Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2009
02/12/2009US20090042356 Peeling Method and Method of Manufacturing Semiconductor Device
02/12/2009US20090042355 Semiconductor wafer and manufacturing method therefor
02/12/2009US20090042354 Integrated circuit fabrication process using a compression cap layer in forming a silicide with minimal post-laser annealing dopant deactivation
02/12/2009US20090042353 Integrated circuit fabrication process for a high melting temperature silicide with minimal post-laser annealing dopant deactivation
02/12/2009US20090042352 Gate interface relaxation anneal method for wafer processing with post-implant dynamic surface annealing
02/12/2009US20090042351 Method for making a transistor with a stressor
02/12/2009US20090042350 Manufacturing method of nonvolatile memory
02/12/2009US20090042349 Split gate memory cell and method therefor
02/12/2009US20090042348 Method for manufacturing semiconductor device
02/12/2009US20090042346 Electrolyte pattern and method for manufacturing an electrolyte pattern
02/12/2009US20090042345 Methods of Fabricating Transistors Having Buried N-Type and P-Type Regions Beneath the Source Region
02/12/2009US20090042344 InP-Based Transistor Fabrication
02/12/2009US20090042343 Methods of fabricating crystalline silicon, thin film transistors, and solar cells
02/12/2009US20090042342 Method for crystallization of amorphous silicon by joule heating
02/12/2009US20090042341 Electrical fuse with a thinned fuselink middle portion
02/12/2009US20090042340 Nonvolatile storage device and method of manufacturing the same, and storage device and method of manufacturing the same
02/12/2009US20090042339 Packaged integrated circuits and methods to form a packaged integrated circuit
02/12/2009US20090042338 Capping Coating for 3D Integration Applications
02/12/2009US20090042337 Method of Manufacturing an Integrated Circuit Module
02/12/2009US20090042336 Fabrication method of an organic substrate having embedded active-chips
02/12/2009US20090042335 Vertical side wall active pin structures in a phase change memory and manufacturing methods
02/12/2009US20090042334 CMOS image sensor and method for fabricating the same
02/12/2009US20090042333 Structure and Method for Surfaced-Passivated Zinc-Oxide
02/12/2009US20090042327 Method for assembling array-type semiconductor laser device
02/12/2009US20090042325 Semiconductor light emitting device and method for manufacturing the same
02/12/2009US20090042324 Substrate supporting apparatus
02/12/2009US20090042323 Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor device
02/12/2009US20090042322 Method for inspecting semiconductor device
02/12/2009US20090042321 Apparatus and method for plasma doping
02/12/2009US20090042320 Methods for liquid transfer coating of three-dimensional substrates
02/12/2009US20090042141 Anti-reflective polymer, anti-reflective composition containing the same, and method for forming pattern using the same
02/12/2009US20090042136 Carbon Nanotube-Silicon Composite Structures and Methods for Making Same
02/12/2009US20090042112 Magnetic recording media
02/12/2009US20090042110 Reflection type photomask blank, manufacturing method thereof, reflection type photomask, and manufacturing method of semiconductor device
02/12/2009US20090042109 Mask blank substrate manufacturing method, mask blank manufacturing method, mask manufacturing method, and mask blank substrate
02/12/2009US20090042108 Pattern forming method and mask
02/12/2009US20090042106 Photomask, and method and apparatus for producing the same
02/12/2009US20090042053 Dielectric layer structure and manufacturing method thereof
02/12/2009US20090042002 Heat Treatment Method of ZnTe Single Crystal Substrate and ZnTe Single Crystal Substrate
02/12/2009US20090041948 Method of forming fine patterns
02/12/2009US20090041926 Coating and developing apparatus, substrate processing method and computer-readable recording medium
02/12/2009US20090041563 Wafer Transferring Apparatus, Polishing Apparatus, and Wafer Receiving Method
02/12/2009US20090041443 Backside Rapid Thermal Processing of Patterned Wafers
02/12/2009US20090041382 Simulation method of optical image intensity distribution, program, and method of manufacturing semiconductor device
02/12/2009US20090041335 Pattern defect inspection method and apparatus
02/12/2009US20090041333 Scanning electron microscope
02/12/2009US20090041270 Mems Microphone And Method For Producing Said Microphone
02/12/2009US20090041075 Surface-emitting type semiconductor optial device and method for manufacturing a surface-emitting type semiconductor optical device
