Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2008
09/18/2008US20080225133 CMOS APS with stacked avalanche multiplication layer and low voltage readout electronics
09/18/2008US20080224960 Image Display Screen and Method for Controlling Said Screen
09/18/2008US20080224941 Semiconductor device and manufacturing method thereof
09/18/2008US20080224940 Semiconductor device and manufacturing method thereof
09/18/2008US20080224725 Test circuit, wafer, measuring apparatus, measuring method, device manufacturing method and display apparatus
09/18/2008US20080224720 Support Member Assembly for Conductive Contact Members
09/18/2008US20080224334 Molded Beam for Optoelectronic Sensor Chip Substrate
09/18/2008US20080224333 Semiconductor device and method of manufacturing the same
09/18/2008US20080224332 Transistor circuit formation substrate and method of manufacturing transistor
09/18/2008US20080224331 Electronic device and method for manufacturing the same
09/18/2008US20080224330 Power delivery package having through wafer vias
09/18/2008US20080224329 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
09/18/2008US20080224324 Semiconductor device and method of manufacturing the same
09/18/2008US20080224323 Semiconductor Module With Semiconductor Chips And Method For Producing It
09/18/2008US20080224322 Semiconductor device and manufacturing method thereof
09/18/2008US20080224320 Silicon chip having inclined contact pads and electronic module comprising such a chip
09/18/2008US20080224319 Micro electro-mechanical system and method of manufacturing the same
09/18/2008US20080224317 Stable silicide films and methods for making the same
09/18/2008US20080224316 Electronic device and method for producing electronic devices
09/18/2008US20080224315 Semiconductor device and manufacturing method thereof
09/18/2008US20080224314 Method and Apparatus for Forming a Noble Metal Layer, Notably on Inlaid Metal Features
09/18/2008US20080224313 Method for forming a seed layer for damascene copper wiring, and semiconductor wafer with damascene copper wiring formed using the method
09/18/2008US20080224310 Method for manufacturing semiconductor device and semiconductor device
09/18/2008US20080224308 Semiconductor package and fabricating method thereof
09/18/2008US20080224305 Method, apparatus, and system for phase change memory packaging
09/18/2008US20080224302 Semiconductor Module
09/18/2008US20080224301 Lead Structure for a Semiconductor Component and Method for Producing the Same
09/18/2008US20080224300 Semiconductor Module With Semiconductor Chips And Method For Producing It
09/18/2008US20080224298 Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components
09/18/2008US20080224297 Apparatus comprising a device and method for producing it
09/18/2008US20080224296 Article and Panel Comprising Semiconductor Chips, Casting Mold and Methods of Producing the Same
09/18/2008US20080224293 Method And Apparatus For Fabricating A Plurality Of Semiconductor Devices
09/18/2008US20080224291 Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
09/18/2008US20080224290 Low cost lead-free preplated leadframe having improved adhesion and solderability
09/18/2008US20080224289 Multi-chip stack structure and fabrication method thereof
09/18/2008US20080224285 Power module having stacked flip-chip and method of fabricating the power module
09/18/2008US20080224283 Leadframe-based semiconductor package and fabrication method thereof
09/18/2008US20080224282 Semiconductor device and method of manufacturing the same
09/18/2008US20080224281 Semiconductor device and method of manufacturing same
09/18/2008US20080224280 Lead frame, semiconductor device, and method of manufacturing the semiconductor device
09/18/2008US20080224279 Vertical electrical interconnect formed on support prior to die mount
09/18/2008US20080224278 Circuit component and method of manufacture
09/18/2008US20080224276 Semiconductor device package
09/18/2008US20080224275 Semiconductor device and method for manufacturing thereof
09/18/2008US20080224274 Semiconductor device, semiconductor display device, and manufacturing method of semiconductor device
09/18/2008US20080224271 Semiconductor Device and Method of Manufacturing Same, Wiring Board and Method of Manufacturing Same, Semiconductor Package, and Electronic Device
09/18/2008US20080224270 Silicon single crystal substrate and manufacture thereof
09/18/2008US20080224269 Gettering structures and methods and their application
09/18/2008US20080224267 Semiconductor devices including hydrogen implantation layers and methods of forming the same
