| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/17/2008 | US20080087900 Integrated-Type Led And Manufacturing Method Thereof |
| 04/17/2008 | US20080087896 Trench Schottky barrier diode with differential oxide thickness |
| 04/17/2008 | US20080087895 Polysilicon thin film transistor and method of fabricating the same |
| 04/17/2008 | US20080087894 Semiconductor thin film and semiconductor device |
| 04/17/2008 | US20080087893 LCD TFT array plate and fabricating method thereof |
| 04/17/2008 | US20080087891 Semiconductor-on-diamond devices and methods of forming |
| 04/17/2008 | US20080087890 Methods to form dielectric structures in semiconductor devices and resulting devices |
| 04/17/2008 | US20080087889 Method of fabricating an organic electroluminescent device and system of displaying images |
| 04/17/2008 | US20080087888 Semiconductor device and method for manufacturing semiconductor |
| 04/17/2008 | US20080087885 Organic field-effect transistor and method of making same based on polymerizable self-assembled monolayers |
| 04/17/2008 | US20080087877 Nitride Semiconductor Light Emitting Device And Fabrication Method Thereof |
| 04/17/2008 | US20080087876 Method for Fabricating Lateral Semiconductor Device |
| 04/17/2008 | US20080087808 Method and system for controlling beam scanning in an ion implantation device |
| 04/17/2008 | US20080087645 Regeneration method of etching solution, an etching method and an etching system |
| 04/17/2008 | US20080087644 Polishing Composition And Polishing Method |
| 04/17/2008 | US20080087641 Components for a plasma processing apparatus |
| 04/17/2008 | US20080087640 Laser processing apparatus |
| 04/17/2008 | US20080087382 Substrate stage and plasma processing apparatus |
| 04/17/2008 | US20080087319 Method For Metallisation Of A Semiconductor Device |
| 04/17/2008 | US20080087220 Plasma Processing Apparatus and Multi-Chamber System |
| 04/17/2008 | US20080087218 Board processing apparatus and method of fabricating semiconductor apparatus |
| 04/17/2008 | US20080087217 Coating apparatus, thin film forming method, thin film forming apparatus, and semiconductor device manufacturing method, electro-optic device and electronic instrument |
| 04/17/2008 | US20080087215 Method and system of coating polymer solution on a substrate in a solvent saturated chamber |
| 04/17/2008 | US20080087213 Method for fabricating a semiconductor device, method for fabricating an electronic device, and semiconductor fabricating apparatus |
| 04/17/2008 | US20080086950 Cerium oxide abrasive particles, water and acid selected from adipic, pentanedioic, butanedioic, and malonic acid; dispersion stability and removal rate; chemical mechanical polishing |
| 04/17/2008 | US20080086858 Method and apparatus of fabricating a semiconductor device by back grinding and dicing |
| 04/17/2008 | DE19982451B4 Verwendung einer flammenhemmenden Polypropylenzusammensetzung Use of a flame retardant polypropylene composition |
| 04/17/2008 | DE19962702B4 Prüfsockel einer BGA-Vorrichtung A test socket BGA device |
| 04/17/2008 | DE19924182B4 Träger für zu bearbeitende, aufzubewahrende und/oder zu transportierende Halbleiterwafer Support for to be processed, to be stored and / or transported semiconductor wafer |
| 04/17/2008 | DE19918198B4 Struktur eines P-Kanal-Graben-MOSFETs Structure of a P channel trench MOSFET |
| 04/17/2008 | DE19540103B4 Prüfvorrichtung für mittels Prüfwerkzeugen zu prüfende Halbleiter-Wafer Tester for means testing tools to test semiconductor wafers |
| 04/17/2008 | DE112006001550T5 Schlamm für das chemisch-mechanische Polieren von Aluminium Slurry for chemical mechanical polishing of aluminum |
| 04/17/2008 | DE112006001516T5 Feldeffekttransistor mit Ladungsgleichgewicht Field effect transistor with charge balance |
| 04/17/2008 | DE112006001321T5 Verfahren zum Absetzen eines elektronischen Bauteils und Handhabevorrichtung für elektronische Bauteile Method for making an electronic component and handling device for electronic components |
| 04/17/2008 | DE112006000584T5 Integrationsschema für ein vollständig silizdiertes Gate Integration scheme for a fully silizdiertes gate |
| 04/17/2008 | DE112006000465T5 Barriereschichten für leitende Strukturmerkmale Barrier layers for conductive features |
| 04/17/2008 | DE112006000307T5 Halbleitereinrichtung und Verfahren und Vorrichtung zu deren Herstellung A semiconductor device and method and apparatus for the preparation thereof |
