Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2006
06/29/2006US20060141744 System and method of forming a bonded substrate and a bonded substrate product
06/29/2006US20060141743 Method and system for 3D alignment in wafer scale integration
06/29/2006US20060141742 Method of producing a complex structure by assembling stressed structures
06/29/2006US20060141741 Adjuvant for chemical mechanical polishing slurry
06/29/2006US20060141740 Semiconductor device with shallow trench isolation and a manufacturing method thereof
06/29/2006US20060141739 Method for fabricating contact holes in a semiconductor body and a semiconductor structure
06/29/2006US20060141738 Method for measuring bonding quality of bonded substrates, metrology apparatus, and method of producing a device from a bonded substrate
06/29/2006US20060141737 Planar magnetic tunnel junction substrate having recessed alignment marks
06/29/2006US20060141736 Method for fabricating capacitor of semiconductor memory device using amorphous carbon
06/29/2006US20060141735 Method for forming a MIM capacitor in a semiconductor device
06/29/2006US20060141734 Method for fabricating semiconductor device
06/29/2006US20060141733 Capacitors having a horizontally folded dielectric layer and methods for manufacturing the same
06/29/2006US20060141732 Method for forming isolation region in semiconductor device
06/29/2006US20060141731 Method for forming shallow trench isolation in semiconductor device
06/29/2006US20060141730 Process for manufacturing integrated resistive elements with silicidation protection
06/29/2006US20060141729 System and method for suppressing oxide formation
06/29/2006US20060141728 Formation of junctions and silicides with reduced thermal budget
06/29/2006US20060141727 Method of fabricating low-power CMOS device
06/29/2006US20060141726 Field effect transistor with a high breakdown voltage and method of manufacturing the same
06/29/2006US20060141725 Method of manufacturing flash memory device
06/29/2006US20060141724 Method of manufacturing MOS transistor
06/29/2006US20060141723 Method for manufacturing semiconductor device
06/29/2006US20060141722 Method of sequentially forming silicide layer and contact barrier in semiconductor integrated circuit device
06/29/2006US20060141721 Semiconductor transistor device and method for manufacturing the same
06/29/2006US20060141720 Method of fabricating MOS transistor
06/29/2006US20060141719 Method of fabricating semiconductor device
06/29/2006US20060141718 Method of manufacturing flash memory device
06/29/2006US20060141717 Method of forming isolation film in semiconductor device
06/29/2006US20060141716 Method for manufacturing a cell transistor of a semiconductor memory device
06/29/2006US20060141715 Integrated circuit devices having contact holes exposing gate electrodes in active regions and methods of fabricating the same
06/29/2006US20060141714 Method for manufacturing a semiconductor device
06/29/2006US20060141713 Manufacturing method with self-aligned arrangement of solid body electrolyte memory cells of minimum structure size
06/29/2006US20060141712 Method for manufacturing PMOSFET
06/29/2006US20060141711 Method of manufacturing flash memory device
06/29/2006US20060141710 NOR-type flash memory device of twin bit cell structure and method of fabricating the same
06/29/2006US20060141709 Method for programming multi-level nitride read-only memory cells
06/29/2006US20060141708 Non-volatile memory device with buried control gate and method of fabricating the same
06/29/2006US20060141707 Semiconductor memory device and method for fabricating the same
06/29/2006US20060141706 Methods of forming non-volatile semiconductor memory devices using prominences and trenches, and devices so formed
06/29/2006US20060141705 Method for fabricating metal-insulator-metal capacitor of semiconductor device
06/29/2006US20060141704 Manufacturing method of semiconductor device
06/29/2006US20060141703 Method of manufacturing nonvolatile organic memory device and nonvolatile organic memory device manufactured by the same
06/29/2006US20060141702 Method for depositing titanium oxide layer and method for fabricating capacitor by using the same
06/29/2006US20060141701 Semiconductor device having trench capacitors and method for making the trench capacitors
06/29/2006US20060141700 Method for fabricating semiconductor memory device having recessed storage node contact plug
06/29/2006US20060141699 Method for fabricating semiconductor memory device
06/29/2006US20060141698 Method of improved high K dielectric - polysilicon interface for CMOS devices
06/29/2006US20060141697 Method and apparatus on (110) surfaces of silicon structures with conduction in the <110> direction
