| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/22/2008 | US7361287 Method for etching structures in an etching body by means of a plasma |
| 04/22/2008 | US7361285 Method for fabricating cliche and method for forming pattern using the same |
| 04/22/2008 | US7361234 Photolithographic stepper and/or scanner machines including cleaning devices and methods of cleaning photolithographic stepper and/or scanner machines |
| 04/22/2008 | US7361230 Substrate processing apparatus |
| 04/22/2008 | US7361229 Device for deposition with chamber cleaner and method for cleaning chamber |
| 04/22/2008 | US7361228 Showerheads for providing a gas to a substrate and apparatus |
| 04/22/2008 | US7361016 Temperature control assembly for use in etching processes and an associated retrofit method |
| 04/22/2008 | US7360985 Wafer processing apparatus including clean box stopping mechanism |
| 04/22/2008 | US7360981 Datum plate for use in installations of substrate handling systems |
| 04/22/2008 | US7360953 Light guiding device |
| 04/22/2008 | US7360907 Micro corner cube array, method of making the micro corner cube array, and display device |
| 04/22/2008 | US7360679 Method for the production of a soldered connection |
| 04/22/2008 | US7360546 Cleaning apparatus for semiconductor wafer |
| 04/22/2008 | US7360463 Process condition sensing wafer and data analysis system |
| 04/22/2008 | US7360346 Purging system and purging method for the interior of a portable type hermetically sealed container |
| 04/22/2008 | US7360322 Non-contacting conveyance equipment |
| 04/22/2008 | US7360309 Method of manufacturing microchannel heat exchangers |
| 04/22/2008 | US7360273 Substrate cleaning device and substrate processing facility |
| 04/17/2008 | WO2008045887A1 Die separation |
| 04/17/2008 | WO2008045826A2 Method of arranging dies in a wafer for easy inkless partial wafer process |
| 04/17/2008 | WO2008045764A1 De-fluoridation process |
| 04/17/2008 | WO2008045707A1 Integrated circuit with back side conductive paths |
| 04/17/2008 | WO2008045672A2 Method for fabricating conducting plates for a high-q mim capacitor |
| 04/17/2008 | WO2008045669A1 High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach |
| 04/17/2008 | WO2008045593A2 Dual-gate memory device and optimization of electrical interaction between front and back gates to enable scaling |
| 04/17/2008 | WO2008045591A2 Low power rf tuning using optical and non-reflected power methods |
| 04/17/2008 | WO2008045589A2 Dual-gate device and method |
| 04/17/2008 | WO2008045422A2 Edge connect wafer level stacking |
| 04/17/2008 | WO2008045202A2 Method to deposit conformal low temperature sio2 |
| 04/17/2008 | WO2008044843A1 Nanoscale multi-junction quantum dot device and fabrication method thereof |
| 04/17/2008 | WO2008044840A2 Machining apparatus and semiconductor strip machining system using the same |
| 04/17/2008 | WO2008044828A1 Single-electron logic transistor with dual gates operating at room temperature and the method thereof |
| 04/17/2008 | WO2008044803A1 Method for manufacturing metal structure and carbon nano tube by using immersion plating |
| 04/17/2008 | WO2008044801A1 Semiconductor device and method for manufacturing the same |
| 04/17/2008 | WO2008044786A1 Machining end point detecting method, grinding method, and grinder |
| 04/17/2008 | WO2008044778A1 Method for fabricating semiconductor chip |
| 04/17/2008 | WO2008044757A1 Conductive film forming method, thin film transistor, panel with thin film transistor and thin film transistor manufacturing method |
| 04/17/2008 | WO2008044741A1 Resist composition for use in lithography method utilizing electron beam, x-ray or euv light |
| 04/17/2008 | WO2008044706A1 Sheet-like material conveying device |
| 04/17/2008 | WO2008044655A1 Expander unit, and equipment for manufacturing electronic component including this expander unit |
| 04/17/2008 | WO2008044633A1 Plasma etching device and plasma etching method |
| 04/17/2008 | WO2008044602A1 Method for forming thin film and multilayer structure of thin film |
| 04/17/2008 | WO2008044577A1 Film forming method and film forming apparatus |
| 04/17/2008 | WO2008044559A1 Semiconductor device |
| 04/17/2008 | WO2008044537A1 Semiconductor package and method for producing semiconductor package |
| 04/17/2008 | WO2008044495A1 Cover body and substrate receiving container |
| 04/17/2008 | WO2008044479A1 Electron beam lithography system and electron beam lithography |
| 04/17/2008 | WO2008044478A1 Organic ruthenium compound for chemical vapor deposition, and chemical vapor deposition method using the organic ruthenium compound |
| 04/17/2008 | WO2008044477A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device |
| 04/17/2008 | WO2008044394A1 Position adjusting method for laser beam emitting device |
| 04/17/2008 | WO2008044381A1 Vibration sensor and method for manufacturing the vibration sensor |
| 04/17/2008 | WO2008044357A1 Connected structure and method for manufacture thereof |
| 04/17/2008 | WO2008044340A1 Substrate transfer apparatus |
