| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/23/2008 | US7427168 Developing method and developing unit |
| 09/23/2008 | US7426900 Integrated electrostatic inductive coupling for plasma processing |
| 09/23/2008 | CA2169852C Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics |
| 09/18/2008 | WO2008112949A1 Cmos device with dual-epi channels and self-aligned contacts |
| 09/18/2008 | WO2008112883A2 Die attachment method with a covex surface underfill |
| 09/18/2008 | WO2008112859A1 Method of sti corner rounding using nitridation and high temperature thermal processing |
| 09/18/2008 | WO2008112825A1 System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices |
| 09/18/2008 | WO2008112725A1 A method of making reliable wafer level chip scale package semiconductor devices |
| 09/18/2008 | WO2008112673A2 Dynamic temperature backside gas control for improved within-substrate processing uniformity |
| 09/18/2008 | WO2008112598A2 Method for utilizing heavily doped silicon feedstock to produce substrates for photovoltaic applications by dopant compensation during crystal growth |
| 09/18/2008 | WO2008112463A1 Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces |
| 09/18/2008 | WO2008112447A1 Method and system for monitoring contamination on a substrate |
| 09/18/2008 | WO2008112433A1 Conformal coating comprising binder and non-conductive particulate |
| 09/18/2008 | WO2008112423A1 Method and apparatus for pressure and mix ratio control |
| 09/18/2008 | WO2008112354A1 Multilayer conductive elements |
| 09/18/2008 | WO2008112263A1 Advanced high-k gate stack patterning and structure containing a patterned high-k gate stack |
| 09/18/2008 | WO2008112225A1 Cleaning hardware kit for composite showerhead electrode assemblies for plasma processing apparatuses |
| 09/18/2008 | WO2008112185A1 Method to fabricate iii-n field effect transistors using ion implantation with reduced dopant activation and damage recovery temperature |
| 09/18/2008 | WO2008112097A2 Nitride semiconductor structures with interlayer structures and methods of fabricating nitride semiconductor structures with interlayer structures |
| 09/18/2008 | WO2008112096A2 Thick nitride semiconductor structures with interlayer structures and methods of fabricating thick nitride semiconductor structures |
| 09/18/2008 | WO2008112086A2 Electroplating process |
| 09/18/2008 | WO2008112081A1 Radio frequency isolation for soi transistors |
| 09/18/2008 | WO2008112000A2 Large area integration of quartz resonators with electronics |
| 09/18/2008 | WO2008111977A1 Method of teaching eyepoints for wire bonding and related semiconductor processing operations |
| 09/18/2008 | WO2008111914A1 An integrated circuit structure and a method of forming the same |
| 09/18/2008 | WO2008111814A1 Method of growing crystals in semiconductor device |
| 09/18/2008 | WO2008111758A1 Apparatus for inspection of semiconductor device and method for inspection by the same |
| 09/18/2008 | WO2008111752A1 Apparatus for transferring a wafer |
| 09/18/2008 | WO2008111738A1 Method for fabricating 1-3-6 2 compound thin film using single metal-organic chemical vapor deposition process |
| 09/18/2008 | WO2008111729A1 Method of thinning substrate, apparatus for thinning substrate and system having the same |
| 09/18/2008 | WO2008111701A1 Plasma analyzer |
| 09/18/2008 | WO2008111629A1 Planar motor, positioning apparatus, exposure apparatus, and device manufacturing method |
| 09/18/2008 | WO2008111533A1 Patterned insulating fine particle film, electronic component using the patterned insulating fine particle film, micromachine, optical component, and process for producing patterned insulating fine particle film |
| 09/18/2008 | WO2008111524A1 Package manufacturing method, package, optical module and die for integral molding |
| 09/18/2008 | WO2008111518A1 Method for forming nitride semiconductor laminated structure and method for manufacturing nitride semiconductor element |
| 09/18/2008 | WO2008111499A1 Cobalt-containing film-forming material and method for forming cobalt silicide film using the material |
| 09/18/2008 | WO2008111470A1 Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part |
| 09/18/2008 | WO2008111463A1 Coating solution for film formation, method for production of the coating solution, and method for production of semiconductor device |
| 09/18/2008 | WO2008111437A1 Semiconductor device manufacturing method |
| 09/18/2008 | WO2008111410A1 Substrate conveying robot |
| 09/18/2008 | WO2008111409A1 Semiconductor chip, and semiconductor device |
| 09/18/2008 | WO2008111406A1 Configurable circuit and configuration method |
| 09/18/2008 | WO2008111404A1 Ultrasonic cleaning device |
| 09/18/2008 | WO2008111401A1 Method of forming film of group iii nitride such as gallium nitride |
| 09/18/2008 | WO2008111400A1 Method of coating application, coating application apparatus and computer readable storage medium |
| 09/18/2008 | WO2008111393A1 Resin composition comprising empty silicone fine particles and organic polymer, and interlayer insulating film |
| 09/18/2008 | WO2008111391A1 High frequency package |
| 09/18/2008 | WO2008111389A1 Etching solution and etching method |
| 09/18/2008 | WO2008111365A1 Scanning electron microscope having length measuring function and sample dimension length measuring method |
