H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2006
10/24/2006	US7126150 Light emitting layer and forming method of the same
10/24/2006	US7126145 Frame transfer prober
10/24/2006	US7126141 Electrooptic system array, charged-particle beam exposure apparatus using the same, and device manufacturing method
10/24/2006	US7126140 Multi-electron beam exposure method and apparatus
10/24/2006	US7126138 Electron flood apparatus and ion implantation system
10/24/2006	US7126090 Ceramic heaters, a method for producing the same and articles having metal members
10/24/2006	US7126083 Chip scale marker and method of calibrating marking position
10/24/2006	US7126052 Insertion of surfactant; low pressure desorption; solar cells
10/24/2006	US7125815 Methods of forming a phosphorous doped silicon dioxide comprising layer
10/24/2006	US7125814 Bis-o-nitrophenols derivatives and poly-o-hydroxyamides, polybenzoxazoles, materials, and microelectronic devices made therefrom
10/24/2006	US7125813 Method of depositing low K barrier layers
10/24/2006	US7125812 CVD method and device for forming silicon-containing insulation film
10/24/2006	US7125811 Oxidation method for semiconductor process
10/24/2006	US7125810 Semiconductor device and method of manufacturing semiconductor device
10/24/2006	US7125809 Method and material for removing etch residue from high aspect ratio contact surfaces
10/24/2006	US7125808 Method for manufacturing non-volatile memory cells on a semiconductor substrate
10/24/2006	US7125807 Method for manufacturing non-volatile memory cells on a semiconductor substrate
10/24/2006	US7125806 Etching method
10/24/2006	US7125805 Method of semiconductor fabrication incorporating disposable spacer into elevated source/drain processing
10/24/2006	US7125804 Etching methods and apparatus and substrate assemblies produced therewith
10/24/2006	US7125803 Reverse tone mask method for post-CMP elimination of copper overburden
10/24/2006	US7125802 CMP process leaving no residual oxide layer or slurry particles
10/24/2006	US7125801 Method of manufacturing Group III nitride crystal substrate, etchant used in the method, Group III nitride crystal substrate, and semiconductor device including the same
10/24/2006	US7125800 Methods for making nearly planar dielectric films in integrated circuits
10/24/2006	US7125799 Method and device for processing substrate, and apparatus for manufacturing semiconductor device
10/24/2006	US7125798 Circuit device and manufacturing method of circuit device
10/24/2006	US7125797 Contact structure of semiconductor device and method of forming the same
10/24/2006	US7125796 Plasma etch process for multilayer vias having an organic layer with vertical sidewalls
10/24/2006	US7125795 Fabrication method for microstructures with high aspect ratios
10/24/2006	US7125794 Method of manufacturing semiconductor device
10/24/2006	US7125793 Method for forming an opening for an interconnect structure in a dielectric layer having a photosensitive material
10/24/2006	US7125792 Dual damascene structure and method
10/24/2006	US7125791 Advanced copper damascene structure
10/24/2006	US7125790 Inclusion of low-k dielectric material between bit lines
10/24/2006	US7125789 Composite metal column for mounting semiconductor device
10/24/2006	US7125788 Circuit device and method of manufacturing the circuit device
10/24/2006	US7125787 Method of manufacturing insulated gate semiconductor device
10/24/2006	US7125786 Method of forming vias in silicon carbide and resulting devices and circuits
10/24/2006	US7125785 Mixed orientation and mixed material semiconductor-on-insulator wafer
10/24/2006	US7125784 Method of forming isolation film in semiconductor device
10/24/2006	US7125783 Dielectric anti-reflective coating surface treatment to prevent defect generation in associated wet clean
10/24/2006	US7125782 Air gaps between conductive lines for reduced RC delay of integrated circuits
10/24/2006	US7125781 Methods of forming capacitor devices
10/24/2006	US7125780 Dielectric isolation type semiconductor device and method for manufacturing the same
10/24/2006	US7125779 Semiconductor device and method of manufacturing the same
10/24/2006	US7125778 Method for fabricating a self-aligning mask
10/24/2006	US7125777 Asymmetric hetero-doped high-voltage MOSFET (AH2MOS)
10/24/2006	US7125776 Multi-step chemical mechanical polishing of a gate area in a FinFET
10/24/2006	US7125775 Method for forming hybrid device gates
10/24/2006	US7125774 Method of manufacturing transistor having recessed channel
10/24/2006	US7125772 Nonvolatile memory
10/24/2006	US7125771 Methods for fabricating nonvolatile memory device
