Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2008
04/29/2008US7364805 Crystal film, crystal substrate, and semiconductor device
04/29/2008US7364798 Internal member for plasma-treating vessel and method of producing the same
04/29/2008US7364797 Adhesive composition and adhesive film
04/29/2008US7364784 Thin semiconductor package having stackable lead frame and method of manufacturing the same
04/29/2008US7364778 Container for an electronic component
04/29/2008US7364769 Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof
04/29/2008US7364667 Slurry for CMP and CMP method
04/29/2008US7364626 Substrate processing apparatus and substrate processing method
04/29/2008US7364625 Rinsing processes and equipment
04/29/2008US7364624 Wafer handling apparatus and method of manufacturing thereof
04/29/2008US7364623 Confinement ring drive
04/29/2008US7364622 Method and apparatus for fabricating a device, and the device and an electronic equipment
04/29/2008US7364616 Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine
04/29/2008US7364600 Slurry for CMP and method of polishing substrate using same
04/29/2008US7364495 Wafer double-side polishing apparatus and double-side polishing method
04/29/2008US7364414 Fluid pump system
04/29/2008US7364376 Substrate processing apparatus
04/29/2008US7364349 Chemical dilution system for semiconductor device processing system
04/29/2008US7364028 Glass substrate transporting facility
04/29/2008US7363876 Multi-core transformer plasma source
04/29/2008US7363727 Method for utilizing a meniscus in substrate processing
04/29/2008CA2406210C Method of depositing silicon thin film and silicon thin film solar cell
04/29/2008CA2181591C Electrostatic discharge protection of isfet sensors
04/24/2008WO2008049024A1 Methods and apparatus for tuning a set of plasma processing steps
04/24/2008WO2008049019A2 Copper deposition for filling features in manufacture of microelectronic devices
04/24/2008WO2008048985A2 Method of manufacturing integrated deep and shallow trench isolation structures
04/24/2008WO2008048925A2 Wafer via formation
04/24/2008WO2008048862A2 Formation of high quality dielectric films of silicon dioxide for sti: usage of different siloxane-based precursors for harp ii - remote plasma enhanced deposition processes
04/24/2008WO2008048813A1 Non-volatile memory with dual voltage select gate structure
04/24/2008WO2008048812A1 Fabricating non-volatile memory with dual voltage select gate structure
04/24/2008WO2008048786A2 Fabrication of ccd image sensors using single layer polysilicon
04/24/2008WO2008048704A2 Pulsed growth of gan nanowires and applications in group iii nitride semiconductor substrate materials and devices
04/24/2008WO2008048604A1 Quartz guard ring
04/24/2008WO2008048543A1 Upper electrode backing member with particle reducing features
04/24/2008WO2008048518A1 Detachable electrostatic chuck having sealing assembly
04/24/2008WO2008048483A2 Access to one or more levels of material storage shelves by an overhead hoist transport vehicle from a single track position
04/24/2008WO2008048444A1 Quartz guard ring centering features
04/24/2008WO2008048443A1 Methods and apparatus for wet cleaning electrode assemblies for plasma processing apparatuses
04/24/2008WO2008048303A2 Group iii nitride articles and methods for making same
04/24/2008WO2008048302A2 Bulk thermoelectric compositions from coated nanoparticles
04/24/2008WO2008048299A2 Method of synthesizing nanometer scale objects and devices resulting therefrom
04/24/2008WO2008048281A2 Method and system for electrolytic fabrication of atomic clock cells
04/24/2008WO2008048259A2 Wet processing using a fluid meniscus, apparatus and method
04/24/2008WO2008048247A2 Methods of synthesis of nanotubes and uses thereof
04/24/2008WO2008047928A1 Semiconductor device and method for manufacturing the same
04/24/2008WO2008047907A1 Sapphire substrate, nitride semiconductor luminescent element using the sapphire substrate, and method for manufacturing the nitride semiconductor luminescent element
04/24/2008WO2008047905A1 Method of forming resist pattern and negative resist composition
04/24/2008WO2008047900A1 Sputtering film-forming apparatus and backing plate for sputtering film-forming apparatus
04/24/2008WO2008047881A1 Process for producing crystal silicon grain and crystal silicon grain production apparatus
04/24/2008WO2008047845A1 Nitride compound semiconductor transistor and method for manufacturing the same
04/24/2008WO2008047838A1 Ti FILM FORMING METHOD AND STORAGE MEDIUM
04/24/2008WO2008047832A1 Semiconductor device, semiconductor device manufacturing method, and inspection method
04/24/2008WO2008047790A1 Disklike cutting tool and cutting device