| 04/17/2008 | WO2008044327A1 Method for protecting wafer circuit surface and method for reducing wafer thickness |
| 04/17/2008 | WO2008044326A1 Positive- or negative-working chemical amplification-type photoresist composition for low-temperature dry etching, and method for photoresist pattern formation using the same |
| 04/17/2008 | WO2008044319A1 Euv light generating apparatus and euv exposure apparatus |
| 04/17/2008 | WO2008044181A1 Method of forming an interconnect structure |
| 04/17/2008 | WO2008043876A1 Method for measuring the active koh concentration in a koh etching process |
| 04/17/2008 | WO2008043320A1 Method for generating a defined shrinkage behaviour of a section of a ceramic green film |
| 04/17/2008 | WO2008030371A3 Implant at shallow trench isolation corner |
| 04/17/2008 | WO2008028660A3 Device with pb-based high-k dielectric thin-film capacitor comprising pb-donating layers |
| 04/17/2008 | WO2008027473A3 A transistor having a locally provided metal silicide region in contact areas and a method of forming the transistor |
| 04/17/2008 | WO2008024932A3 Hotwall reactor and method for reducing particle formation in gan mocvd |
| 04/17/2008 | WO2008024572A3 Superjunction trench device and method |
| 04/17/2008 | WO2008023232A3 Buffer station for stocker system |
| 04/17/2008 | WO2007148836A3 Electrode bonding method and part mounting apparatus |
| 04/17/2008 | WO2007123762A3 Damage assessment of a wafer using optical metrology |
| 04/17/2008 | WO2007117844A3 Semiconductor die packages using thin dies and metal substrates |
| 04/17/2008 | WO2007117829A3 Method for bonding a semiconductor substrate to a metal substrate |
| 04/17/2008 | WO2007112187A3 High density trench fet with integrated schottky diode and method of manufacture |
| 04/17/2008 | WO2007109487A3 Semiconductor device incorporating fluorine into gate dielectric |
| 04/17/2008 | WO2007109252A3 Method of plasma processing with in-situ monitoring and process parameter tuning |
| 04/17/2008 | WO2007094984A3 SEALED ELASTOMER BONDED Si ELECTRODES AND THE LIKE FOR REDUCED PARTICLE CONTAMINATION IN DIELECTRIC ETCH |
| 04/17/2008 | WO2007082933A3 Micromechanical placement system, and corresponding device |
| 04/17/2008 | WO2006012626A3 Memory devices, transistors, memory cells, and methods of making same |
| 04/17/2008 | US20080091979 Semiconductor memory device and test method |
| 04/17/2008 | US20080090988 Method for handling polysilazane or polysilazane solution, polysilazane or polysilazane solution, and method for producing semiconductor device |
| 04/17/2008 | US20080090501 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
| 04/17/2008 | US20080090500 Process for reducing dishing and erosion during chemical mechanical planarization |
| 04/17/2008 | US20080090425 Two-step post nitridation annealing for lower EOT plasma nitrided gate dielectrics |
| 04/17/2008 | US20080090424 Method of forming an oxinitride layer |
| 04/17/2008 | US20080090423 Gas switching during an etch process to modulate the characteristics of the etch |
| 04/17/2008 | US20080090422 Etching method |
| 04/17/2008 | US20080090421 Forming a sacrificial layer in order to realise a suspended element |
| 04/17/2008 | US20080090420 selectively etching anti-reflective multilayer using photoresist pattern as an etching mask, forming a fine pattern in a peripheral circuit region; improve the data processing speed |
| 04/17/2008 | US20080090419 Method of forming a hard mask and method of forming a fine pattern of semiconductor device using the same |
| 04/17/2008 | US20080090418 Method for forming fine patterns of a semiconductor device using double patterning |
| 04/17/2008 | US20080090417 showerhead electrode assembly for processing semiconductor substrates; prevent aluminum fluoride formation; gas passages are positioned and sized such that they are misaligned at ambient temperature, concentric at high temperature; non-uniform shear stresses |
| 04/17/2008 | US20080090416 Methods of etching polysilicon and methods of forming pluralities of capacitors |
| 04/17/2008 | US20080090415 Substrate processing apparatus, method of manufacturing a semiconductor device, and method of forming a thin film on metal surface |
| 04/17/2008 | US20080090414 Manufacture of electroless cobalt deposition compositions for microelectronics applications |
| 04/17/2008 | US20080090413 Wafer via formation |
| 04/17/2008 | US20080090412 Pre-silicide spacer removal |
| 04/17/2008 | US20080090411 Method of manufacturing a semiconductor device |
| 04/17/2008 | US20080090410 Semiconductor device having oxidized metal film and manufacture method of the same |
| 04/17/2008 | US20080090409 Method for manufacturing a semiconductor device including interconnections having a smaller width |
| 04/17/2008 | US20080090408 Methods for controlling the profile of a trench of a semiconductor structure |
| 04/17/2008 | US20080090407 Terminal pad structures and methods of fabricating same |
| 04/17/2008 | US20080090406 Via attached to a bond pad utilizing a tapered interconnect |
| 04/17/2008 | US20080090405 Composite solder TIM for electronic package |