02/12/2009US20090041074 Passivation of Vertical Cavity Surface Emitting Lasers
02/12/2009US20090041073 Dbr laser with improved thermal tuning efficiency
02/12/2009US20090040829 Lateral pocket implant charge trapping devices
02/12/2009US20090040824 Semiconductor device and method of manufacturing the same
02/12/2009US20090040802 Semiconductor memory device, memory-mounted lsi and fabrication method for semiconductor memory device
02/12/2009US20090040682 Method of de-chucking wafer using direct voltage and alternating voltage, and apparatus for fabricating semiconductor device using the same
02/12/2009US20090040681 Electrode Sheet for Electrostatic Chuck, and Electrostatic Chuck
02/12/2009US20090040514 Method and apparatus for scanning, stitching and damping measurements of a double sided metrology inspection tool
02/12/2009US20090040512 Semiconductor wafer inspection device and method
02/12/2009US20090040489 Position sensor
02/12/2009US20090040487 Imaging device in a projection exposure facility
02/12/2009US20090040445 Semiconductor device and method of fabricating the same
02/12/2009US20090040432 Transflective liquid crystal display
02/12/2009US20090040418 LED device and back panel of liquid crystal display
02/12/2009US20090040345 Color imaging device and color imaging device manufacturing method
02/12/2009US20090040059 Apparatus to Monitor Process-Based Parameters of an Integrated Circuit (IC) Substrate
02/12/2009US20090039770 Organic light emitting device and method for manufacturing the same
02/12/2009US20090039533 Adhesion structure for a package apparatus
02/12/2009US20090039532 Semiconductor device package having a back side protective scheme
02/12/2009US20090039531 Flip-chip package covered with tape
02/12/2009US20090039530 Near chip scale package integration process
02/12/2009US20090039529 Integrated Circuit Having a Plurality of Connection Pads and Integrated Circuit Package
02/12/2009US20090039528 Wafer level stacked packages with individual chip selection
02/12/2009US20090039527 Sensor-type package and method for fabricating the same
02/12/2009US20090039526 Package and the method for making the same, and a stacked package
02/12/2009US20090039524 Methods and apparatus to support an overhanging region of a stacked die
02/12/2009US20090039523 Packaged integrated circuit devices with through-body conductive vias, and methods of making same
02/12/2009US20090039522 Bipolar and cmos integration with reduced contact height
02/12/2009US20090039521 Semiconductor structure and semiconductor manufacturing method
02/12/2009US20090039519 Semiconductor device, photomask, semiconductor device production method, and pattern layout method
02/12/2009US20090039518 Method for forming a damascene structure
02/12/2009US20090039517 Chemical vapor deposition of titanium
02/12/2009US20090039516 Power semiconductor component with metal contact layer and production method therefor
02/12/2009US20090039515 Ionizing radiation blocking in ic chip to reduce soft errors
02/12/2009US20090039514 Semiconductor device and method for manufacturing the same
02/12/2009US20090039513 Contacting Method for Semiconductor Material and Semiconductor Device
02/12/2009US20090039512 Electromigration resistant interconnect structure
02/12/2009US20090039511 Semiconductor device and method for fabricating the same
02/12/2009US20090039510 Semiconductor device and manufacturing method thereof
02/12/2009US20090039509 Semiconductor device and method of manufacturing the same
02/12/2009US20090039508 Larger than die size wafer-level redistribution packaging process
02/12/2009US20090039507 Electronic Element, Electronic Element Device Using the Same, and Manufacturing Method Thereof
02/12/2009US20090039506 Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof
02/12/2009US20090039505 Thermally insulating bonding pad structure for solder reflow connection
02/12/2009US20090039501 Integrated circuit with galvanically bonded heat sink
02/12/2009US20090039499 Heat Sink with Thermally Compliant Beams
02/12/2009US20090039497 Semiconductor device package having a back side protective scheme
02/12/2009US20090039496 Method for fabricating a semiconductor and semiconductor package
02/12/2009US20090039494 Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it
02/12/2009US20090039491 Semiconductor package having buried post in encapsulant and method of manufacturing the same
02/12/2009US20090039489 method of producing optical mems
02/12/2009US20090039488 Semiconductor package and method for fabricating the same