10/24/2006	US7125770 Gate Structure in flash memory cell and method of forming the same, and method of forming dielectric film
10/24/2006	US7125769 Method of fabricating flash memory device
10/24/2006	US7125768 Method for reducing single bit data loss in a memory circuit
10/24/2006	US7125767 Capacitor including a dielectric layer having an inhomogeneous crystalline region and method of fabricating the same
10/24/2006	US7125766 Method of forming capacitor for semiconductor device
10/24/2006	US7125765 Semiconductor device and method for manufacturing same
10/24/2006	US7125764 Method of producing solid electrolytic capacitor
10/24/2006	US7125763 Silicided buried bitline process for a non-volatile memory cell
10/24/2006	US7125762 Compensating the workfunction of a metal gate transistor for abstraction by the gate dielectric layer
10/24/2006	US7125761 Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
10/24/2006	US7125760 Method for implementing electro-static discharge protection in silicon-on-insulator devices
10/24/2006	US7125758 Controlling the properties and uniformity of a silicon nitride film by controlling the film forming precursors
10/24/2006	US7125757 Method of manufacturing an array substrate for a liquid crystal display device
10/24/2006	US7125756 Method for fabricating liquid crystal display device
10/24/2006	US7125755 Method and structure for electrostatic discharge protection of photomasks
10/24/2006	US7125753 Self-aligned thin capacitively-coupled thyristor structure
10/24/2006	US7125752 Methods for making microwave circuits including a ground plane
10/24/2006	US7125751 Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions
10/24/2006	US7125750 Leadframe with enhanced encapsulation adhesion
10/24/2006	US7125749 Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
10/24/2006	US7125748 Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask
10/24/2006	US7125747 Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe
10/24/2006	US7125746 Flip-chip sub-assembly, methods of making same and device including same
10/24/2006	US7125745 Multi-chip package substrate for flip-chip and wire bonding
10/24/2006	US7125744 High-frequency module and method for manufacturing the same
10/24/2006	US7125743 Method for reduction of electromagnetic interference in integrated circuit packages
10/24/2006	US7125742 Multi-passivation layer structure for organic thin-film transistors and method for fabricating the same
10/24/2006	US7125741 Rework process of patterned photo-resist layer
10/24/2006	US7125740 Solid-state image pickup device and fabrication method thereof
10/24/2006	US7125739 Method for producing and testing a corrosion-resistant channel in a silicon device
10/24/2006	US7125738 Method of fabricating a photosensitive structure
10/24/2006	US7125737 Robust Group III light emitting diode for high reliability in standard packaging applications
10/24/2006	US7125736 Method of crystallizing a nitride III-V compound semiconductor layer on a sapphire substrate
10/24/2006	US7125735 Method of fabricating semiconductor device
10/24/2006	US7125734 Increased light extraction from a nitride LED
10/24/2006	US7125733 Method for producing an optical emission module having at least two vertically emitting lasers
10/24/2006	US7125732 Semiconductor light emitting device and its manufacturing method
10/24/2006	US7125731 Drop generator for ultra-small droplets
10/24/2006	US7125730 Power supply, a semiconductor making apparatus and a semiconductor wafer fabricating method using the same
10/24/2006	US7125729 Method for opening the plastic housing of an electronic module
10/24/2006	US7125654 Transverse electric-field type liquid crystal display device, process of manufacturing the same, and scan-exposing device
10/24/2006	US7125645 Composite photoresist for pattern transferring
10/24/2006	US7125642 Fluorinated vinyl sulfonate compound for use as monomer
10/24/2006	US7125641 Polymers, resist compositions and patterning process
10/24/2006	US7125584 Dropping a liquid adjusted to be spread into a give amount on a substrate to be processed from a dropping nozzle or dropping nozzles of a dropping unit onto the substrate, and then moving the dropping unit and substrate
10/24/2006	US7125521 Method to solve alignment mark blinded issues and technology for application of semiconductor etching at a tiny area
10/24/2006	US7125496 Etching method using photoresist etch barrier
10/24/2006	US7125477 Contacts for electrochemical processing

1 ... 3245 3246 3247 3248 3249 3250 3251 3252 3253 3254 3255 3256 3257 3258 3259 3260 3261 3262 3263 3264 3265 ... 6590