| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/21/2006 | US20060207968 Selective etching of oxides from substrates |
| 09/21/2006 | US20060207965 Method to form both high and low-k materials over the same dielectric region, and their application in mixed mode circuits |
| 09/21/2006 | US20060207916 Precision substrate storage container |
| 09/21/2006 | US20060207887 Monitoring apparatus and method for improving the accuracy and repeatability of electrochemical capacitance voltage (ecv) measurements |
| 09/21/2006 | US20060207885 Plating method that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 09/21/2006 | US20060207724 Method of removing oxide film on a substrate with hydrogen and fluorine radicals |
| 09/21/2006 | US20060207714 Display device and method of manufacturing the same |
| 09/21/2006 | US20060207713 Forming a SiO2 layer on a silicon substrate; applying a heat-curable conductive adhesive layer; laminating the single crystal plate on the adhesive; heat curing; and polishing, polarizing and etching the crystal plate; fabrication of many electric or electronic devices including a microactuator |
| 09/21/2006 | US20060207691 Metal layer forming methods and capacitor electrode forming methods |
| 09/21/2006 | US20060207688 Method for storing silicon substrate having silicon oxide film formed thereon |
| 09/21/2006 | US20060207636 Multi-menisci processing apparatus |
| 09/21/2006 | US20060207635 Barrier polishing fluid |
| 09/21/2006 | US20060207631 Apparatus and method of cleaning a sustrate |
| 09/21/2006 | US20060207630 Device for cleaning cvd device and method of cleaning cvd device |
| 09/21/2006 | US20060207505 Method and apparatus for forming multi-layered thin film by using photolysis chemical vapor deposition |
| 09/21/2006 | US20060207188 Ceria abrasive for cmp |
| 09/21/2006 | DE4430963B4 Kondensator für einen dynamischen Direktzugriffspeicher sowie Verfahren zur Herstellung desselben Of the same capacitor for a dynamic random access memory as well as methods for preparing |
| 09/21/2006 | DE4243611B4 Testmodusschaltung für eine Speichervorrichtung Test mode circuit for a memory device |
| 09/21/2006 | DE19940320B4 Nicht reflektierende Beschichtungspolymere und Verfahren zu deren Herstellung Non-reflective coating polymers and methods for their preparation |
| 09/21/2006 | DE19810810B4 Verfahren zum Nassätzen eines LCD-Glassubstrats sowie Ätzvorrichtung zur Durchführung des Verfahrens A method of wet etching of an LCD glass substrate, and etching apparatus for performing the method |
| 09/21/2006 | DE19727423B4 Halbleiterbauelement und ein Herstellungsverfahren dafür A semiconductor device and a manufacturing method thereof |
| 09/21/2006 | DE112004002033T5 Verfahren zur Herstellung eines Verbindungshalbleitersubstrats A process for preparing a compound semiconductor substrate |
| 09/21/2006 | DE112004002022T5 Messsonden-Prüfstruktur Measuring probe test structure |
| 09/21/2006 | DE10310617B4 Elektronisches Bauteil mit Hohlraum und ein Verfahren zur Herstellung desselben An electronic part having the cavity and a method of manufacturing the same |
| 09/21/2006 | DE10220360B4 Verwendung eines elektrischen Widerstands-Bauelementes auf Diamantbasis Use of an electric resistance component diamond-based |
| 09/21/2006 | DE102006012155A1 Verfahren zum Herstellen eines Halbleiterbauelements A method of manufacturing a semiconductor device |
| 09/21/2006 | DE102006010503A1 Polierkissen auf Wasserbasis und Herstellungsverfahren Water-based polishing pad and manufacturing method |
| 09/21/2006 | DE102006008454A1 Pads layout structure for use in e.g. semiconductor memory component, has subsets of wire and non-wire bonding pads, where non-wire bonding pad subset is used to test component, while wire bonding pad subset is used for bonding component |
| 09/21/2006 | DE102006005547A1 Semiconductor memory device, e.g. silicon-oxide-nitride-oxide-semicon ductor device for use in, e.g., memory card, has metal film generating high potential barrier between conductive gate film and blocking insulation film |
| 09/21/2006 | DE102006000720A1 Laserstrahlbearbeitungsmaschine Laser beam processing machine |
| 09/21/2006 | DE102005038416B3 Thermode mechanism for manufacturing smart label, has heating plates aligned vertically and arranged next to one another, in lower side of base plates, where heating units are arranged at front and bottom sides of heating plates |