| 09/18/2008 | WO2008111348A1 Sheet-mounting device and its method |
| 09/18/2008 | WO2008111327A1 Apparatus and method for punching out electronic component |
| 09/18/2008 | WO2008111286A1 Vertical heat-treating boat, and semiconductor wafer heat-treating method |
| 09/18/2008 | WO2008111283A1 Photocurable resin composition |
| 09/18/2008 | WO2008111277A1 Single crystal zinc oxide substrate |
| 09/18/2008 | WO2008111274A1 Laminate structure on semiconductor substrate |
| 09/18/2008 | WO2008111269A1 Semiconductor device having first electrode and second electrode and its manufacturing method |
| 09/18/2008 | WO2008111251A1 Resist composition, method of forming resist pattern, and process for manufacturing electronic device |
| 09/18/2008 | WO2008111231A1 Chemical vapor-phase growing apparatus, method of forming film and process for producing semiconductor device |
| 09/18/2008 | WO2008111208A1 Semiconductor integrated circuit |
| 09/18/2008 | WO2008111205A1 Process for producing semiconductor device, wafer and wafer cleaning apparatus |
| 09/18/2008 | WO2008111203A1 Resist composition, method of forming resist pattern, and process for manufacturing electronic device |
| 09/18/2008 | WO2008111199A1 Semiconductor device, and its manufacturing method |
| 09/18/2008 | WO2008111198A1 Photomask |
| 09/18/2008 | WO2008111188A1 Semiconductor device and process for producing the same |
| 09/18/2008 | WO2008111184A1 Semiconductor manufacturing apparatus, method of cleaning the same, and wafer for cleaning |
| 09/18/2008 | WO2008111177A1 Semiconductor device and method of manufacturing the same |
| 09/18/2008 | WO2008111134A1 Surface-hydrophobicized film, material for formation of surface-hydrophobicized film, wiring layer, semiconductor device and process for producing semiconductor device |
| 09/18/2008 | WO2008111125A1 Semiconductor device and process for producing the same |
| 09/18/2008 | WO2008110746A2 Measuring apparatus |
| 09/18/2008 | WO2008110497A1 Finfet with two independent gates and method for fabricating the same |
| 09/18/2008 | WO2008110401A1 Method and device for generating a porous layer on a semiconductor substrate |
| 09/18/2008 | WO2008110216A1 Copper interconnection for flat panel display manufacturing |
| 09/18/2008 | WO2008091729A3 Technique for improving the performance and extending the lifetime of an ion source with gas dilution |
| 09/18/2008 | WO2008064227A3 Dual stress device and method |
| 09/18/2008 | WO2008058131A9 Method and structure for thick layer transfer using a linear accelerator |
| 09/18/2008 | WO2008053705A3 Method for removing foreign matters from substrate surface |
| 09/18/2008 | WO2008025354A3 Method for selective plasmochemical dry-etching of phosphosilicate glass deposited on surfaces of silicon wafers |
| 09/18/2008 | WO2008019317A3 Load lock chamber with decoupled slit valve door seal compartment |
| 09/18/2008 | WO2008017186A3 Anisotropic magnetic elements for spintronic devices |
| 09/18/2008 | WO2008014031A3 Transistor with asymmetry for data storage circuitry |
| 09/18/2008 | WO2007149627A3 A dry non-plasma treatment system and method of using |
| 09/18/2008 | WO2007133935A3 Method and materials to control doping profile in integrated circuit substrate material |
| 09/18/2008 | WO2007130731A3 Barrier for use in 3-d integration of circuits |
| 09/18/2008 | WO2007121218A3 Field device editor tool |
| 09/18/2008 | WO2007095137A8 Method for conductivity control of (al,in,ga,b)n |
| 09/18/2008 | WO2007089366A3 Warpage-reducing packaging design |
| 09/18/2008 | WO2007002672A9 Atomic layer deposition using alkaline earth metal beta-diketiminate precursors |
| 09/18/2008 | US20080228419 Process condition sensing wafer and data analysis system |
| 09/18/2008 | US20080228311 Substrate processing apparatus, control method for the apparatus, and program for implementing the method |
| 09/18/2008 | US20080227902 comprising epoxy and cyanate ester resins, flexibilizers comprises bis(2,3-epoxy-2-methylpropyl)ether, a polyphenylene ether and silicon carbide fillers, having a higher fracture toughness, low viscosity and freeze resistance, used in electronic packages |
| 09/18/2008 | US20080227371 Double-side polishing apparatus |
| 09/18/2008 | US20080227367 Substrate polishing metrology using interference signals |
| 09/18/2008 | US20080227303 Vapor deposition process; semiconductor; high dielectric constants,used for capacitor dielectrics and gate dielectrics; random access memory devices |
| 09/18/2008 | US20080227302 Fibrous laminate interface for security coatings |
| 09/18/2008 | US20080227301 Integrated circuits; cleaning a bevel edge of a semiconductor; eliminates contamination by byproduct layer |
| 09/18/2008 | US20080227300 Method for manufacturing semiconductor device |
| 09/18/2008 | US20080227299 Tapered edge exposure for removal of material from a semiconductor wafer |
| 09/18/2008 | US20080227298 Semiconductor device manufacturing method |
| 09/18/2008 | US20080227297 Chemical mechanical polishing method and method for manufacturing semiconductor device |
| 09/18/2008 | US20080227296 Acidic aqueous solution, amphoteric surfactant/corrosion inhibitor; glycol selected from diethylene glycol, ethylene glycol, and polyoxyethylene glycol; hydrogen peroxide, benzoyl peroxide, barium peroxide, calcium peroxide or sodium peroxide; applied to tungsten layer |