Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2009
02/10/2009US7488656 Removal of charged defects from metal oxide-gate stacks
02/10/2009US7488655 Method for fabricating semiconductor device
02/10/2009US7488654 Fabrication of local damascene finFETs using contact type nitride damascene mask
02/10/2009US7488653 Semiconductor device and method for implantation of doping agents in a channel
02/10/2009US7488652 Manufacturing method of gate oxidation films
02/10/2009US7488651 Method of making vertical transistor structures having vertical-surrounding-gates with self-aligned features
02/10/2009US7488650 Method of forming trench-gate electrode for FinFET device
02/10/2009US7488649 Method of manufacturing split gate type non-volatile memory device
02/10/2009US7488648 Methods of fabricating scalable two-transistor memory devices having metal source/drain regions
02/10/2009US7488647 System and method for providing a poly cap and a no field oxide area to prevent formation of a vertical bird's beak structure in the manufacture of a semiconductor device
02/10/2009US7488646 Nonvolatile semiconductor memory device and its manufacturing method
02/10/2009US7488645 Method of fabricating a non-volatile memory
02/10/2009US7488644 Method of fabricating a semiconductor device
02/10/2009US7488643 MIM capacitor and method of making same
02/10/2009US7488642 Process for forming a buried plate
02/10/2009US7488641 Trench DRAM cell with vertical device and buried word lines
02/10/2009US7488640 Aluminum nitride and aluminum oxide/aluminum nitride heterostructure gate dielectric stack based field effect transistors and method for forming same
02/10/2009US7488639 Method of manufacturing a semiconductor integrated circuit device
02/10/2009US7488638 Method for fabricating a voltage-stable PMOSFET semiconductor structure
02/10/2009US7488637 CMOS image sensor and method for forming the same
02/10/2009US7488636 Broken die detect sensor
02/10/2009US7488635 Semiconductor structure with reduced gate doping and methods for forming thereof
02/10/2009US7488634 Method for fabricating flash memory device
02/10/2009US7488633 Method for forming polysilicon by illuminating a laser beam at the amorphous silicon substrate through a mask
02/10/2009US7488632 Thin film transistor substrate for display device and fabricating method thereof
02/10/2009US7488631 Semiconductor device having a schottky source/drain transistor
02/10/2009US7488629 Fabricating method of an active-matrix organic electroluminescent display panel
02/10/2009US7488628 Methods for fabricating ferroelectric memory devices with improved ferroelectric properties
02/10/2009US7488627 Thyristor-based memory and its method of operation
02/10/2009US7488625 Vertically stacked, field programmable, nonvolatile memory and method of fabrication
02/10/2009US7488624 Techniques for providing decoupling capacitance
02/10/2009US7488623 Integrated circuit chip packaging assembly
02/10/2009US7488622 Method for producing a surface-mountable semiconductor component
02/10/2009US7488621 Package-integrated thin film LED
02/10/2009US7488620 Method of fabricating leadframe based flash memory cards including singulation by straight line cuts
02/10/2009US7488619 Method and apparatus for manufacturing IC chip packaged device
02/10/2009US7488618 Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same
02/10/2009US7488617 CMOS image sensor and method for manufacturing the same
02/10/2009US7488616 CMOS image sensor and method for manufacturing the same
02/10/2009US7488615 Method of manufacturing a solid-state imaging device
02/10/2009US7488614 Providing a charge dissipation structure for an electrostatically driven device
02/10/2009US7488613 Nitride-based light-emitting device and method of manufacturing the same
02/10/2009US7488612 Liquid crystal display device and fabricating method thereof
02/10/2009US7488611 Devices and methods for integrated circuit manufacturing
02/10/2009US7488610 Insulator film characteristic measuring method and insulator film characteristic measuring apparatus
02/10/2009US7488609 Method for forming an MgO barrier layer in a tunneling magnetoresistive (TMR) device
02/10/2009US7488593 Using genetic engineering to prepare virus having plurality of recognition sites for selective binding or nucleating; synthesis of trifunctionalized viral particles for use as field effect transistors
02/10/2009US7488560 enables the pellicle to be removed from an exposure master plate without using a solvent, etc. and without being accompanied by cohesive failure in a pressure-sensitive adhesive
