060142173 Solvent compositions containing chlorofluoroolefins or fluoroolefins |
| 06/29/2006 | US20060141979 Radio frequency circuit with integrated on-chip radio frequency signal coupler |
| 06/29/2006 | US20060141809 Single side workpiece processing |
| 06/29/2006 | US20060141808 Method for the heat treatment of substrates |
| 06/29/2006 | US20060141807 Seal hardening furnace of liquid crystal display device having rack bar |
| 06/29/2006 | US20060141806 Apparatus and process for treating dielectric materials |
| 06/29/2006 | US20060141805 Method of depositing dielectric films |
| 06/29/2006 | US20060141804 Method and apparatus to facilitate electrostatic discharge resiliency |
| 06/29/2006 | US20060141803 Method of cleaning silicon nitride layer |
| 06/29/2006 | US20060141802 Silicon electrode assembly surface decontamination by acidic solution |
| 06/29/2006 | US20060141801 Semiconductor device manufacturing method, wafer, and wafer manufacturing method |
| 06/29/2006 | US20060141800 Method for forming step channel of semiconductor device |
| 06/29/2006 | US20060141799 Method of manufacturing a semiconductor device |
| 06/29/2006 | US20060141798 Device and method of performing a seasoning process for a semiconductor device manufacturing apparatus |
| 06/29/2006 | US20060141797 Method for fabricating semiconductor device |
| 06/29/2006 | US20060141796 Method of manufacturing semiconductor device |
| 06/29/2006 | US20060141795 Method for fabrication semiconductor device |
| 06/29/2006 | US20060141794 Plasma system and method for anisotropically etching structures into a substrate |
| 06/29/2006 | US20060141793 Forming of trenches or wells having different destinations in a semiconductor substrate |
| 06/29/2006 | US20060141792 Process for manufacturing semiconductor integrated circuit device |
| 06/29/2006 | US20060141791 Method for fabricating a semiconductor device |
| 06/29/2006 | US20060141790 Chemical mechanical polishing method |
| 06/29/2006 | US20060141789 Method for etching and for forming a contact hole using thereof |
| 06/29/2006 | US20060141788 Method for fabricating semiconductor device capable of preventing scratch |
| 06/29/2006 | US20060141787 Cleaning methods for silicon electrode assembly surface contamination removal |
| 06/29/2006 | US20060141786 Method of manufacturing an electronic device and electronic device |
| 06/29/2006 | US20060141785 Inter-metal dielectric of semiconductor device and manufacturing method thereof |
| 06/29/2006 | US20060141784 Utilizing suppressor comprising one or more ethylene oxide-propylene oxide copolymers bonded to nitrogen containing species; smoothness; preventing voids and defects |
| 06/29/2006 | US20060141783 Sputtering apparatus and method for forming metal silicide layer using the same |
| 06/29/2006 | US20060141782 Film forming method, film forming system and recording medium |
| 06/29/2006 | US20060141781 Method for forming metal line of semiconductor device |
| 06/29/2006 | US20060141780 Methods for the plasma formation of a microelectronic barrier layer |
| 06/29/2006 | US20060141779 Method for forming an aluminum contact |
| 06/29/2006 | US20060141778 Manufacturing method of semiconductor device |
| 06/29/2006 | US20060141777 Methods for patterning a layer of a semiconductor device |
| 06/29/2006 | US20060141776 Method of manufacturing a semiconductor device |
| 06/29/2006 | US20060141775 Method of forming electrical connections in a semiconductor structure |
| 06/29/2006 | US20060141774 Pattern transfer mask related to formation of dual damascene structure and method of forming dual damascene structure |
| 06/29/2006 | US20060141773 Method of forming metal line in semiconductor device |
| 06/29/2006 | US20060141772 Methods of forming interconnection lines in semiconductor devices |
| 06/29/2006 | US20060141771 Semiconductor device with a metal line and method of forming the same |
| 06/29/2006 | US20060141769 Method for forming metal line of semiconductor device |
| 06/29/2006 | US20060141768 Method to eliminate plating copper defect |
| 06/29/2006 | US20060141767 Metal wiring for semiconductor device and method for forming the same |
| 06/29/2006 | US20060141766 Method of manufacturing semiconductor device |
| 06/29/2006 | US20060141765 Metal wiring pattern for memory devices |
| 06/29/2006 | US20060141764 Method of manufacturing wiring board |
| 06/29/2006 | US20060141763 System for and method of planarizing the contact region of a via by use of a continuous inline vacuum deposition |
| 06/29/2006 | US20060141762 Interlocking via for package via integrity |
| 06/29/2006 | US20060141761 System for and method of forming via holes by multiple deposition events in a continuous inline shadow mask deposition process |
| 06/29/2006 | US20060141760 Method for producing an electrical component |
| 06/29/2006 | US20060141759 Method of forming pad and fuse in semiconductor device |
| 06/29/2006 | US20060141758 Method of forming contact pads |
| 06/29/2006 | US20060141757 Method for manufacturing semiconductor device |
| 06/29/2006 | US20060141756 Method for producing a semiconductor structure |
| 06/29/2006 | US20060141755 Method of configuring a process to obtain a thin layer with a low density of holes |
| 06/29/2006 | US20060141754 Laser treatment apparatus, laser treatment method, and manufacturing method of semiconductor device |
| 06/29/2006 | US20060141753 Epitaxial structure of gallium nitride series semiconductor device and process of manufacturing the same |
| 06/29/2006 | US20060141752 Methods for forming a P-type polysilicon layer in a semiconductor device |
| 06/29/2006 | US20060141751 Method for making a silicon dioxide layer on a silicon substrate by anodic oxidation |
| 06/29/2006 | US20060141750 Semiconductor integrated device and method for manufacturing same |
| 06/29/2006 | US20060141749 Adhesive of folder package |
| 06/29/2006 | US20060141748 Thermal treament of a semiconductor layer |
| 06/29/2006 | US20060141747 Controlled cleaving process |
| 06/29/2006 | US20060141746 Methods for forming semiconductor structures |
| 06/29/2006 | US20060141745 Method and system for wafer bonding of structured substrates for electro-mechanical devices |