| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/24/2008 | WO2008011296A3 Process and system for quality management and analysis of via drilling |
| 04/24/2008 | WO2008005161A3 Semiconductor assemblies and manufacturing methods thereof |
| 04/24/2008 | WO2007150032A3 Solderability improvement method for leaded semiconductor package |
| 04/24/2008 | WO2007149720A3 Semiconductive device having resist poison aluminum oxide barrier and method of manufacture |
| 04/24/2008 | WO2007143008A3 Semiconductor having improved gate-to-drain breakdown voltage |
| 04/24/2008 | WO2007140288A3 Formation of improved soi substrates using bulk semiconductor wafers |
| 04/24/2008 | WO2007139765A3 Semiconductor-on-diamond devices and associated methods |
| 04/24/2008 | WO2007133806A3 Wafer level semiconductor chip packages and methods of making the same |
| 04/24/2008 | WO2007133271A3 Methods for oriented growth of nanowires on patterned substrates |
| 04/24/2008 | WO2007130148A3 Method of fabricating reduced subthreshold leakage current submicron nfet's with high iii/v ratio material |
| 04/24/2008 | WO2007126679A3 Heterojunction device comprising a semiconductor and a resistivity-switching oxide or nitride |
| 04/24/2008 | WO2007098071A3 Process tuning gas injection from the substrate edge |
| 04/24/2008 | WO2007042797A8 Positive displacement pumping chamber |
| 04/24/2008 | US20080098203 Apparatus, method, system and executable module for configuration and operation of adaptive integrated circuitry havingf fixed, application specific computational elements |
| 04/24/2008 | US20080097647 Liquid processing apparatus, liquid processing method, computer program, and storage medium |
| 04/24/2008 | US20080097641 Interconnect structure of semiconductor integrated circuit, and design method and device therefor |
| 04/24/2008 | US20080097627 Monitoring method of processing state and processing unit |
| 04/24/2008 | US20080096475 Polishing Composition and Polishing Method |
| 04/24/2008 | US20080096396 Methods of Forming Low Hydrogen Concentration Charge-Trapping Layer Structures for Non-Volatile Memory |
| 04/24/2008 | US20080096395 Producing Method of Semiconductor Device |
| 04/24/2008 | US20080096394 Gate dielectric layers and methods of fabricating gate dielectric layers |
| 04/24/2008 | US20080096393 Apparatus and method of etching a semiconductor substrate |
| 04/24/2008 | US20080096392 Ashing system |
| 04/24/2008 | US20080096391 Method of fabricating semiconductor device having fine contact holes |
| 04/24/2008 | US20080096390 chemical mechanical polishing composition; abrasive silica particles, hydrogen peroxide, halogen compound, and benzotriazole; tantalum and copper |
| 04/24/2008 | US20080096389 Copper damascene chemical mechanical polishing (CMP) for thin film head writer fabrication |
| 04/24/2008 | US20080096388 Planarization method using hybrid oxide and polysilicon cmp |
| 04/24/2008 | US20080096387 Method for removing photoresist layer and method of forming opening |
| 04/24/2008 | US20080096386 Method of forming a phase-changeable layer and method of manufacturing a semiconductor memory device using the same |
| 04/24/2008 | US20080096385 Slurry composition for forming tungsten pattern and method for manufacturing semiconductor device using the same |
| 04/24/2008 | US20080096384 Method of forming damascene filament wires |
| 04/24/2008 | US20080096383 Method of manufacturing a semiconductor device with multiple dielectrics |
| 04/24/2008 | US20080096382 Method for producing an integrated circuit including a connection contact on a semiconductor body |
| 04/24/2008 | US20080096381 Atomic layer deposition process for iridium barrier layers |
| 04/24/2008 | US20080096380 Low-k interconnect structures with reduced RC delay |
| 04/24/2008 | US20080096379 Flip chip metallization method and devices |
| 04/24/2008 | US20080096378 Contact structure and method of forming the same |
| 04/24/2008 | US20080096377 Semiconductor device and method for forming the same |
| 04/24/2008 | US20080096376 Transparent zinc oxide electrode having a graded oxygen content |
| 04/24/2008 | US20080096375 Method for Making Memory Cell Device |
| 04/24/2008 | US20080096374 Selective removal of rare earth based high-k materials in a semiconductor device |
| 04/24/2008 | US20080096373 Fabrication of ccd image sensors using single layer polysilicon |
| 04/24/2008 | US20080096372 Patterning of doped poly-silicon gates |
| 04/24/2008 | US20080096371 Process For Producing P-Doped and Epitaxially Coated Semiconductor Wafers From Silicon |
| 04/24/2008 | US20080096370 Method of manufacturing dual orientation wafers |
| 04/24/2008 | US20080096369 Apparatus and method for high-throughput chemical vapor deposition |
| 04/24/2008 | US20080096368 Wafer processing method |
| 04/24/2008 | US20080096367 Method for Laser Dicing of a Substrate |
| 04/24/2008 | US20080096366 Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device |
| 04/24/2008 | US20080096365 Permanent wafer bonding using metal alloy preform discs |
| 04/24/2008 | US20080096364 Conformal liner for gap-filling |
| 04/24/2008 | US20080096363 High Dielectric Constant Materials |