02/10/2009US7488543 comprising two pieces of aluminum nitride sintered body plates joined together without using adhesive, and a metal layer formed on a portion of the junction interface; plate heater or an electrostatic chuck for treating a semiconductor wafer
02/10/2009US7488532 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same
02/10/2009US7488507 Capacitor with plasma deposited dielectric
02/10/2009US7488505 Enhancing the inplane uniformity of the thickness of a coating film to improve throughput by applying coating liquid spirally, monitoring to detect uncoated regions, and applying a second coating liquid to fill the uncoated region
02/10/2009US7488400 Apparatus for etching wafer by single-wafer process
02/10/2009US7488385 Method for epitaxial growth of a gallium nitride film separated from its substrate
02/10/2009US7488374 Trapping device, processing system, and method removing impurities
02/10/2009US7488240 Polishing device
02/10/2009US7488236 Polishing pad and method of producing the same
02/10/2009US7488235 Polishing apparatus and related polishing methods
02/10/2009US7488220 Electrical connector with locking mechanism
02/10/2009US7488127 Resist pattern forming apparatus and method thereof
02/10/2009US7487740 Voltage non-uniformity compensation method for high frequency plasma reactor for the treatment of rectangular large area substrates
02/10/2009US7487678 Z offset MEMS devices and methods
02/10/2009US7487586 Process for producing semiconductor device
02/10/2009CA2321360C Process for encapsulating electronic components
02/05/2009WO2009018581A1 Copper metallization of through silicon via
02/05/2009WO2009018556A2 Method of enhancing drive current in a transistor
02/05/2009WO2009018395A2 Self-aligned t-gate carbon nanotube field effect transistor devices and method for forming the same
02/05/2009WO2009018371A2 Nanomembrane structures having mixed crystalline orientations and compositions
02/05/2009WO2009018267A1 Composite sheet
02/05/2009WO2009018244A1 Method and system for increasing throughput during location specific processing of a plurality of substrates
02/05/2009WO2009018203A2 Integrated circuit formation using different angled implants
02/05/2009WO2009018110A2 Oblique vacuum deposition for roll-roll coating of wire grid polarizer lines oriented in a down-web direction
02/05/2009WO2009018062A1 Interconnect structure with grain growth promotion layer and method for forming the same
02/05/2009WO2009018059A2 Process of semiconductor fabrication with mask overlay on pitch multiplied features and associated structures
02/05/2009WO2009018057A1 Method for etching metal nitride with high selectivity to other materials
02/05/2009WO2009018044A2 Advanced multi-workpiece processing chamber
02/05/2009WO2009017997A1 Method for forming a semiconductor device having abrupt ultra shallow epi-tip regions
02/05/2009WO2009017990A1 Method and apparatus for verifying proper substrate positioning
02/05/2009WO2009017982A2 Methods for device fabrication using pitch reduction and associated structures
02/05/2009WO2009017929A2 Fabrication method to minimize ballast layer defects
02/05/2009WO2009017923A1 Semiconductor device having backside redistribution layers and method for fabricating the same
02/05/2009WO2009017894A1 Method for partitioning and incoherently summing a coherent beam
02/05/2009WO2009017888A1 Method of processing a high-k dielectric for cet scaling
02/05/2009WO2009017871A1 Non-volatile memory device with reduced write-erase cycle time
02/05/2009WO2009017869A1 Improved buried isolation layer
02/05/2009WO2009017854A2 Sensor system and method
02/05/2009WO2009017835A2 Semiconductor packaging process using through silicon vias
02/05/2009WO2009017830A1 Fabrication of patterned and ordered nanoparticles
02/05/2009WO2009017829A1 Control of strain through thickness in epitaxial films via vertical nanocomposite heteroepitaxy
02/05/2009WO2009017782A2 Ruthenium cmp compositions and methods
02/05/2009WO2009017779A1 Self-aligned cross-point memory fabrication
02/05/2009WO2009017758A2 Reconstituted wafer stack packaging with after-applied pad extensions
02/05/2009WO2009017734A1 Slurry containing multi-oxidizer and nano-sized diamond abrasive for tungsten cmp
02/05/2009WO2009017700A1 Polymer electronic devices by all-solution process
02/05/2009WO2009017672A2 Wire saw process
02/05/2009WO2009017667A1 Method of depositing tungsten using plasma-treated tungsten nitride
02/05/2009WO2009017652A2 Compositions and methods for chemical-mechanical polishing of phase change materials
02/05/2009WO2009017622A1 Ultra thin single crystalline semiconductor tft and process for making same
02/05/2009WO2009017465A2 Patterned wafer defect inspection system and method
02/05/2009WO2009017448A1 Method for producing electronic devices on a wafer.