09/18/2008US20080224265 Semiconductor device and manufacturing method thereof
09/18/2008US20080224264 Capacitor and method for fabricating the same
09/18/2008US20080224263 Semiconductor device and method of manufacturing the same
09/18/2008US20080224261 Fuse/anti-fuse structure and methods of making and programming same
09/18/2008US20080224260 Programmable Vias for Structured ASICs
09/18/2008US20080224259 Methods of fabricating passive element without planarizing and related semiconductor device
09/18/2008US20080224258 Semiconductor structue with multiple fins having different channel region heights and method of forming the semiconductor structure
09/18/2008US20080224256 Semiconductor-on-insulator(soi) structures including gradient nitrided buried oxide (box)
09/18/2008US20080224254 Glass-based SOI structures
09/18/2008US20080224252 Semiconductor device having an element isolating insulating film
09/18/2008US20080224250 Image Sensor and Method of Fabricating The Same
09/18/2008US20080224248 Image sensor module having build-in package cavity and the method of the same
09/18/2008US20080224246 Image Sensor and Method for Fabricating the Same
09/18/2008US20080224245 Image sensor and method for manufacturing the same
09/18/2008US20080224244 Image sensor and method for manufacturing the same
09/18/2008US20080224242 Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrate
09/18/2008US20080224241 Electronic device, resonator, oscillator and method for manufacturing electronic device
09/18/2008US20080224239 Method for forming fully silicided gate electrode in a semiconductor device
09/18/2008US20080224238 ADVANCED HIGH-k GATE STACK PATTERNING AND STRUCTURE CONTAINING A PATTERNED HIGH-k GATE STACK
09/18/2008US20080224236 Metal gate electrode for semiconductor devices
09/18/2008US20080224235 Selectively depositing aluminium in a replacement metal gate process
09/18/2008US20080224234 Method for manufacturing semiconductor device and semiconductor device
09/18/2008US20080224232 Silicidation process for mos transistor and transistor structure
09/18/2008US20080224230 Mosfet device having screening layers formed between main gate and passing gate and method for manufacturing the same
09/18/2008US20080224229 Semiconductor device and manufacturing method thereof
09/18/2008US20080224225 MOS transistors with selectively strained channels
09/18/2008US20080224224 Tunnel field-effect transistor with gated tunnel barrier
09/18/2008US20080224223 Semiconductor device and method for fabricating the same
09/18/2008US20080224222 Semiconductor device having a fin transistor and method for fabricating the same
09/18/2008US20080224219 Semiconductor device and method for manufacturing same
09/18/2008US20080224218 Cmos structure including differential channel stressing layer compositions
09/18/2008US20080224217 Mugfet switch
09/18/2008US20080224215 Semiconductor thin film and its manufacturing method and semiconductor device and its manufacturing method
09/18/2008US20080224214 Semiconductor device and fabrication method
09/18/2008US20080224213 Process for making finfet device with body contact and buried oxide junction isolation
09/18/2008US20080224212 Semiconductor device and method for fabricating the same
09/18/2008US20080224210 Short channel lv, mv, and hv cmos devices
09/18/2008US20080224209 Semiconductor device and method for fabricating the same
09/18/2008US20080224208 Semiconductor device and method for fabricating the same
09/18/2008US20080224206 Metal oxide semiconductor field effect transistors (mosfets) including recessed channel regions and methods of fabricating the same
09/18/2008US20080224205 Vertical Thin-Film Transistor with Enhanced Gate Oxide
09/18/2008US20080224204 Process for manufacturing a multi-drain electronic power device integrated in semiconductor substrate and corresponding device
09/18/2008US20080224201 Flash Memory Devices and Methods of Fabricating the Same
09/18/2008US20080224197 Semiconductor device and method for manufacturing the same
09/18/2008US20080224196 Semiconductor device and manufacturing process for the same
09/18/2008US20080224195 Semiconductor device with ferro-electric capacitor
09/18/2008US20080224190 Image sensor and method of fabricating the same
09/18/2008US20080224188 Image sensor and method for manufacturing the same
09/18/2008US20080224187 Image Sensor Pixel and Method of Fabricating the Same
09/18/2008US20080224185 Semiconductor device having a metal carbide gate with an electropositive element and a method of making the same
09/18/2008US20080224184 Transistor Manufacture