Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2006
07/04/2006US7071042 Method of fabricating silicon integrated circuit on glass
07/04/2006US7071041 Method of manufacturing a semiconductor device
07/04/2006US7071040 Method of fabricating thin film transistor
07/04/2006US7071039 Manufacturing method of partial SOI wafer, semiconductor device using the partial SOI wafer and manufacturing method thereof
07/04/2006US7071038 Method of forming a semiconductor device having a dielectric layer with high dielectric constant
07/04/2006US7071037 Semiconductor device and manufacturing method thereof
07/04/2006US7071036 CMOS-TFT Array substrate and method for fabricating the same
07/04/2006US7071035 Apparatus and method for laser radiation
07/04/2006US7071034 Method of making semiconductor device
07/04/2006US7071033 Method for forming semiconductor device including stacked dies
07/04/2006US7071032 Material to improve image sensor yield during wafer sawing
07/04/2006US7071031 Three-dimensional integrated CMOS-MEMS device and process for making the same
07/04/2006US7071030 Method of making a flexible substrate with a filler material
07/04/2006US7071029 Methods for fabricating final substrates
07/04/2006US7071028 Semiconductor device and its manufacturing method
07/04/2006US7071027 Ball grid array package having improved reliability and method of manufacturing the same
07/04/2006US7071026 Production method for making film carrier tape for mounting electronic devices thereon
07/04/2006US7071025 Separating wafers coated with plastic films
07/04/2006US7071024 Method for packaging a microelectronic device using on-die bond pad expansion
07/04/2006US7071023 Nanotube device structure and methods of fabrication
07/04/2006US7071022 Silicon crystallization using self-assembled monolayers
07/04/2006US7071021 PCRAM memory cell and method of making same
07/04/2006US7071020 Method of forming an elevated photodiode in an image sensor
07/04/2006US7071019 System and method to improve image sensor sensitivity
07/04/2006US7071018 Process for manufacturing a solar cell
07/04/2006US7071017 Micro structure with interlock configuration
07/04/2006US7071016 Micro-electro mechanical systems (MEMS) device using silicon on insulator (SOI) wafer, and method of fabricating and grounding the same
07/04/2006US7071015 Semiconductor light emitting device and method for producing the same
07/04/2006US7071014 Methods for preserving strained semiconductor substrate layers during CMOS processing
07/04/2006US7071013 Fixture and method for uniform electroless metal deposition on integrated circuit bond pads
07/04/2006US7071012 Methods relating to the reconstruction of semiconductor wafers for wafer-level processing
07/04/2006US7071011 Method of defect review
07/04/2006US7071010 Methods of making a three terminal magnetic sensor having a collector region electrically isolated from a carrier substrate body
07/04/2006US7071009 MRAM arrays with reduced bit line resistance and method to make the same
07/04/2006US7071008 Multi-resistive state material that uses dopants
07/04/2006US7071007 Method of forming a low voltage drive ferroelectric capacitor
07/04/2006US7070914 Process for producing an image using a first minimum bottom antireflective coating composition
07/04/2006US7070907 Substrate having character/symbol section and processing method of character/symbol section
07/04/2006US7070891 Photomask, method for manufacturing the same, and method for measuring optical characteristics of wafer exposure system using the photomask during operation
07/04/2006US7070888 Method of selecting photomask blank substrates
07/04/2006US7070851 Web process interconnect in electronic assemblies
07/04/2006US7070831 chip size semiconductor package, which is an ultra-thin size; metal-plated film on a lower surface of the conductive wire patterns under the first openings and attached to the wire pattern by a direct pressure of an ultra-sound heat compression
07/04/2006US7070702 selectively etching substrate, for example lithium niobate, by applying etchant such as hydrofluoric acid and nitric acid at surface of substrate and illuminating an area of the surface with light from a light source, whereby etching is partially inhibited in illuminated area of substrate
07/04/2006US7070701 Manufacturing method of fine structure, optical element, integrated circuit, and electronic instrument
07/04/2006US7070687 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing
07/04/2006US7070670 Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device
07/04/2006US7070661 Uniform gas cushion wafer support
07/04/2006US7070660 Wafer holder with stiffening rib
07/04/2006US7070659 System for filling openings in semiconductor products
