Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2009
02/11/2009CN100461822C Driver circuit
02/11/2009CN100461474C Packing structure of chip inverted-mounted light-emitting diode and packing method thereof
02/11/2009CN100461468C 发光半导体器件及其制造方法 The light emitting semiconductor device and its manufacturing method
02/11/2009CN100461464C Semiconductor structure for imaging detectors
02/11/2009CN100461459C Method for manufacturing semiconductor device and method for manufacturing electronic apparatus
02/11/2009CN100461458C High voltage devices and making method thereof
02/11/2009CN100461457C High-voltage field-effect transistor and method of making a high-voltage field-effect transistor
02/11/2009CN100461456C Semiconductor device and manufacturing method thereof
02/11/2009CN100461455C Semiconductor structure and forming method thereof, transverse diffusion p-type mos device
02/11/2009CN100461454C Semiconductor element and method of forming the same
02/11/2009CN100461453C Metal oxide semiconductor transistor and production thereof
02/11/2009CN100461452C Metal-oxide-semiconductor device having trenched diffusion region and method of forming same
02/11/2009CN100461451C Method and structure to create multiple device widths in FINFET technology
02/11/2009CN100461450C Semiconductor device and method for fabricating the same
02/11/2009CN100461449C Semiconductor device and method for manufacturing semiconductor device
02/11/2009CN100461447C Semiconductor devices and methods for fabricating the same
02/11/2009CN100461446C Strained Si MOSFET on tensile-strained sige-on-insulator (SGOI)
02/11/2009CN100461445C Organic electroluminescent devices and fabrication methods thereof
02/11/2009CN100461444C Light emitting display and method of manufacturing the same
02/11/2009CN100461441C Semiconductor device and method for manufacturing semiconductor device
02/11/2009CN100461439C Image sensor element and manufacturing method thereof
02/11/2009CN100461438C Pixel sensor cell having reduced pinning layer barrier potential and forming method thereof
02/11/2009CN100461436C CMOS image sensor and method for fabricating the same
02/11/2009CN100461435C Very-long-wave mercury cadmium telluride infrared focal plane detector antireflective membrane and preparing method thereof
02/11/2009CN100461433C TFI array structure and manufacturing method thereof
02/11/2009CN100461432C Thin film transistor channel structure
02/11/2009CN100461431C Array substrate for liquid crystal display device and method of fabricating the same
02/11/2009CN100461430C Semiconductor structure and forming method thereof
02/11/2009CN100461427C Nonvolatile semiconductor storage device and manufacturing method therefor
02/11/2009CN100461426C Non-volatile memory and producing method and operating method thereof
02/11/2009CN100461424C Structure and method for semiconductor integrated circuit tunnel oxidation window region design
02/11/2009CN100461423C Memory element and forming method thereof
02/11/2009CN100461422C Dynamic random access emory unit with lateral deviation sotrage node and makin method thereof
02/11/2009CN100461421C Semiconductor device having ferroelectric capacitor and manufacture method thereof
02/11/2009CN100461420C Double gate finfet field effect transistor gain unit and producing method thereof
02/11/2009CN100461418C Flash memory device and method of fabricating the same
02/11/2009CN100461417C 半导体存储装置及其制造方法 The semiconductor memory device and manufacturing method thereof
02/11/2009CN100461416C Semiconductor device
02/11/2009CN100461415C Field effect transistor and manufacturing method thereof
02/11/2009CN100461414C Semiconductor device and manufacturing method thereof
02/11/2009CN100461412C Ic chip, semiconductor structure and manufacturing method thereof
02/11/2009CN100461411C Semiconductor device
02/11/2009CN100461409C Semiconductor device and manufacturing method thereof
02/11/2009CN100461407C Semiconductor component and method for forming the same
02/11/2009CN100461406C Inspection substrate for display device
02/11/2009CN100461404C 半导体器件 Semiconductor devices
02/11/2009CN100461402C Circuit device and method for manufacturing same
02/11/2009CN100461397C Semiconductor device having a wire bond pad and method therefor
02/11/2009CN100461396C Semiconductor device and method of manufacturing the same
02/11/2009CN100461395C Integrated circuit element and method for forming same
02/11/2009CN100461393C Method and structure for combining copper with metal-insulator-metal capacitor
02/11/2009CN100461392C 半导体封装 The semiconductor package
