| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/29/2006 | DE102005054431A1 Verfahren zum Herstellen eines Flaschengrabens und eines Flaschengrabenkondensators A method of manufacturing a bottle and a bottle trench capacitor grave |
| 06/29/2006 | DE102005045967A1 New top anti-reflective coating polymer compounds useful to fabricate a semiconductor device |
| 06/29/2006 | DE102004063959A1 Verfahren zur Herstellung einer vergrabenen metallischen Schicht in einem Halbleiterkörper und Halbleiterbauelement mit einer vergrabenen metallischen Schicht A process for producing a buried metallic layer in a semiconductor body and the semiconductor component with a buried metallic layer |
| 06/29/2006 | DE102004063578B4 Verfahren zur Ausbildung von Dual Gate Elektroden bei Anwendung des Damaszener Gate Prozesses Method for forming dual gate electrodes by applying the Damascus Gate process |
| 06/29/2006 | DE102004061604A1 Semiconductor-solar cell producing method, involves directly contacting films having openings with solar cell areas, applying voltage between cell surface and one film, locally removing cell material in openings after limiting gas discharge |
| 06/29/2006 | DE102004061518A1 Fin field effect transistor manufacturing method, involves producing auxiliary layer, where auxiliary layer covers part of electrically conductive layer and does not cover part of conductive layer that is arranged over top surface |
| 06/29/2006 | DE102004061099A1 Power semiconductor module for use as contact for sensors comprises of substrate arranged with base plate and frame housing enclosing substrate, whereby second section of auxiliary connections are connected with high impedance connection |
| 06/29/2006 | DE102004061056A1 Micromechanical functional component manufacturing method for e.g. micro pump, involves connecting substrates by local application of thermal energy in intermediate layer formed from glass frit, where application is carried out by laser |
| 06/29/2006 | DE102004060821A1 Verfahren zur Herstellung von Deep-Trench-Strukturen A process for the production of deep trench structures |
| 06/29/2006 | DE102004060625A1 Beschichtete Halbleiterscheibe und Verfahren und Vorrichtung zur Herstellung der Halbleiterscheibe Coated wafer and method and apparatus for producing the semiconductor wafer |
| 06/29/2006 | DE102004060624A1 Halbleiterscheibe mit epitaktisch abgeschiedener Schicht und Verfahren zur Herstellung der Halbleiterscheibe Semiconductor wafer having epitaxially deposited layer and method for manufacturing the semiconductor wafer |
| 06/29/2006 | DE102004060569A1 Method for the production of double capacitor involves internal capacitor and external capacitor in single trench such that inner and outer capacitors are formed between their electrode contact and earth electrode |
| 06/29/2006 | DE102004060369A1 Semiconductor circuit manufacturing wafer, has connection contacts provided in test structure-area and forming two rows, which run in longitudinal direction and are displaced against each other transverse to longitudinal direction |
| 06/29/2006 | DE102004060365A1 Bauelement mit Halbleiterübergang und Verfahren zur Herstellung Component with a semiconductor junction and methods for preparing |
| 06/29/2006 | DE102004060364A1 Halbleitersubstrat mit Mehrschichtaufbau und Verfahren zur Herstellung Semiconductor substrate having a multilayer structure and methods for preparing |
| 06/29/2006 | DE102004060210A1 Separation diffusion zone producing method for double-sided blocking power semiconductor component, involves producing trench that extends from side of semiconductor body up to maximum depth of body, and placing doping material into body |
| 06/29/2006 | DE102004060188A1 Process hot chamber comprises a number of rod lamps and a number of spot lamps for heating an object arranged in the chamber |
| 06/29/2006 | DE102004059884A1 Microchip, e.g. heterojunction bipolar transistor, flip-chip mounting method, involves coating surfaces of microchips, with gold-tin-solder, where chips are soldered by heating of arrangement along with substrate |