| 04/17/2008 | DE112006000148T5 Bauteil mit gestuftem Profil im Quellen/Senken-Bereich Component with stepped profile in the source / drain region |
| 04/17/2008 | DE112005003123T5 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements mit mehreren gestapelten Schichten mit Hybridorientierung A semiconductor device and method of manufacturing a semiconductor device having a plurality of stacked layers with hybrid orientation |
| 04/17/2008 | DE112005003119T5 Verfahren zur Herstellung einer Halbleitereinrichtung mit einem Gate-Dielektrikum mit hohem k und einer Metall-Gateelektrode A method of manufacturing a semiconductor device having a gate dielectric with a high k and a metal gate electrode |
| 04/17/2008 | DE10348007B4 Verfahren zum Strukturieren und Feldeffekttransistoren A method for patterning and field effect transistors |
| 04/17/2008 | DE10346561B4 Verfahren zur Herstellung einer Photomaske mit einer Transparenzeinstellschicht A method for producing a photomask having a Transparenzeinstellschicht |
| 04/17/2008 | DE10345475B4 Nichtflüchtiger integrierter Halbleiterspeicher Non-volatile Integrated semiconductor memory |
| 04/17/2008 | DE10339989B4 Verfahren zur Herstellung eines konformen Abstandselements benachbart zu einer Gateelektrodenstruktur A process for producing a conformal spacer adjacent to a gate electrode structure |
| 04/17/2008 | DE10321457B4 Verfahren zur Herstellung integrierter Schaltungen mit gleichförmigen Silizidsperrschichten A method for manufacturing integrated circuits having uniform Silizidsperrschichten |
| 04/17/2008 | DE102007049481A1 Semiconductor component, has electrical connection established in inner side of semiconductor component by conductor boards, which are arranged in three-dimensional manner such that respective welding positions are provided at boards |
| 04/17/2008 | DE102007047698A1 Vorrichtung und Verfahren zum Verbinden von Komponenten Device and method for connecting components |
| 04/17/2008 | DE102007047594A1 Wafer processing device used in the manufacture of semiconductors comprises a tensioning table for holding the wafer, a cutting unit for cutting the wafer and an orientating unit for orientating a laser beam onto the wafer held on the table |
| 04/17/2008 | DE102007047437A1 Substratbearbeitungsverfahren, Substratbearbeitungseinrichtung, und Speichermedium Substrate processing method, substrate processing apparatus, and storage medium |
| 04/17/2008 | DE102007042359A1 Reflexions-CMOS-Bildsensor und Verfahren zu seiner Herstellung Reflection CMOS image sensor and method for its manufacture |
| 04/17/2008 | DE102007038418A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 04/17/2008 | DE102006060205B3 Substrate's e.g. wafer, plated-through hole and strip conductor producing method, involves producing plated-through hole and strip conductor simultaneously on one side of substrate by further deposition of metal |
| 04/17/2008 | DE102006049432A1 Verfahren zur Herstellung von selbst aggregierenden Monolagen auf Festkörperoberflächen Process for the preparation of self-aggregating monolayers on solid surfaces |
| 04/17/2008 | DE102006048800A1 Wafer-carrier arrangement for use during manufacturing e.g. diode, has carrier layer system with carrier layer, where adhesive strength between system and separation layer is greater than adhesive strength between wafer and separation layer |
| 04/17/2008 | DE102006048799A1 Wafer-carrier arrangement for use during manufacturing e.g. diode, has carrier layer system with carrier layer, where adhesive strength between system and separation layer is greater than adhesive strength between wafer and separation layer |
| 04/17/2008 | DE102006048638A1 New perylene dyes e.g. useful as pigments in inks, paints, lacquers and plastics |
| 04/17/2008 | DE102006048592A1 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls An opto-electronic module and method for producing an optoelectronic module |
| 04/17/2008 | DE102006048586A1 Semiconductor device i.e. vertical double-diffused metal oxide semiconductor power transistor, manufacturing method, involves isolating semiconductor device after application of metal structure on front side of semiconductor wafer |
| 04/17/2008 | DE102006048409A1 Production of layers and/or crystals of group 3 metal nitrides using sublimation comprises producing the metal nitride from a source containing the metal nitride and depositing the metal nitride on a substrate and/or seed crystal |
| 04/17/2008 | DE102006047928A1 Verfahren zur Herstellung mindestens einer porösen Schicht A process for producing at least one porous layer |