02/11/2009CN100461390C Flip chip semiconductor package device and manufacturing method thereof
02/11/2009CN100461389C Planar pad design and production method
02/11/2009CN100461385C Integrated circuit device for driving a laser diode with reduced heat transfer and method for fabricating the device
02/11/2009CN100461384C 电路装置及其制造方法 Circuit device and manufacturing method thereof
02/11/2009CN100461381C Semiconductor wafer
02/11/2009CN100461379C Picture element structure of liquid crystal display and producing method thereof
02/11/2009CN100461378C Method for making array lining with driving integrated circuit
02/11/2009CN100461377C Method of forming a resistor in a flash memory device
02/11/2009CN100461376C Method for producing nonvolatile memory
02/11/2009CN100461375C Method for making isolation structure for flash-memory semiconductor device
02/11/2009CN100461374C Nonvolatile memory unit, manufacturing method, and opertion method
02/11/2009CN100461373C Method of chemical and mechanical polishing in joining polycrystalline silicon plug bolt manufacture and arrangement thereof
02/11/2009CN100461371C Semiconductor chip, method for manufacturing semiconductor chip, semiconductor device and method for manufacturing semiconductor device
02/11/2009CN100461370C Method for fabricating CMOS image sensor
02/11/2009CN100461369C A method for depositing a metal layer on a semiconductor interconnect structure
02/11/2009CN100461368C Semiconductor substrate and with deuterated buried layer and manufacturing method thereof
02/11/2009CN100461367C Formation of patterned silicon-on-insulator (soi)/silicon-on-nothing (son) composite structure by porous Si engineering
02/11/2009CN100461366C Method and structure for capacitor manufacturing in damascus copper process of integrated circuit unit
02/11/2009CN100461365C High precision silicon slice bench and positioning method thereof
02/11/2009CN100461364C Multiple zone carrier head with flexible membrane
02/11/2009CN100461363C Transfer robot and transfer apparatus
02/11/2009CN100461362C Method for improving ultrathin plasma silicon oxy nitride electrical test accurancy
02/11/2009CN100461361C Method for calibrating tool manufactured by semiconductor device
02/11/2009CN100461360C Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatus
02/11/2009CN100461359C Thermo-compression bonding tool and thermo-compression bonding device
02/11/2009CN100461358C Component mounting method and component mounting apparatus
02/11/2009CN100461357C Through electrode and method for forming the same
02/11/2009CN100461356C Semiconductor component with at least one semiconductor chip on base chip serving as substrate and method for production thereof
02/11/2009CN100461355C Flexible contact-connection device
02/11/2009CN100461354C Packaging method for integrated circuit and LED
02/11/2009CN100461353C Method for manufacturing hybrid integrated circuit device
02/11/2009CN100461352C Interconnect structures and forming method thereof
02/11/2009CN100461351C Manufacture method of semiconductor device
02/11/2009CN100461350C A semiconductor device having an organic anti-reflective coating (ARC) and manufacturing method therefor
02/11/2009CN100461349C Process for producing high resistance silicon wafer, and process for producing epitaxial wafer and SOI wafer
02/11/2009CN100461348C Silicon-based material layer, forming method, structure, device, emitter and display incorporating the silicon-based material layer
02/11/2009CN100461347C Semiconductor device and method of manufacturing the same
02/11/2009CN100461346C Polishing pad and method for manufacture of semiconductor device using the same
02/11/2009CN100461345C Etch with ramping
02/11/2009CN100461344C Method for removing carbon-containing residues from a substrate
02/11/2009CN100461343C Method for depositing atomic-layer to semiconductor device by pretreatment materials
02/11/2009CN100461342C Forming method of slotted grid dielectric layer
02/11/2009CN100461341C Method and apparatus for plasma nitridation of gate dielectrics using amplitude modulated radio-frequency energy
02/11/2009CN100461340C Method for manufacturing group III nitride compound semiconductor
02/11/2009CN100461339C Compound semiconductor element, manufacturing method of compound semiconductor element, diode element
02/11/2009CN100461338C Method of manufacturing optical devices and related improvements
02/11/2009CN100461337C Method for forming pattern, thin film transistor, display device and method for manufacturing the same and application
02/11/2009CN100461336C Exposure apparatus and device producing method