| 09/21/2006 | DE102005030449A1 Floating gate electrode formation method of flash memory device, involves patterning organic bottom anti-reflection coating film using photoresist patterns |
| 09/21/2006 | DE102005030448A1 Fabrication method for flash memory used in digital camera, involves forming electrode spacer on side walls of floating gate formed between element isolation film |
| 09/21/2006 | DE102005026315A1 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device |
| 09/21/2006 | DE102005016930A1 RFID chip and strip substrate contact surfaces electrical and mechanical connection establishing method for transponder, involves hooking chip surfaces having hooks/lugs with substrate surfaces having hooks/lugs with size in nanometer range |
| 09/21/2006 | DE102005012217A1 Lateral MISFET has semiconductor body of doped semiconductor substrate of first conductivity type and on semiconductor substrate epitaxial layer is provided to first conductivity type complementing second conductivity type |
| 09/21/2006 | DE102005011873A1 Ion recombination zone producing method for e.g. silicon wafer, involves accomplishing diffusion processes to store heavy metal in space agglomerate, and producing zone of increased ion recombination in body zone of power transistor |
| 09/21/2006 | DE102005011159A1 Semiconductor component has surface mountable external contacts, which has external contact surface on lower surface of housing of semiconductor components whereby drain contact surface is provided at rear surface of semiconductor chip |
| 09/21/2006 | DE102005011150A1 Verfahren zum Entwurf einer integrierten Schaltung Method for designing an integrated circuit |
| 09/21/2006 | DE102005011107A1 Verfahren und Vorrichtung zum Bearbeiten von Wafern auf Montageträgern A method and apparatus for processing of wafers on mounting supports |
| 09/21/2006 | DE102005011106A1 Binding two wafers comprises preparing a first wafer and second wafer with a binding surface; applying a binding agent at the binding surface of at least one of the wafers; and joining the wafers at the binding surfaces |
| 09/21/2006 | DE102005010953A1 Monocrystalline semiconductor layers production for electronic circuits, comprises melt recrystallization of polycrystalline two dimensional elements to form monocrystalline two dimensional elements on heatproof and insulation bottom layer |
| 09/21/2006 | DE102005002675A1 Plane spin-on-layer production for use on semiconductor wafer, involves superimposing liner layer on semiconductor structure before superimposition of spin-on-layer, where structure supports planar superimposition of layer on it |
| 09/21/2006 | DE102004037336B4 Verfahren zum Herstellen einer Schicht-Anordnung und Schicht-Anordnung A method for producing a layer arrangement and layer arrangement |
| 09/21/2006 | DE102004029023B4 Leistungshalbleitermodul mit einem Detektor zum Erfassen eines durch ein Leistungshalbleiterbauteil fliessenden Schaltungshauptstroms Power semiconductor module with a detector for detecting a current flowing through a power semiconductor device circuit the main current |
| 09/21/2006 | DE10134178B4 Halbleiterspeicher mit mehreren Speicherzellenfeldern A semiconductor memory having a plurality of memory cell arrays |
| 09/21/2006 | DE10128419B4 Festkörper-Bildaufnahmeeinrichtung mit Mikrolinse und Unterfüllung Solid-state image pickup device with microlens and underfill |
| 09/21/2006 | DE10127387B4 Verfahren zum Herstellen eines Halbleitersubstrats und eines Halbleiterbauelements aus zwei einkristallinen Halbleiterscheiben A method for producing a semiconductor substrate and a semiconductor device made up of two monocrystalline semiconductor wafers |
| 09/21/2006 | DE10037950B4 Nichtflüchtiger ferroelektrischer Speicher und Verfahren zum Herstellen desselben Of the same non-volatile ferroelectric memory and method of manufacturing |
| 09/21/2006 | CA2602365A1 Low-dielectric constant cryptocrystal layers and nanostructures |
| 09/21/2006 | CA2564423A1 Group iii nitride semiconductor device and epitaxial substrate |
| 09/20/2006 | EP1703568A2 Display device |
| 09/20/2006 | EP1703567A2 Insulated gate field-effect transistor and method of making the same |
| 09/20/2006 | EP1703565A1 Bipolar transistor, semiconductor device comprising the bipolar transistor and process for fabricating them |
