Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2006
07/06/2006US20060145167 Electronic device including a guest material within a layer and a process for forming the same
07/06/2006US20060145166 Semiconductor apparatus, method for growing nitride semiconductor and method for producing semiconductor apparatus
07/06/2006US20060145165 Semiconductor light emitting device and fabrication method thereof
07/06/2006US20060145159 Light-emitting device, method of manufacturing the same, and display unit
07/06/2006US20060145155 TFT array substrate and the fabrication method thereof
07/06/2006US20060145153 Semiconductor device and method of manufacturing the same
07/06/2006US20060145141 Field effect transistor and method of manufacturing the same
07/06/2006US20060145139 Organic semiconductor device and its manufacturing method
07/06/2006US20060145137 Quantum dot/quantum well Light Emitting Diode
07/06/2006US20060145134 Non-planarized, self-aligned, non-volatile phase-change memory array and method of formation
07/06/2006US20060144988 Device and method for transporting film carrier tape for mounting electronic components
07/06/2006US20060144828 Device and method for laser processing
07/06/2006US20060144825 Dual reduced agents for barrier removal in chemical mechanical polishing
07/06/2006US20060144824 Method of polishing a silicon-containing dielectric
07/06/2006US20060144823 Etching solution for D-defect evaluation in silicon wafer and evaluation method using the same
07/06/2006US20060144822 Apparatus and method for wet-etching
07/06/2006US20060144819 Remote chamber methods for removing surface deposits
07/06/2006US20060144817 Low-pressure removal of photoresist and etch residue
07/06/2006US20060144815 Treatment method for surface of photoresist layer and method for forming patterned photoresist layer
07/06/2006US20060144714 Substrate plating method and apparatus
07/06/2006US20060144584 Cooling device for vacuum treatment device
07/06/2006US20060144520 Viewing window cleaning apparatus
07/06/2006US20060144518 Plasma processing apparatus and plasma processing method
07/06/2006US20060144517 Plasma producing apparatus and doping apparatus
07/06/2006US20060144429 Device and process for liquid treatment of wafer-shaped articles
07/06/2006US20060144428 Processing-subject cleaning method and apparatus, and device manufacturing method and device
07/06/2006US20060144427 Plasma cleansing apparatus that eliminates organic and oxidative contaminant and may effectively dissipate heat and eliminate exhaust gas and integrated system for the same
07/06/2006US20060144418 Components for film forming device and method of washing the component
07/06/2006US20060144338 High accuracy vapor generation and delivery for thin film deposition
07/06/2006US20060144336 Heater of chemical vapor deposition apparatus for manfuacturing a thin film
07/06/2006US20060144335 Methods and devices for monitoring and controlling thin film processing
07/06/2006US20060144334 Method and apparatus for deposition of low dielectric constant materials
07/06/2006US20060144333 Atomic layer deposition apparatus and method
07/06/2006US20060144330 Coating process method and coating process apparatus
07/06/2006US20060144319 Gelated colloid crystal precursor and gelated colloid crystal, and method and apparatus for preparing gelated colloid crystal
07/06/2006US20060144293 Coating solutions for use in forming bismuth-based ferroelectric thin films and a method of forming bismuth-based ferroelectric thin films using the coating solutions
07/06/2006US20060144234 Trapping device, processing system, and method removing impurities
07/06/2006US20060143993 Slurry compositions for use in chemical mechanical polishing and method of manufacturing semiconductor device using the same
07/06/2006US20060143937 Method for drying substrates
07/06/2006US20060143913 Very low moisture o-ring and method for preparing the same
07/06/2006DE19958200B4 Mikroelektronische Struktur und Verfahren zu deren Herstellung Microelectronic structure and process for their preparation
07/06/2006DE19952604B4 Vorrichtung zum Ausbilden eines Beschichtungsfilms An apparatus for forming a coating film
07/06/2006DE19925657B4 Verfahren zum Ausbilden eines selbstpositionierenden Kontakts in einem Halbleiterbauelement A method for forming a self-aligned contact in a semiconductor device
07/06/2006DE19807010B4 Verfahren zur Herstellung einer nichtflüchtigen Speichereinrichtung A method of manufacturing a nonvolatile memory device