04/24/2008WO2008047789A1 Disklike cutting tool and cutting device
04/24/2008WO2008047778A1 Substrate cabinet
04/24/2008WO2008047752A1 Silicon wafer supporting method, heat treatment jig and heat-treated wafer
04/24/2008WO2008047733A1 Near field exposure mask, method of forming resist pattern using the mask, and method of producing device
04/24/2008WO2008047732A1 Fixed jig, chip pickup method and chip pickup apparatus
04/24/2008WO2008047731A1 Chip pickup method and chip pickup apparatus
04/24/2008WO2008047729A1 Resist composition for immersion exposure and method of forming resist pattern
04/24/2008WO2008047726A1 Thin film transistor substrate and display device
04/24/2008WO2008047720A1 Solution for treatment of resist substrate after development processing, and method for treatment of resist substrate using the same
04/24/2008WO2008047719A1 Method for formation of miniaturized pattern and resist substrate treatment solution for use in the method
04/24/2008WO2008047715A1 Method for manufacturing semiconductor device using quadruple-layer laminate
04/24/2008WO2008047708A1 Sheet for die sort and method of transferring chip with adhesive layer
04/24/2008WO2008047704A1 Method for manufacturing electronic device using plasma reactor processing system
04/24/2008WO2008047697A1 Method and jig for holding silicon wafer
04/24/2008WO2008047687A1 Semiconductor device and semiconductor device manufacturing method
04/24/2008WO2008047678A1 Composition for formation of upper layer film, and method for formation of photoresist pattern
04/24/2008WO2008047667A1 Multilayer film for wiring and wiring circuit
04/24/2008WO2008047665A1 Semiconductor device
04/24/2008WO2008047654A1 Composition for formation of film, method for production of patterned film, and insulation film for electronic device
04/24/2008WO2008047641A1 Composition for electrode formation and method for forming electrode by using the composition
04/24/2008WO2008047638A1 Process for semiconductor device production using under-resist film cured by photocrosslinking
04/24/2008WO2008047635A1 Method for manufacturing semiconductor device and semiconductor device
04/24/2008WO2008047631A1 Method for producing long polishing pad
04/24/2008WO2008047627A1 Group iii element nitride substrate, substrate with epitaxial layer, processes for producing these, and process for producing semiconductor element
04/24/2008WO2008047623A1 Chemically amplified positive resist composition for thermal lithography and method for formation of resist pattern
04/24/2008WO2008047610A1 Film for semiconductor, method for producing film for semiconductor, and semiconductor device
04/24/2008WO2008047585A1 Semiconductor device external circuit connection unit structure and its formation method
04/24/2008WO2008047572A1 Oxide material, patterning substrate, pattern forming method, method for producing transfer template for imprint, method for producing recording medium, transfer template for imprint, and recording medium
04/24/2008WO2008047564A1 Semiconductor device manufacturing method and semiconductor device
04/24/2008WO2008047563A1 Electronic element, variable capacitor, micro switch, method for driving micro switch, and mems type electronic element
04/24/2008WO2008047541A1 Film coating apparatus and film coating method
04/24/2008WO2008047536A1 Magnetic memory cell and magnetic random access memory
04/24/2008WO2008047522A1 Silicon carbide semiconductor device and method for fabricating the same
04/24/2008WO2008047520A1 Plasma filming apparatus, and plasma filming method
04/24/2008WO2008047506A1 Vaporizer and film forming apparatus
04/24/2008WO2008047478A1 Method for evaluating semiconductor wafer
04/24/2008WO2008046783A1 Method and apparatus for processing a multiplicity of security documents
04/24/2008WO2008046754A2 Mechanical stopper and method for transporting substrates in automatic placement machines
04/24/2008WO2008046397A1 Ultrasonic bonding device
04/24/2008WO2008046396A1 Ultrasonic bonding device
04/24/2008WO2008046304A1 A cleaning method for use in post etch and ashing a semiconductor wafer
04/24/2008WO2008046147A1 Up and down conversion using quantum dot arrays
04/24/2008WO2008027205A3 Self assembled monolayer for improving adhesion between copper and barrier layer
04/24/2008WO2008027143A3 Semiconductor devices, assemblies and contructions, and methods of forming semiconductor devices, assemblies and constructions
04/24/2008WO2008027090A3 Control of materials and porous magnetic particles
04/24/2008WO2008019076A3 Substrate carrier enclosure
04/24/2008WO2008018936A3 High fidelity nano-structures and arrays for photovoltaics and methods of making the same