Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2006
10/25/2006EP1714316A1 Semiconductor package with contact support layer and method to produce the package
10/25/2006EP1714315A2 Nitridation of high-k dielectric films
10/25/2006EP1714314A2 Method for forming a memory structure using a modified surface topography and structure thereof
10/25/2006EP1714313A1 Method for the creation of an integrated electronic circuit and integrated electronic circuit thus obtained
10/25/2006EP1714312A1 A semiconductor device, an electronic device and an electronic apparatus
10/25/2006EP1714311A2 Generating multiple bandgaps using multiple epitaxial layers
10/25/2006EP1714310A1 Method for depositing a conductive carbon material on a semiconductor for forming a schottky contact and semiconductor contact device
10/25/2006EP1714309A1 Device for applying a liquid dopant solution on a wafer
10/25/2006EP1714308A2 Back-contact solar cells and methods for fabrication
10/25/2006EP1714294A1 Nonvolatile memory
10/25/2006EP1714292A1 Non-volatile memory cell using high-k material and inter-gate programming
10/25/2006EP1713952A2 A method and apparatus for forming a high quality low temperature silicon nitride layer
10/25/2006EP1713399A2 Cmut devices and fabrication methods
10/25/2006EP1576671A4 Growth of planar, non-polar a-plane gallium nitride by hydride vapor phase epitaxy
10/25/2006EP1568069A4 Active matrix backplane for controlling controlled elements and method of manufacture thereof
10/25/2006EP1520299B1 Set of integrated capacitor arrangements, especially integrated grid capacitors
10/25/2006EP1514234B1 Tape manufacturing
10/25/2006EP1509796B1 Laser production and product qualification via accelerated life testing based on statistical modeling
10/25/2006EP1481284A4 Method of passivating of low dielectric materials in wafer processing
10/25/2006EP1436670A4 Determination of center of focus by cross-section analysis
10/25/2006EP1423856B1 Non-volatile memory device
10/25/2006EP1415335B1 Use of diverse materials in air-cavity packaging of electronic devices
10/25/2006EP1414050B1 Method for producing nanocomposite magnet using atomizing method
10/25/2006EP1363745B1 Atomizer
10/25/2006EP1328571B1 A process for preparing organic silicate polymer
10/25/2006EP1208604B1 Method for producing a semiconductor diode
10/25/2006EP1110240B1 Process for preparing an ideal oxygen precipitating silicon wafer
10/25/2006EP0916154B1 Double window exhaust arrangement for wafer plasma processor
10/25/2006EP0860024A4 Circuit structure having a flip-mounted matrix of devices
10/25/2006CN2831433Y Plane surrounded salient point encapsulation structure of integrated circuit or discrete component
10/25/2006CN2831432Y Plane lined salient point encapsulation structure of integrated circuit or discrete component
10/25/2006CN2831431Y Plane array salient point encapsulation structure of integrated circuit or discrete component
10/25/2006CN2831430Y Plane salient point combined encapsulation structure of integrated circuit or discrete component
10/25/2006CN2831419Y Hole-like conducting structure having compensation area on reference plane
10/25/2006CN2831418Y Wafer encapsulator
10/25/2006CN1853451A Method for manufacturing an electronic module
10/25/2006CN1853280A Systems and methods having a metal-semiconductor-metal (MSM) photodetector with buried oxide layer
10/25/2006CN1853277A Method for manufacturing field effect semiconductor device
10/25/2006CN1853275A 半导体装置 Semiconductor device
10/25/2006CN1853274A Semiconductor device and process for manufacturing the same
10/25/2006CN1853273A 半导体装置 Semiconductor device
10/25/2006CN1853271A Method and apparatus for a dual substrate package
10/25/2006CN1853267A Method for the manufacture of a non-volatile memory device and memory device thus obtained
10/25/2006CN1853266A Method and apparatus for fabricating CMOS field effect transistors
10/25/2006CN1853265A Method of detaching a semiconductor layer
10/25/2006CN1853264A System and method for integrating in-situ metrology within a wafer process
10/25/2006CN1853263A Designs and methods for conductive bumps
10/25/2006CN1853262A Process and integration scheme for fabricating conductive components through-vias and semiconductor components including conductive through-wafer vias
10/25/2006CN1853261A Fabrication of single or multiple gate field plates