07/04/2006US7070657 Method and apparatus for depositing antireflective coating
07/04/2006US7070490 Vacuum suction membrane for holding silicon wafer
07/04/2006US7070486 Polishing apparatus and method of polishing work piece
07/04/2006US7070485 Polishing composition
07/04/2006US7070479 Arrangement and method for conditioning a polishing pad
07/04/2006US7070477 Method of polishing semiconductor wafer
07/04/2006US7070379 Semiconductor fabrication apparatus having FOUP index in apparatus installation area
07/04/2006US7070289 Catoptric projection optical system
07/04/2006US7070258 Printhead and ink supply arrangement
07/04/2006US7070254 Nozzle clogging detection device, droplet ejecting device, electronic optical device, method for producing same, and electronic device
07/04/2006US7070178 Holder for a substrate cassette and device provided with such a holder
07/04/2006US7070087 Method and apparatus for transferring solder bumps
07/04/2006US7069984 Multi-channel temperature control system for semiconductor processing facilities
07/04/2006US7069937 Vertical proximity processor
07/04/2006US7069742 SOLIDIFICATION, SLUSHING, LIQUEFACTION, purification, recovering; partial solidification and recycle of carbon dioxide; no use of pumps or compressors
07/04/2006US7069647 Method for populating a substrate with electronic components
07/04/2006US7069631 Method for manufacturing a liquid ejecting head
07/04/2006CA2211542C Electrical feedthroughs for ceramic circuit board support substrates
06/2006
06/29/2006WO2006069369A2 A method for constructing contact formations
06/29/2006WO2006069341A2 Cluster tool architecture for processing a substrate
06/29/2006WO2006069255A2 Methods and systems for controlling variation in dimensions of patterned features across a wafer
06/29/2006WO2006069184A1 Eeprom array with self-aligned shallow-trench isolation
06/29/2006WO2006069137A1 Thermally controlled fluidic self-assembly
06/29/2006WO2006069085A2 An in-situ chamber clean process to remove by-product deposits from chemical vapor etch chamber
06/29/2006WO2006069014A1 Multi-thickness dielectric for semiconductor memory
06/29/2006WO2006068958A2 Non-contact discrete removal of substrate surface contaminants/coatings, and method, apparatus, and system for implementing the same
06/29/2006WO2006068805A1 Method and apparatus for controlling spatial temperature distribution
06/29/2006WO2006068672A2 Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate
06/29/2006WO2006068654A2 Systems and methods for nanowire growth and manufacturing
06/29/2006WO2006068461A1 Support structure and lithographic apparatus
06/29/2006WO2006068388A1 A probe card manufacturing method including sensing probe and the probe card, probe card inspection system
06/29/2006WO2006068328A1 Polishing composition and polishing method
06/29/2006WO2006068288A1 Method for measuring position of mask surface in height direction, exposure apparatus and exposure method
06/29/2006WO2006068286A1 Semiconductor device
06/29/2006WO2006068284A1 Manufacturing method for semiconductor chips
06/29/2006WO2006068283A1 Flattening method and flattening apparatus
06/29/2006WO2006068267A1 Compound for resist and radiation-sensitive composition
06/29/2006WO2006068260A1 Magnetic fluid sealing unit for semiconductor wafer vertical heat treating apparatus
06/29/2006WO2006068241A1 Substrate surface treating apparatus
06/29/2006WO2006068235A1 Method for cleaning of semiconductor processing apparatus and method for ethching silicon substrate
06/29/2006WO2006068233A1 Magnetic guiding apparatus, stage apparatus, exposure apparatus and device manufacturing method
06/29/2006WO2006068181A1 Film, silica film and method of forming the same, composition for forming silica film, and electronic part
06/29/2006WO2006068127A1 Method for producing epitaxial silicon wafer
06/29/2006WO2006068091A1 Fine treatment agent and fine treatment method using same
06/29/2006WO2006068048A1 Material for pattern formation, apparatus for pattern formation, and method for pattern formation
06/29/2006WO2006068027A1 Semiconductor device and its manufacturing method
06/29/2006WO2006068000A1 Stacked body for cof substrate, method for manufacturing such stacked body for cof substrate, and cof film carrier tape formed by using such stacked body for cof substrate
06/29/2006WO2006067995A1 Film-forming method and recording medium
06/29/2006WO2006067974A1 Non-contact convey device by superconducting magnetic levitation
06/29/2006WO2006067944A1 Resist composition for liquid immersion exposure and method for resist pattern formation
06/29/2006WO2006067678A1 Semiconductor device with a superparaelectric gate insulator