Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2008
04/17/2008US20080090404 Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same
04/17/2008US20080090403 Apparatus and method forming a contact to silicide and a contact to a contact
04/17/2008US20080090402 Densifying surface of porous dielectric layer using gas cluster ion beam
04/17/2008US20080090401 Independently addressable interdigitated nanowires
04/17/2008US20080090400 Self-aligned in-contact phase change memory device
04/17/2008US20080090399 Electrode for implantable device
04/17/2008US20080090398 Method for Manufacturing a Structure in a Semiconductor Device and a Structure in a Semiconductor Device
04/17/2008US20080090397 Nonplanar transistors with metal gate electrodes
04/17/2008US20080090396 Light exposure apparatus and method for making semiconductor device formed using the same
04/17/2008US20080090395 Method for producing p-type group III nitride semiconductor and method for producing electrode for p-type group III nitride semiconductor
04/17/2008US20080090394 forming a heat resistant semiconductor in mild reaction condition and can be easily adopted in large scale manufacturing; all chemicals involved are environmentally benign; starting zinc chloride or zinc acetate in ethylene glycol solvent with tetramethylammonium hydroxide
04/17/2008US20080090393 Ultra shallow junction with rapid thermal anneal
04/17/2008US20080090392 Technique for Improved Damage Control in a Plasma Doping (PLAD) Ion Implantation
04/17/2008US20080090391 Method for manufacturing semiconductor device
04/17/2008US20080090390 Method for producing ZnTe system compound semiconductor single crystal, ZnTe system compound semiconductor single crystal, and semiconductor device
04/17/2008US20080090389 Manufacturing method of semiconductor device and substrate processing apparatus
04/17/2008US20080090388 Method of fabricating semiconductor device and method for fabricating electronic device
04/17/2008US20080090387 Method of making semiconductor element
04/17/2008US20080090386 Method for producing ZnTe system compound semiconductor single crystal, ZnTe system compound semiconductor single crystal, and semiconductor device
04/17/2008US20080090385 Composite material including nanocrystals and methods of making
04/17/2008US20080090384 Manufacturing Method For Simox Substrate
04/17/2008US20080090383 Method for manufacturing SiC semiconductor device
04/17/2008US20080090382 Substrate dividing method
04/17/2008US20080090381 Laser processing method for gallium arsenide wafer
04/17/2008US20080090380 Temporary Wafer Bonding Method for Semiconductor Processing
04/17/2008US20080090379 Nitridation of STI Fill Oxide to Prevent the Loss of STI Fill Oxide During Manufacturing Process
04/17/2008US20080090378 Method of fabricating semiconductor device
04/17/2008US20080090377 Laser scribe on front side of a semiconductor wafer
04/17/2008US20080090376 Method of fabricating semiconductor device
04/17/2008US20080090375 Method for manufacturing a semiconductor device including a stacked capacitor
04/17/2008US20080090374 Methods of Forming Capacitors
04/17/2008US20080090373 Fabrication method of trench capacitor
04/17/2008US20080090372 Method of manufacturing coil
04/17/2008US20080090371 Semiconductor apparatus including a thin-metal-film resistor element and a method of manufacturing the same
04/17/2008US20080090370 Post-silicide spacer removal
04/17/2008US20080090369 Method of manufacturing semiconductor device
04/17/2008US20080090368 Method for forming offset spacers for semiconductor device arrangements
04/17/2008US20080090367 Field effect transistor with thin gate electrode and method of fabricating same
04/17/2008US20080090366 Hybrid SOI-Bulk Semiconductor Transistors
04/17/2008US20080090365 Electrically erasable programmable read only memory (eeprom) cell
04/17/2008US20080090364 Semiconductor device and its manufacture method
04/17/2008US20080090363 Method of manufacturing semiconductor device
04/17/2008US20080090362 Methods of fabricating field effect transistors having multiple stacked channels
04/17/2008US20080090361 Corner dominated trigate field effect transistor
04/17/2008US20080090360 Methods for fabricating multiple finger transistors
04/17/2008US20080090359 Semiconductor device having a p-mos transistor with source-drain extension counter-doping
04/17/2008US20080090358 Method of fabricating semiconductor integrated circuit device
04/17/2008US20080090357 Shallow source MOSFET
04/17/2008US20080090356 Method of manufacturing integrated circuit device including recessed channel transistor
04/17/2008US20080090355 Manufacturing method of flash memory
04/17/2008US20080090354 Method of Manufacturing a Non-Volatile Memory Device
04/17/2008US20080090353 Method of Manufacturing Non-Volatile Memory Device
