Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2006
09/26/2006US7112467 Structure and method for temporarily holding integrated circuit chips in accurate alignment
09/26/2006US7112466 Semiconductor device for isolating a photodiode to reduce junction leakage and method of formation
09/26/2006US7112465 Fabrication methods for ultra thin back-illuminated photodiode array
09/26/2006US7112464 Devices having vertically-disposed nanofabric articles and methods of making the same
09/26/2006US7112463 Method for making devices using ink jet printing
09/26/2006US7112462 Self-light-emitting apparatus and semiconductor device used in the apparatus
09/26/2006US7112461 Fabrication process for integrated circuit having photodiode device
09/26/2006US7112460 Semiconductor laser device, production method therefor, and jig for use in the production method
09/26/2006US7112459 Thin film transistor liquid crystal display and fabrication method thereof
09/26/2006US7112458 Method of forming a liquid crystal display
09/26/2006US7112457 Method of manufacturing an opto-coupler
09/26/2006US7112456 Vertical GaN light emitting diode and method for manufacturing the same
09/26/2006US7112455 Semiconductor optical devices and method for forming
09/26/2006US7112454 System and method for reducing shorting in memory cells
09/26/2006US7112390 Forming, measuring and adjusting photoresist films patterns on wafers, used to from electrical and electronic apparatus; photolithography
09/26/2006US7112352 Apparatus and method for depositing large area coatings on planar surfaces
09/26/2006US7112288 Methods for inspection sample preparation
09/26/2006US7112286 Thin film resistor structure and method of fabricating a thin film resistor structure
09/26/2006US7112268 Plating device and plating method
09/26/2006US7112243 Method for producing Group III nitride compound semiconductor
09/26/2006US7112125 Polishing cloth, polishing apparatus and method of manufacturing semiconductor devices
09/26/2006US7112123 Chemical-mechanical polishing (CMP) slurry containing clay and CeO2 abrasive particles and method of planarizing surfaces
09/26/2006US7112121 Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
09/26/2006US7112048 BOC BGA package for die with I-shaped bond pad layout
09/26/2006US7112027 Pod cover removing-installing apparatus
09/26/2006US7111797 Non-contact fluid particle cleaner and method
09/26/2006US7111771 Doped tin-indium; superplasticity; microelectronics; for use in computers, wireless communicators, hand-held devices, automobiles, locomotives, aircraft, watercraft, and spacecraft
09/26/2006US7111632 Ultrasonic cleaning device for removing undesirable particles from an object
09/26/2006US7111630 High pressure processing apparatus and method
09/26/2006US7111629 Method for cleaning substrate surface
09/26/2006US7111390 Parts mounting and assembling apparatus
09/21/2006WO2006099354A1 Narrow semiconductor trench structure
09/21/2006WO2006099198A1 Complementary metal oxide semiconductor integrated circuit using uniaxial compressive stress and biaxial compressive stress
09/21/2006WO2006098991A2 Integrated circuit capacitor having antireflective dielectric
09/21/2006WO2006098888A2 Plasma oxidation and removal of oxidized material
09/21/2006WO2006098820A2 Method of forming a semiconductor device having a diffusion barrier stack and structure thereof
09/21/2006WO2006098792A2 High accuracy vapor generation and delivery for thin film deposition
09/21/2006WO2006098756A2 Synthetic control of metal oxide nanocrystal sizes and shapes
09/21/2006WO2006098565A1 Method of depositing thin film using ald process
09/21/2006WO2006098513A1 Heat treatment method and method for crystallizing semiconductor
09/21/2006WO2006098472A1 Plate member, substrate holding device, exposure device and exposure method, and device manufacturing method
09/21/2006WO2006098459A1 Resin ejection nozzle, resin encapsulation method, and electronic part assembly
09/21/2006WO2006098454A1 Submount and method for manufacturing same
09/21/2006WO2006098432A1 Magnetic semiconductor material
09/21/2006WO2006098426A1 Electronic component mounting method and electronic component mounting device
09/21/2006WO2006098416A1 Organic thin-film transistor and method for manufacturing same
09/21/2006WO2006098391A1 Exposure apparatus and exposure method
09/21/2006WO2006098369A1 Method for manufacturing semiconductor device and semiconductor device
09/21/2006WO2006098352A1 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
09/21/2006WO2006098341A1 Field effect transistor and device thereof
09/21/2006WO2006098316A1 Method for thin film formation
09/21/2006WO2006098300A1 Substrate treatment method and substrate treatment apparatus
09/21/2006WO2006098291A1 Photosensitive resin composition