| 06/29/2006 | DE102004041889B4 Halbleitervorrichtung mit gestapelten Halbleiterbauelementen und Verfahren zu deren Herstellung A semiconductor device with stacked semiconductor devices and processes for their preparation |
| 06/29/2006 | DE102004041417B4 Electrical arrangement for microelectronics has component insulated from substrate by dielectric layer on conductive substrate |
| 06/29/2006 | DE10194628B4 Gassammler für einen Epitaxiereaktor Gas collector for an epitaxial reactor |
| 06/29/2006 | DE10144955B4 Vorrichtung zum Beschicken von Mikrosystemen Device for feeding of microsystems |
| 06/29/2006 | DE10134484B4 Verfahren zur Verhinderung eines Biegens von Halbleiterschichten und anhand des Verfahrens hergestellte Halbleitervorrichtung A method for preventing bending of the semiconductor layer and produced by the method semiconductor device |
| 06/29/2006 | DE10131491B4 Verfahren zum Herstellen einer Halbleiterspeichereinrichtung A method of manufacturing a semiconductor memory device |
| 06/29/2006 | DE10131490B4 Verfahren zum Herstellen einer Halbleiterspeichereinrichtung A method of manufacturing a semiconductor memory device |
| 06/29/2006 | DE10115492B4 Verfahren zur Aufbereitung einer Reaktionskammer Process for the preparation of a reaction chamber |
| 06/29/2006 | DE10008814B4 Separating bottom for use in braking and/or clamping device, has flexible supporting elements projected from outer surface, where supporting elements with center line of base body enclose angle of preset values |
| 06/29/2006 | DE10006257B4 Dünnfilmtransistoren mit organisch-anorganischen Hybridmaterialien als halbleitende Kanäle Thin film transistors with organic-inorganic hybrid materials as semiconducting channels |
| 06/29/2006 | CA2587774A1 Component for detecting especially infrared electromagnetic radiation |
| 06/29/2006 | CA2562148A1 Systems and methods for nanowire growth and manufacturing |
| 06/28/2006 | EP1675446A1 Multi-layer ceramic substrate, method for manufacturng the same and electronic device using the same |
| 06/28/2006 | EP1675181A1 Methode of making a non-volatile MOS semiconductor memory device |
| 06/28/2006 | EP1675180A1 Methode of making a non-volatile MOS semiconductor memory device |
| 06/28/2006 | EP1675176A1 Method for measuring the bonding quality of bonded substrates, metrology apparatus, and method of producing a device from a bonded substrate |
| 06/28/2006 | EP1675169A1 Semiconductor substrate, semiconductor device and process for producing semiconductor substrate |
| 06/28/2006 | EP1675168A2 Process and device for the positioning of connection balls for integrated circuits |
| 06/28/2006 | EP1675167A1 Hot-melt underfill composition and method of application |
| 06/28/2006 | EP1675166A2 Internally gettered heteroepitaxial semiconductor wafers and methods of manufacturing such wafers |
| 06/28/2006 | EP1675165A2 Method and system for 3D alignment in wafer scale integration |
| 06/28/2006 | EP1675164A1 Multilayer film reflection mirror, production method for multilayer film reflection mirror, and exposure system |
| 06/28/2006 | EP1675163A2 Ferroelectric film and method of manufacturing the same |
| 06/28/2006 | EP1675162A2 Ferroelectric film, method of manufacturing ferroelectric film, ferroelectric capacitor, and ferroelectric memory |
| 06/28/2006 | EP1675161A1 Ferroelectric material, manufacturing method and ferroelectric memory |
| 06/28/2006 | EP1675160A1 Electrostatic chuck with built-in heater |
| 06/28/2006 | EP1674890A2 Multilayer material and method of preparing same |
| 06/28/2006 | EP1674873A2 Sensor |
| 06/28/2006 | EP1673815A1 Group-iii nitride semiconductor device |
| 06/28/2006 | EP1673813A2 Fully depleted silicon-on-insulator cmos logic |
| 06/28/2006 | EP1673810A2 Field effect transistor, particularly vertical field effect transistor, memory cell, and production method |
| 06/28/2006 | EP1673806A2 Amorphous carbon layer to improve photoresist adhesion |
| 06/28/2006 | EP1673805A1 An etch back process using nitrous oxide |
| 06/28/2006 | EP1673804A1 Wafer etching techniques |
| 06/28/2006 | EP1673803A1 Mems based contact conductivity electrostatic chuck |