| 04/17/2008 | DE102006047739A1 Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen Heat-activated adhesive tape particularly for bonding electronic components and conductor tracks |
| 04/17/2008 | DE102006047388A1 Feldeffekttransistor sowie elektrische Schaltung Field effect transistor and electrical circuit |
| 04/17/2008 | DE102006036585B4 Verfahren und Vorrichtung zum Ermitteln von Messwerten Method and device for determining measured values, |
| 04/17/2008 | DE102006035666B3 Verfahren zum Ausbilden einer Halbleiterstruktur A method of forming a semiconductor structure |
| 04/17/2008 | DE102006023731B4 Halbleiterstruktur und Verfahren zur Herstellung der Halbleiterstruktur Semiconductor structure and method of manufacturing the semiconductor structure |
| 04/17/2008 | DE102004016705B4 Verfahren zur Ausbildung einer Öffnung für einen Kontakt in einem Halbleiterbauelement sowie zugehörige Halbleiterbauelementstruktur A method of forming an opening for a contact in a semiconductor device and associated semiconductor device structure |
| 04/17/2008 | DE102004005502B4 Verfahren zur Herstellung eines MOS-Transistors mit erhöhter Source-/Drain-Struktur A process for producing a MOS transistor with an elevated source / drain structure |
| 04/17/2008 | DE10126296B4 Verfahren zur Herstellung eines elektronischen Bauelements A method of manufacturing an electronic component |
| 04/17/2008 | DE10125345B4 Prüfkontaktsystem mit Planarisierungsmechanismus Prüfkontaktsystem with planarization mechanism |
| 04/17/2008 | CA2666404A1 Connected structure and method for manufacture thereof |
| 04/16/2008 | EP1912484A1 Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
| 04/16/2008 | EP1912298A1 ZnO based compound semiconductor light emitting device and method for manufacturing the same |
| 04/16/2008 | EP1912256A1 Method of manufacturing a thin film transistor substrate |
| 04/16/2008 | EP1912255A2 A stacked thin-film-transistor non-volatile memory device and method for fabricating the same |
| 04/16/2008 | EP1912254A2 Vertical-channel FinFET SONOS memory, manufacturing method thereof and operating method using the same |
| 04/16/2008 | EP1912253A2 Method of forming a dielectric film |
| 04/16/2008 | EP1912252A1 Polysilicon thin film transistor and method of fabricating the same |
| 04/16/2008 | EP1912251A2 Resistor in a wiring layer and manufacturing method of the same |
| 04/16/2008 | EP1912250A1 Adhesive tape cutting method and tape cutting apparatus |
| 04/16/2008 | EP1912246A2 Power supply antenna and power supply method |
| 04/16/2008 | EP1912223A1 Operating techniques for reducing the program and read disturbs of a non-volatile memory |
| 04/16/2008 | EP1912076A2 Method and device for characterising wafers during manufacture of solar cells |
| 04/16/2008 | EP1912054A1 Method for structuring a surface layer |
| 04/16/2008 | EP1911784A1 Silica nanoparticles thermoset resin compositions |
| 04/16/2008 | EP1911579A1 Epoxy resin composition for encapsulating semiconductor device and thin semicondutor device |
| 04/16/2008 | EP1911337A1 Method for transferring and device for handling electronic components |
| 04/16/2008 | EP1911102A1 Method for passivating a substrate surface |
| 04/16/2008 | EP1911100A2 Electronic device including discontinuous storage elements |
| 04/16/2008 | EP1911099A2 Thin film circuits |
| 04/16/2008 | EP1911098A1 Method of forming a semiconductor structure |
| 04/16/2008 | EP1911097A1 Power semiconductor device and method of manufacturing a power semiconductor device |
| 04/16/2008 | EP1911096A2 Method and structure for forming slot via bitline for mram devices |
| 04/16/2008 | EP1911095A2 Reduced electric field dmos using self-aligned trench isolation |
| 04/16/2008 | EP1911088A2 Metal gate mosfet by full semiconductor metal alloy conversion |
| 04/16/2008 | EP1911087A2 Semiconductor devices and method of fabrication |
| 04/16/2008 | EP1911086A2 Solutions integrated circuit integration of alternative active area materials |
| 04/16/2008 | EP1911085A2 Method of production of a film |
| 04/16/2008 | EP1911084A1 Strained silicon on insulator (ssoi) structure with improved crystallinity in the strained silicon layer |
| 04/16/2008 | EP1911083A1 Semiconductor constructions, memory arrays, electronic systems, and methods of forming semiconductor constructions |
| 04/16/2008 | EP1911082A1 Functional film containing structure and method of manufacturing functional film |