| 09/20/2006 | EP1703563A2 Mos image sensor |
| 09/20/2006 | EP1703558A2 Wiring board with embedded semiconductor chip, embedded reinforcing member and method of manufacturing the same |
| 09/20/2006 | EP1703553A2 Via in semiconductor substrate and its fabrication method |
| 09/20/2006 | EP1703552A2 Method of forming non-conformal layers |
| 09/20/2006 | EP1703551A1 Process and apparatus for treating objects, particularly for cleaning semiconductor elements |
| 09/20/2006 | EP1703550A1 Vapor growth device and production method for epitaxial wafer |
| 09/20/2006 | EP1703549A1 Vapor growth device and porduction method for epitaxial wafer |
| 09/20/2006 | EP1703548A1 Exposure apparatus, exposure method, and device producing method |
| 09/20/2006 | EP1703547A2 Method and device for controlling the contamination of wafer substrates |
| 09/20/2006 | EP1703546A2 Processing device |
| 09/20/2006 | EP1703545A2 Gas providing member and processing device |
| 09/20/2006 | EP1703544A2 Chip holder and chip treatment method |
| 09/20/2006 | EP1703539A1 Electron beam device |
| 09/20/2006 | EP1703521A1 Semiconductor integrated circuit and nonvolatile memory element |
| 09/20/2006 | EP1703520A1 Semiconductor integrated circuit and nonvolatile memory element |
| 09/20/2006 | EP1703328A1 Composition for forming nitride coating film for hard mask |
| 09/20/2006 | EP1703327A2 Composition for forming antireflection film, laminate, and method for forming resist pattern |
| 09/20/2006 | EP1703302A1 Ion beam measuring method and ion implanting apparatus |
| 09/20/2006 | EP1703002A2 Multilayer substrate, method for producing a multilayer substrate, and device |
| 09/20/2006 | EP1702965A2 Metal chemical mechanical polishing solution and polishing method |
| 09/20/2006 | EP1702963A1 Anti-moisture and soil-repellent coatings |
| 09/20/2006 | EP1702900A1 Alumina-sintered body and associated manufacturing method, and electrostatic chuck and associated manufacturing method |
| 09/20/2006 | EP1702371A1 Method for the production a nanoelement field effect transistor, nanoelement-field effect transistor and surrounded gate structure |
| 09/20/2006 | EP1702367A2 Transistor having three electronically isolated electrodes and method of formation |
| 09/20/2006 | EP1702365A2 Enhancement of electron and hole mobilities in 110 under biaxial compressive strain |
| 09/20/2006 | EP1702362A1 Monolithically integrated circuit for radio frequency applications |
| 09/20/2006 | EP1702359A1 Fabrication method |
| 09/20/2006 | EP1702358A2 A method for forming thick dielectric regions using etched trenches |
| 09/20/2006 | EP1702357A1 Substrate with determinate thermal expansion coefficient |
| 09/20/2006 | EP1702356A2 A method of varying etch selectivities of a film |
| 09/20/2006 | EP1702355A1 Methods for deposition of semiconductor material |
| 09/20/2006 | EP1702354A2 Single-crystal semiconductor layer with heteroaromatic macro-network |
| 09/20/2006 | EP1702353A1 Multiple anneal induced disordering |
| 09/20/2006 | EP1702352A2 Nanotube fabrication basis |
| 09/20/2006 | EP1702351A2 Exhaust conditioning system for semiconductor reactor |
| 09/20/2006 | EP1702350A2 Planar substrate with selected semiconductor crystal orientations formed by localized amorphzation and recrystallization of stacked template layers |
| 09/20/2006 | EP1702349A2 Method of manufacturing a semiconductor component, and semiconductor component formed thereby |
| 09/20/2006 | EP1702348A2 SiGe LATTICE ENGINEERING USING A COMBINATION OF OXIDATION THINNING AND EPITAXIAL REGROWTH |
| 09/20/2006 | EP1702241A2 Chuck system, lithographic apparatus using the same and device manufacturing method |
| 09/20/2006 | EP1702226A2 Lensed tip optical fiber and method of making the same |
| 09/20/2006 | EP1701827A1 Cutting device and control of the cutting device |
| 09/20/2006 | EP1701686A2 Method of manufacturing a superjunction device with conventional terminations |
| 09/20/2006 | EP1565656B1 High-pressure device for closing a container in a clean room |
| 09/20/2006 | EP1558678B1 Toughened epoxy / polyanhydride no- flow underfill encapsulant composition |
| 09/20/2006 | EP1552343A4 High-density interconnection of temperature sensitive electronic devices |
| 09/20/2006 | EP1476500A4 Method of making a nanoporous film |