10/25/2006CN1853260A Semiconductor structure with different lattice constant materials and method for forming the same
10/25/2006CN1853259A Method of substrate processing and apparatus for substrate processing
10/25/2006CN1853258A Memory cell structure having nitride layer with reduced charge loss and method for fabricating same
10/25/2006CN1853257A Improved method of forming openings in an organic resin material
10/25/2006CN1853254A Method and apparatus for improved baffle plate
10/25/2006CN1853241A Methods for identifying non-volatile memory elements with poor subthreshold slope or weak transconductance
10/25/2006CN1853141A Compound for resist and radiation-sensitive composition
10/25/2006CN1853140A Positive photoresist composition and method of forming resist pattern
10/25/2006CN1853004A Apparatus and method of detecting the electroless deposition endpoint
10/25/2006CN1852845A Substrate containing case
10/25/2006CN1852786A Polishing cloth, polishing cloth processing method, and substrate manufacturing method using same
10/25/2006CN1852772A Ultaviolet curing processes for advanced low-k materials
10/25/2006CN1852652A Metal box-lid connection device for shielding
10/25/2006CN1852630A Plasma exciting method
10/25/2006CN1852629A Plasma etching device
10/25/2006CN1852628A Radio-frequency starting control method for etching apparatus
10/25/2006CN1852627A Plasma-reaction-chamber control system assembling box
10/25/2006CN1851992A Method for preventing vertical-cavity-face emitting semiconductor laser from cracking while wet oxidation
10/25/2006CN1851946A Vertical-structure non-polarized gallium substrate device and side epitaxial growth method
10/25/2006CN1851945A Packing substrate structure of optical diode and preparing method
10/25/2006CN1851944A Conductive non-polarized composite gallium nitride substrate lining and production method
10/25/2006CN1851943A Non-polarized composite gallium nitride substrate lining and production method
10/25/2006CN1851938A Epoxy-glue packing method for low-temperature infrared detector and special device
10/25/2006CN1851930A Partial consumption SOI MOS transistor and making method
10/25/2006CN1851928A Method for modulating carrying-performance nano-grade field effect transistor using dipale effect
10/25/2006CN1851927A Low-capacitance over-voltage protector and production technology
10/25/2006CN1851926A Polysilicon film with smooth surface and mfg. method
10/25/2006CN1851924A Organic electro-exciting light-emitting display and producing method
10/25/2006CN1851922A Semiconductor device and method for manufacturing the same
10/25/2006CN1851919A Capacitor of high-performance metal/insulator/metal structure and preparing method
10/25/2006CN1851917A Semiconductor device and method for producing the same
10/25/2006CN1851916A Flat-face saliant-point type packing base-board for electronic device and making method thereof
10/25/2006CN1851915A Flat-face saliant-point type packing base-board for integrated circuit or discrete device
10/25/2006CN1851906A Method for making base-board of liquid crystal display
10/25/2006CN1851905A Active element array base-board and mfg. method
10/25/2006CN1851904A Technology method of anti-ESD integrated SOI LIGBT device unit
10/25/2006CN1851903A Multi-bit non-volatile memory device having a dual-gate and method of manufacturing the same, and method of multi-bit cell operation
10/25/2006CN1851902A CMOS image sensor pixel with smile structure under transfer gate
10/25/2006CN1851901A Method for making organic light-emitting-diode panel
10/25/2006CN1851900A Making method of adopting phase-change to realizing strain silicon on insulator
10/25/2006CN1851899A Lifting apparatus with function of regulating length used for semiconductor apparatus
10/25/2006CN1851898A Thimble device
10/25/2006CN1851897A Electrostatic chuck
10/25/2006CN1851896A Electrostatic chuck
10/25/2006CN1851895A Static chuck system capable of controlling temperature partitionedly
10/25/2006CN1851894A Static chuck
10/25/2006CN1851893A System for eliminating static
10/25/2006CN1851892A Vacuum mechanical-arm
10/25/2006CN1851891A Double staight-liue motor redundant synchronous-driven T-shape operating table
10/25/2006CN1851890A Platform vacuum air-channel system with flow-control and controlling method
10/25/2006CN1851889A Chip oriented gap-intormation fetching circuit