| 06/28/2006 | EP1673802A1 REMOVAL OF POST ETCH RESIDUES AND COPPER CONTAMINATION FROM LOW-K DIELECTRICS USING SUPERCRITICAL CO sb 2 /sb WITH DIKETONE ADDITIVES |
| 06/28/2006 | EP1673801A2 Developer-soluble materials and methods of using the same in via-first dual damascene applications |
| 06/28/2006 | EP1673800A2 Production method and device for improving the bonding between plastic and metal |
| 06/28/2006 | EP1673799A2 Short-channel transistors |
| 06/28/2006 | EP1673782A2 Mram array with segmented word and bit lines |
| 06/28/2006 | EP1673781A1 Memory cell array with staggered local inter-connect structure |
| 06/28/2006 | EP1673671A2 Power system inhibit method and device and structure therefor |
| 06/28/2006 | EP1673611A2 Operator independent programmable sample preparation and analysis system |
| 06/28/2006 | EP1673416A2 Slurry for chemical mechanical polishing of metals comprising periodic acid |
| 06/28/2006 | EP1673201A1 Polishing apparatus |
| 06/28/2006 | EP1495161A4 Electropolishing and electroplating methods |
| 06/28/2006 | EP1414545B1 Apparatus for and method of trapping products in exhaust gas |
| 06/28/2006 | EP1412182A4 Laser spectral engineering for lithographic process |
| 06/28/2006 | EP1386376A4 Laser spectral engineering for lithographic process |
| 06/28/2006 | EP1345665B1 Apparatus and method for extracting biomass |
| 06/28/2006 | EP1301829A4 Radiation sensitive compositions containing image quality and profile enhancement additives |
| 06/28/2006 | EP1192410A4 Helium-neon laser light source generating two harmonically related, single-frequency wavelengths for use in displacement and dispersion measuring interferometry |
| 06/28/2006 | EP1159756B1 Compounds for the treatment of cancer |
| 06/28/2006 | EP1102970B1 A sensor for measuring a substrate temperature |
| 06/28/2006 | EP0991960B1 Optical system with anti-reflection coating |
| 06/28/2006 | EP0889515B1 Method and apparatus for conveying thin sheet-like substrate |
| 06/28/2006 | CN2791884Y Single transistor plane random access stroage |
| 06/28/2006 | CN2791881Y Chip package structure |
| 06/28/2006 | CN2791880Y Chip loading chamber |
| 06/28/2006 | CN2791879Y Package biscuit detecting machine |
| 06/28/2006 | CN2791878Y Surface figuring machine for high power semiconductor element |
| 06/28/2006 | CN1795563A Method for annealing silicon thin films and polycrystalline silicon thin films prepared therefrom |
| 06/28/2006 | CN1795562A Body-tied soi transistor and method for fabrication thereof |
| 06/28/2006 | CN1795553A Method of manufacturing a substrate, having a porous dielectric layer and air gaps, and a substrate |
| 06/28/2006 | CN1795552A Method for manufacturing a multi-level interconnect structure |
| 06/28/2006 | CN1795551A Electrostatic chuck including a heater mechanism |
| 06/28/2006 | CN1795550A Method of using pre-applied underfill encapsulant |
| 06/28/2006 | CN1795549A 高阻抗射频功率塑料封装 High impedance RF power plastic packages |
| 06/28/2006 | CN1795548A Gate electrode for mos transistors |
| 06/28/2006 | CN1795547A P-channel power mis field effect transistor and switching circuit |
| 06/28/2006 | CN1795546A Method of forming fluorinated carbon film |
| 06/28/2006 | CN1795545A Production method for semiconductor wafer |
| 06/28/2006 | CN1795544A Method of processing silicon wafer |
| 06/28/2006 | CN1795543A Abrasive and method of polishing |
| 06/28/2006 | CN1795542A Method for producing single crystal ingot from which semiconductor wafer is sliced |
| 06/28/2006 | CN1795541A Electron beam microprocessing method |
| 06/28/2006 | CN1795540A Transistor with independant gate structures |
| 06/28/2006 | CN1795539A Method and apparatus for plasma nitridation of gate dielectrics using amplitude modulated radio-frequency energy |
| 06/28/2006 | CN1795538A Substrate for stressed systems and method for growing crystal on the substrate |
| 06/28/2006 | CN1795537A Evaporation source for deposition process and insulation fixing plate, and heating wire winding plate and method for fixing heating wire |
| 06/28/2006 | CN1795536A Position information measuring method and device, and exposure method and system |
| 06/28/2006 | CN1795535A Exposure method, exposure apparatus, and method for producing device |