07/06/2006DE19756569B4 Verfahren zum Herstellen eines geschichteten Keramiksubstrats A method for producing a layered ceramic substrate,
07/06/2006DE19643903B4 Verfahren zur Herstellung eines Bipolartransistors mit Heteroübergang A process for producing a heterojunction bipolar junction
07/06/2006DE112004001651T5 Automatisches Layoutumwandlungsystem und -verfahren Automatic layout conversion system and method
07/06/2006DE112004001568T5 Polierzusammensetzung und Polierverfahren unter Verwendung derselben Polishing composition and polishing method using the same
07/06/2006DE112004001527T5 Verfahren und Lasersysteme zur Verbindungsbearbeitung unter Verwendung von Laserimpulsen mit speziell zugeschnittenen Leistungsprofilen The method and laser systems for call processing using laser pulses with specially tailored power profiles
07/06/2006DE112004001510T5 Speicherzellenstruktur mit einer Nitridschicht mit reduziertem Ladungsverlust und Verfahren zur Herstellung derselben Memory cell structure having nitride layer with reduced charge loss and method for manufacturing the same
07/06/2006DE112004001232T5 Fensteranordnung Fenestration
07/06/2006DE112004000769T5 Laser-Chipschneidvorrichtung Laser chip cutter
07/06/2006DE112004000753T5 Verfahren zum Reduzieren der Kurzkanaleffekte in Speicherzellen und zugehörige Struktur A method for reducing the short-channel effects in the memory cells and associated structure
07/06/2006DE10355925B4 Leistungshalbleitermodul und Verfahren seiner Herstellung The power semiconductor module and its production method
07/06/2006DE10355508B4 Ultradünne Halbleiterschaltung mit Kontakt-Bumps sowie zugehöriges Herstellungsverfahren Ultra-thin semiconductor circuit with contact bumps and manufacturing method thereof
07/06/2006DE10349692B4 Halbleitervorrichtung mit Durchgangselektrode und Verfahren zur Herstellung derselben A semiconductor device having through-electrode and process for producing same
07/06/2006DE10343084B4 Halbleiterwafer aus einer Vielzahl von durch Vereinzelungsrahmen voneinander zu trennenden Chips Semiconductor wafer of a plurality of spaced to be separated by separating frame chips
07/06/2006DE10329212B4 Verfahren zum Herstellen einer integrierten DRAM-Speicherschaltung mit Corner Devices A method for producing a DRAM integrated circuit memory devices with Corner
07/06/2006DE10328578B4 Verfahren zum reaktiven Ionenätzen unter Verwendung einer Hartmaske aus einer amorphen Kohlenstoff-Wasserstoff-Schicht A method of reactive ion etching using a hard mask of an amorphous carbon-hydrogen layer
07/06/2006DE10318681B4 Verfahren und Vorrichtung zum Entfernen eines Randbereichs einer Substratschicht und zur Substratbeschichtung sowie Substrat Method and apparatus for removing an edge portion of a substrate layer and the substrate coating and substrate
07/06/2006DE10260286B4 Verwendung eines Defekterzeugnungsverfahrens zum Dotieren eines Halbleiterkörpers Use of a Defekterzeugnungsverfahrens for doping a semiconductor body
07/06/2006DE10227365B4 Vorrichtung zur Bewegung von Einbauteilen in Vakuumanlagen Means for moving installed equipment in vacuum systems
07/06/2006DE10214065B4 Verfahren zur Herstellung eines verbesserten Metallsilizidbereichs in einem Silizium enthaltenden leitenden Gebiet in einer integrierten Schaltung A process for preparing an improved Metallsilizidbereichs in a silicon-containing conductive region in an integrated circuit
07/06/2006DE102005062532A1 Halbleiterbauelement und Kontaktstellenherstellungsverfahren A semiconductor device manufacturing method and contact points
07/06/2006DE102005057171A1 Laserstrahlbearbeitungsmaschine Laser beam processing machine
07/06/2006DE102005028628A1 Forming an isolation film of semiconductor device by patterning pad film and predetermined depth of substrate to form trenches, and forming sidewall oxide films, first isolation film, silicon layer and second isolation film
07/06/2006DE102005014724B3 Insulation structure manufacturing method for dynamic RAM, involves performing wet chemical etching step for removing substrate, and increasing or decreasing concentration of doped material at middle of substrate vertically to coating
07/06/2006DE102005001291A1 Charge-trapping-Speicherbauelement und Herstellungsverfahren Charge-trapping memory device and manufacturing method