04/17/2008US20080090352 Nonvolatile memory device and method of manufacturing the same
04/17/2008US20080090351 Fabricating non-volatile memory with dual voltage select gate structure
04/17/2008US20080090350 Strained semiconductor device and method of making same
04/17/2008US20080090349 Different embedded strain layers in pmos and nmos transistors and a method of forming the same
04/17/2008US20080090348 Gate-assisted silicon-on-insulator on bulk wafer and its application to floating body cell memory and transistors
04/17/2008US20080090347 Lateral power MOSFET with high breakdown voltage and low on-resistance
04/17/2008US20080090346 Reliable High-Voltage Junction Field Effect Transistor and Method of Manufacturing Therefor
04/17/2008US20080090345 Method for fabrication of devices in a multi-layer structure
04/17/2008US20080090344 Semiconductor device and manufacturing method thereof
04/17/2008US20080090343 Method for manufacturing thin film transistor array panel
04/17/2008US20080090342 Method of manufacturing a thin film transistor substrate
04/17/2008US20080090341 Method for manufacturing display device, and etching apparatus
04/17/2008US20080090340 Method for selective laser crystallization and display panel fabricated by using the same
04/17/2008US20080090339 Method for Forming Inter-Poly Dielectric in Shielded Gate Field Effect Transistor
04/17/2008US20080090338 Flexible substrate with electronic devices and traces
04/17/2008US20080090337 Electrically actuated switch
04/17/2008US20080090336 Method for fabricating heat dissipating package structure
04/17/2008US20080090335 Circuit module and manufacturing method thereof
04/17/2008US20080090334 Method for Manufacturing Semiconductor Device
04/17/2008US20080090333 Microelectronic packages fabricated at the wafer level and methods therefor
04/17/2008US20080090332 Process For Fabricating Electronic Components Using Liquid Injection Molding
04/17/2008US20080090331 Semiconductor device manufacturing method and manufacturing apparatus
04/17/2008US20080090330 Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof
04/17/2008US20080090329 Stacked Modules and Method
04/17/2008US20080090328 Method for producing ZnTe system compound semiconductor single crystal, ZnTe system compound semiconductor single crystal, and semiconductor device
04/17/2008US20080090327 Method for producing ZnTe system compound semiconductor single crystal, ZnTe system compound semiconductor single crystal, and semiconductor device
04/17/2008US20080090324 Forming sublithographic heaters for phase change memories
04/17/2008US20080090323 Image sensor and method of fabricating the same
04/17/2008US20080090322 Method of forming an implantable electronic device chip level hermetic and biocompatible electronics package using SOI wafers
04/17/2008US20080090321 Isolation method for low dark current imager
04/17/2008US20080090320 Self sealed MEMS device
04/17/2008US20080090319 Infrared photodiodes and sensor arrays with improved passivation layers and methods of manufacture
04/17/2008US20080090318 Method and apparatus for forming a photodiode
04/17/2008US20080090316 Method for manufacture of optically pumped, surface-emitting semiconductor laser device
04/17/2008US20080090315 Method for manufacturing semiconductor optical device
04/17/2008US20080090314 Semiconductor device and manufacturing method of the same
04/17/2008US20080090313 Manufacturing device of semiconductor package and manufacturing method of semiconductor package
04/17/2008US20080090312 LITHOGRAPHY ALIGNMENT SYSTEM AND METHOD USING nDSE-BASED FEEDBACK CONTROL
04/17/2008US20080090311 Dipping detecting device for fabricating a semiconductor device
04/17/2008US20080090310 Substrate processing apparatus and substrate processing termination detection method
04/17/2008US20080090309 Controlled annealing method
04/17/2008US20080090308 Semiconductor device alignment mark having a plane pattern and semiconductor device
04/17/2008US20080090307 Bottom electrode for MRAM device and method to fabricate it
04/17/2008US20080090101 Mixing a lower alcohol, a polyethylene glycol, a complexing agent and water with a higher alcohol and a zirconium, aluminium, titanium, tantalum or yttrium alkoxide; hydrolyzing the metal alkoxide to a metal oxide and an alcohol; adding a medium alcohol to the concentrate
04/17/2008US20080090094 Interlayer dielectric film
04/17/2008US20080090085 Adhesive layer of caprolactone-modified epoxy resin and a melamine/isocyanuric acid adduct and a stretchable backing layer; dicing of a semiconductor and die-bonding of the diced semiconductor chip
04/17/2008US20080090001 Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus
04/17/2008US20080089774 A method and apparatus for semconductor processing
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