06/29/2006US20060141696 Method for forming landing plug contact in semiconductor device
06/29/2006US20060141695 Methods of forming thin layers including zirconium hafnium oxide and methods of forming gate structures, capacitors, and flash memory devices using the same
06/29/2006US20060141694 Semiconductor device and method for fabricating the same
06/29/2006US20060141693 Semiconductor multilayer interconnection forming method
06/29/2006US20060141692 Method of fabricating CMOS image sensor
06/29/2006US20060141691 Method for fabricating semiconductor device
06/29/2006US20060141690 Method for manufacturing a semiconductor device
06/29/2006US20060141689 Semiconductor device and method of manufacturing the semiconductor device
06/29/2006US20060141688 Method for producing insulated gate thin film semiconductor device
06/29/2006US20060141687 Methods of forming semiconductor constructions
06/29/2006US20060141686 Copper gate electrode of liquid crystal display device and method of fabricating the same
06/29/2006US20060141685 Liquid crystal display device and fabrication method thereof
06/29/2006US20060141684 Polysilicon film, thin film transistor using the same, and method for forming the same
06/29/2006US20060141683 Production method for thin-film semiconductor
06/29/2006US20060141682 Method of fabricating semiconductor devices employing at least one modulation doped quantum well structure and one or more etch stop layers for accurate contact formation
06/29/2006US20060141681 Processing a memory link with a set of at least two laser pulses
06/29/2006US20060141680 Processing a memory link with a set of at least two laser pulses
06/29/2006US20060141679 Vertically stacked field programmable nonvolatile memory and method of fabrication
06/29/2006US20060141678 Forming a nanotube switch and structures formed thereby
06/29/2006US20060141677 Method of manufacturing a semiconductor device
06/29/2006US20060141676 Method for producing semiconductor substrate
06/29/2006US20060141675 Method of manufacturing heat spreader having vapor chamber defined therein
06/29/2006US20060141674 Windowed package having embedded frame
06/29/2006US20060141673 Integrated circuit device having reduced bow and method for making same
06/29/2006US20060141672 Method for cutting lead terminal of package type electronic component
06/29/2006US20060141671 Thermal interface structure with integrated liquid cooling and methods
06/29/2006US20060141670 Method of forming fine metal pattern and method of forming metal line using the same
06/29/2006US20060141669 Semiconductor package having semiconductor constructing body and method of manufacturing the same
06/29/2006US20060141668 Semiconductor multi-package module having inverted second package and including additional die or stacked package on second package
06/29/2006US20060141667 Bare die socket
06/29/2006US20060141666 Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured thereby
06/29/2006US20060141665 Substrate having a plurality of I/O routing arrangements for a microelectronic device
06/29/2006US20060141663 Method for forming metal interconnection of semiconductor device
06/29/2006US20060141662 Photovoltaic component and production method therefor
06/29/2006US20060141661 CMOS image sensor and method of fabricating the same
06/29/2006US20060141660 CMOS image sensor and method for fabricating the same
06/29/2006US20060141659 Single-crystal-silicon 3D micromirror
06/29/2006US20060141658 Corrugated diaphragm
06/29/2006US20060141657 Field emission device and manufacturing method thereof
06/29/2006US20060141656 Micromechanical sensors and methods of manufacturing same
06/29/2006US20060141655 Photoelectric conversion device, its manufacturing method, and image pickup device
06/29/2006US20060141654 Method for fabricating a CMOS image sensor
06/29/2006US20060141653 Methods of manufacturing an image device
06/29/2006US20060141652 MEMS device package and method for manufacturing the same
06/29/2006US20060141651 Method of fabricating semiconductor devices employing at least one modulation doped quantum well structure and one or more etch stop layers for accurate contact formation
06/29/2006US20060141650 MEMS device package and method for manufacturing the same
06/29/2006US20060141649 Method of reducing insertion loss in a transition region between a plurality of input or output waveguides to a free space coupler region
06/29/2006US20060141648 Light emitting device methods
06/29/2006US20060141647 Method for fabricating CMOS image sensor
06/29/2006US20060141646 Organic electroluminescent device and method of manufacturing the same
06/29/2006US20060141645 Light Emitting Device and Manufacturing Method Thereof
06/29/2006US20060141644 Light emitting diode and fabricating method thereof