07/06/2006DE102004063406B4 Vorrichtung und Anordnung zum Verhindern von Plasmaladungsschäden Device and arrangement for preventing plasma damage to cargo
07/06/2006DE102004063036A1 Verfahren zum Ausbilden von Kontaktflecken A method for forming pads
07/06/2006DE102004062594A1 Disk-shaped object e.g. wafer processing system recovery apparatus, has input unit for resetting overhead hoist transportation, when placing and lifting of front opening unified pod with object is stopped by interruption of light barrier
07/06/2006DE102004061616A1 Plastic optical component for use with e.g. sensor, camera, transmitter or receiver, comprises panel laid into mold and over-injected with plastic
07/06/2006DE102004061549A1 System zum Testen von Halbleiter-Bauelementen A system for testing semiconductor devices
07/06/2006DE102004061054A1 Method for fastening substrate at substrate holder involves laying of first side of substrate on substrate holder, setting of first fluid pressure at first sub range of first side of substrate and setting of second fluid pressure
07/06/2006DE102004060980A1 Device for drying substrate has mechanism for vertical yield of number of parallel substrate from liquid bath and fluid feeding device for arranged guiding of fluid
07/06/2006DE102004060961A1 Technik zur Herstellung eines Substrats mit kristallinen Halbleitergebieten mit unterschiedlichen Eigenschaften, die über einer vergrabenen Isolierschicht angeordnet sind Technology for producing a substrate having crystalline semiconductor regions with different properties, which are arranged on a buried insulating layer
07/06/2006DE10200019B4 Kühlkörper für Halbleiterbauelemente, Verfahren zu dessen Herstellung und Werkzeug zur Durchführung des Verfahrens Heat sink for semiconductor devices, processes for its preparation and to a tool for carrying out the method
07/06/2006DE10127336B4 Halbleiterspeicherzelle mit einem Auswahltransistor und einem Speicherkondensator A semiconductor memory cell comprising a selection transistor and a storage capacitor
07/06/2006DE10060428B4 Mittels Feldeffekt steuerbares in beide Richtungen sperrendes Halbleiterbauelement und Verfahren zu dessen Herstellung By means of field-effect-controllable blocking in both directions semiconductor device and process for its preparation
07/06/2006DE10047152B4 Hochvolt-Diode und Verfahren zu deren Herstellung High-voltage diode and methods for their preparation
07/06/2006DE10022656B4 Verfahren zum Entfernen von Strukturen A method for removing structures
07/06/2006DE10007414B4 Verfahren zur Durchkontaktierung eines Substrats für Leistungshalbleitermodule durch Lot und mit dem Verfahren hergestelltes Substrat Method for through-hole plating of a substrate for power semiconductor modules by solder and substrate produced by the method
07/06/2006CA2592826A1 Semiconductor structures utilizing thin film resistors and tungsten plug connectors and methods for making the same
07/05/2006EP1677585A1 Multilayer printed wiring board and method for manufacturing same
07/05/2006EP1677583A1 Electronic control unit and method thereof
07/05/2006EP1677373A2 Method of using pre-formed nanotubes to make carbon nanotube films, layers, ribbons, elements and articles
07/05/2006EP1677361A2 Semiconductor device and method for manufacture thereof
07/05/2006EP1677360A2 Semiconductor device and fabrication method thereof
07/05/2006EP1677359A1 Semiconductor device and method for manufacturing semiconductor device
07/05/2006EP1677350A2 Semiconductor device having surface regions with different crystal orientation and manufacturing method
07/05/2006EP1677348A1 Method for manufacturing non-volatile memory cells and periphery transistors
07/05/2006EP1677347A1 Magnetic random access memory
07/05/2006EP1677346A2 Machining substrates, particularly semiconductor wafers
07/05/2006EP1677345A1 Bonding wire and integrated circuit device using the same
07/05/2006EP1677344A1 Process for producing high resistance silicon wafer, and process for producing epitaxial wafer and soi wafer
07/05/2006EP1677343A1 Composition for forming etching stopper layer
07/05/2006EP1677342A1 Process for cleaning a semiconductor wafer
07/05/2006EP1677338A1 Apparatus and method for controlling etch depth during plasma alternating etching of semiconductor substrates
07/05/2006EP1677311A1 Non-volatile memory cells, memory arrays including the same and methods of operating cells and arrays
07/05/2006EP1677310A1 Semiconductor memory device and storage method thereof