| 04/24/2008 | US20080096362 Plasma display panel and manufacturing method of the same |
| 04/24/2008 | US20080096361 Structure for realizing integrated circuit having schottky diode and method of fabricating the same |
| 04/24/2008 | US20080096360 Semiconductor wafer suitable for forming a semiconductor junction diode device and method of forming same |
| 04/24/2008 | US20080096359 Method of determining angle misalignment in beam line ion implanters |
| 04/24/2008 | US20080096358 Method of fabricating semiconductor device having reduced contact resistance |
| 04/24/2008 | US20080096357 Method for manufacturing a memory device |
| 04/24/2008 | US20080096356 Substrate Having Silicon Germanium Material and Stressed Silicon Nitride Layer |
| 04/24/2008 | US20080096355 Transistor structure of memory device and method for fabricating the same |
| 04/24/2008 | US20080096354 Vertical MOS transistor with embedded gate and its fabrication process |
| 04/24/2008 | US20080096353 Semiconductor device having a recessed gate and asymmetric dopant regions and method of manufacturing the same |
| 04/24/2008 | US20080096352 Method of forming a semiconductor memory device and semiconductor memory device |
| 04/24/2008 | US20080096351 Memory device and method of manufacturing the same |
| 04/24/2008 | US20080096350 Nonvolatile memory device and fabrication method |
| 04/24/2008 | US20080096349 Method of fabricating a nonvolatile memory device |
| 04/24/2008 | US20080096348 Contacts for semiconductor devices |
| 04/24/2008 | US20080096347 Methods of forming electronic devices including electrodes with insulating spacers thereon |
| 04/24/2008 | US20080096346 Method for Preparing a Trench Capacitor Structure |
| 04/24/2008 | US20080096345 maximize the nanowire surface area while providing mechanical support; large surface area and nanospaces between cathodes and anodes that significantly improve electrochemical performance; nanowire shell having nanowire connected to bottom electrode top surface; nanowire sleeves filled with electrolyte |
| 04/24/2008 | US20080096344 Method for Manufacturing a Resistor Random Access Memory with a Self-Aligned Air Gap insulator |
| 04/24/2008 | US20080096343 Fabricating method of cmos |
| 04/24/2008 | US20080096342 Cmos circuits including a passive element having a low end resistance |
| 04/24/2008 | US20080096341 Method for Manufacturing a Resistor Random Access Memory with Reduced Active Area and Reduced Contact Areas |
| 04/24/2008 | US20080096340 Method of fabricating a nonvolatile memory device |
| 04/24/2008 | US20080096339 Cmos devices with hybrid channel orientations and method for fabricating the same |
| 04/24/2008 | US20080096338 Methods and devices employing metal layers in gates to introduce channel strain |
| 04/24/2008 | US20080096337 Disposable semiconductor device spacer with high selectivity to oxide |
| 04/24/2008 | US20080096336 Method of forming integrated circuit devices having n-MOSFET and p-MOSFET transistors with elevated and silicided source/drain structures |
| 04/24/2008 | US20080096335 SiC metal semiconductor field-effect transistors and methods for producing same |
| 04/24/2008 | US20080096334 Semiconductor device manufacturing method and semiconductor device using the same |
| 04/24/2008 | US20080096333 Method of manufacturing a thin film transistor substrate and stripping composition |
| 04/24/2008 | US20080096332 Method of manufacturing a thin-film transistor substrate |
| 04/24/2008 | US20080096331 Method for fabricating high compressive stress film and strained-silicon transistors |
| 04/24/2008 | US20080096330 High-performance cmos soi devices on hybrid crystal-oriented substrates |
| 04/24/2008 | US20080096329 Method of manufacturing thin film device, electro-optic device, and electronic instrument |
| 04/24/2008 | US20080096328 Nonvolatile memory devices and methods of forming the same |
| 04/24/2008 | US20080096327 Novel monolithic, combo nonvolatile memory allowing byte, page and block write with no disturb and divided-well in the cell array using a unified cell structure and technology with a new scheme of decoder and layout |
| 04/24/2008 | US20080096326 Method for Making Advanced Smart Cards With Integrated Electronics Using Isotropic Thermoset Adhesive Materials With High Quality Exterior Surfaces |
| 04/24/2008 | US20080096325 Chip packaging process |
| 04/24/2008 | US20080096324 Electronic assemblies having a low processing temperature |
| 04/24/2008 | US20080096323 Integrated circuit die/package interconnect |
| 04/24/2008 | US20080096322 Manufacturing method of semiconductor chip |
| 04/24/2008 | US20080096321 Semiconductor chip package manufacturing method and structure thereof |
| 04/24/2008 | US20080096320 High density chip packages, methods of forming, and systems including same |
| 04/24/2008 | US20080096319 Sawn power package and method of fabricating same |
| 04/24/2008 | US20080096318 Method of connecting carrier tapes and tcp mounting apparatus used therefor |
| 04/24/2008 | US20080096317 Method for producing portable memory devices |
| 04/24/2008 | US20080096316 Stacked Die in Die BGA Package |
| 04/24/2008 | US20080096315 Stacked chip package and method for forming the same |