09/21/2006WO2006098268A1 Method of bump forming and method of flip chip mounting using conductive grain
09/21/2006WO2006098266A1 Mask cleaning method
09/21/2006WO2006098259A1 SELECTIVE W-CVD PROCESS AND PROCESS FOR PRODUCING Cu MULTILAYER WIRING
09/21/2006WO2006098237A1 Film forming apparatus and film forming method
09/21/2006WO2006098219A1 Semiconductor device
09/21/2006WO2006098215A1 Nitride semiconductor device and method for manufacturing same
09/21/2006WO2006098211A1 Gripper and method for holding semiconductor wafer, and shape measuring apparatus
09/21/2006WO2006098196A1 Package equipped with semiconductor chip and method for producing same
09/21/2006WO2006098187A1 Flip chip mounting method and bump forming method
09/21/2006WO2006098167A1 Group iii nitride semiconductor device and epitaxial substrate
09/21/2006WO2006098150A1 Polishing head for semiconductor wafer, polishing apparatus and polishing method
09/21/2006WO2006098141A1 Abrasive for semiconductor integrated circuit device, method for polishing semiconductor integrated circuit device and semiconductor integrated circuit device manufacturing method
09/21/2006WO2006098121A1 Organic semiconductor material, organic semiconductor film, organic semiconductor device, organic thin-film transistor, and method for manufacturing organic thin-film transistor
09/21/2006WO2006098109A1 Plasma doping method and device
09/21/2006WO2006098081A1 Treatment device, treatment device consumable parts management method, treatment system, and treatment system consumable parts management method
09/21/2006WO2006098034A1 Simulation apparatus, simulation method, simulation program, and computer readable recording medium in which that program has been recorded
09/21/2006WO2006098023A1 Semiconductor device and method for manufacturing same
09/21/2006WO2006097982A1 Method for manufacturing semiconductor integrated circuit device
09/21/2006WO2006097977A1 Semiconductor device and method for manufacturing same
09/21/2006WO2006097591A1 Method of producing a light-emitting diode comprising a nanostructured pn junction and diode thus obtained
09/21/2006WO2006097426A1 Barrier layers for conductive features
09/21/2006WO2006097241A1 Method for microstructuring solid surfaces
09/21/2006WO2006097087A1 Method and device for treating objects, in particular for cleaning semiconductor objects
09/21/2006WO2006097078A1 Device, in particular, for measuring humidity, comprising corrosion-protected connections
09/21/2006WO2006097029A1 A self-directing and self-assembled quantum conductive junction of nano-medicine and its preparation process
09/21/2006WO2006074248A3 Engineered non-polymeric organic particles for chemical mechanical planarization
09/21/2006WO2006064282A3 A method of ion implantation to reduce transient enhanced diffusion
09/21/2006WO2006063269A3 A method for making a semiconductor device with a high-k gate dielectric and a metal gate electrode
09/21/2006WO2006060983A3 Method for applying an adhesive layer to thinly ground semiconductor chips of a semiconductor wafer
09/21/2006WO2006058594A3 Multiple mask and method for producing differently doped regions
09/21/2006WO2006048846A3 Semiconductor chip connection based on carbon nanotubes
09/21/2006WO2006034679A3 Method for producing a strained layer on a substrate and layered structure
09/21/2006WO2006034672A3 Method for treating semiconductor substrates that are annealed by means of intensive light pulses
09/21/2006WO2006014783A3 Method for manufacturing a semiconductor device having silicided regions
09/21/2006WO2006014346A3 Silicon-rich nickel-silicide ohmic contacts for sic semiconductor devices
09/21/2006WO2006004921A3 Micro-castellated interposer
09/21/2006WO2005112098A3 Blood drawing device with flash detection
09/21/2006WO2005104213A3 COSMETIC FORMULATIONS COMPRISING ZnO NANOPARTICLES
09/21/2006WO2005091974A3 Methods for the optimization of substrate etching in a plasma processing system
09/21/2006WO2005043590A3 Strained dislocation-free channels for cmos and method of manufacture
09/21/2006US20060212253 Intelligent measurement modular semiconductor parametric test system
09/21/2006US20060212156 Method of monitoring and/or controlling a semiconductor manufacturing apparatus and system therefor
09/21/2006US20060212152 Automatic material handling system, production system for semiconductor device, and production management method for semiconductor device
09/21/2006US20060211814 Auxiliary for forming fine pattern and process for producing the same
09/21/2006US20060211344 Chemical dilution system for semiconductor device processing system
09/21/2006US20060211278 Interconnect for microelectronic structures with enhanced spring characteristics
09/21/2006US20060211273 Method of manufacturing an injector plate