Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2009
03/05/2009US20090057881 Microelectronic package and method of cooling same
03/05/2009US20090057879 Structure and process for electrical interconnect and thermal management
03/05/2009US20090057878 Semiconductor die package including heat sinks
03/05/2009US20090057877 Semiconductor Device with Gel-Type Thermal Interface Material
03/05/2009US20090057874 Semiconductor module including semiconductor chips in a plastic housing in separate regions
03/05/2009US20090057873 Packaging substrate structure with electronic component embedded therein and method for manufacture of the same
03/05/2009US20090057872 Through-Chip Via Interconnects for Stacked Integrated Circuit Structures
03/05/2009US20090057868 Wafer Level Chip Size Package For MEMS Devices And Method For Fabricating The Same
03/05/2009US20090057867 Integrated Circuit Package with Passive Component
03/05/2009US20090057866 Microelectronic Package Having Second Level Interconnects Including Stud Bumps and Method of Forming Same
03/05/2009US20090057865 Sandwiched organic lga structure
03/05/2009US20090057864 Integrated circuit package system employing an offset stacked configuration
03/05/2009US20090057863 Integrated circuit package-on-package system with anti-mold flash feature
03/05/2009US20090057862 Integrated circuit package-in-package system with carrier interposer
03/05/2009US20090057861 Integrated circuit package-in-package system with side-by-side and offset stacking
03/05/2009US20090057858 Low cost lead frame package and method for forming same
03/05/2009US20090057857 Lead frame, semiconductor device, and method of manufacturing semiconductor device
03/05/2009US20090057855 Semiconductor die package including stand off structures
03/05/2009US20090057854 Self locking and aligning clip structure for semiconductor die package
03/05/2009US20090057852 Thermally enhanced thin semiconductor package
03/05/2009US20090057851 Method of manufacturing semiconductor device
03/05/2009US20090057850 Surface Mountable Semiconductor Package with Solder Bonding Features
03/05/2009US20090057849 Interconnect in a multi-element package
03/05/2009US20090057848 Redistribution structures for microfeature workpieces
03/05/2009US20090057846 Method to fabricate adjacent silicon fins of differing heights
03/05/2009US20090057845 Apparatus to saw wafer and having nozzle to remove burrs in scribe lanes, method of sawing wafer, and semiconductor package fabricated by the same
03/05/2009US20090057844 Semiconductor device and method of manufacturing semiconductor device
03/05/2009US20090057843 Semiconductor assemblies and methods of manufacturing such assemblies
03/05/2009US20090057842 Selective removal of on-die redistribution interconnects from scribe-lines
03/05/2009US20090057840 Wafer manufacturing method, polishing apparatus, and wafer
03/05/2009US20090057839 Polymer-embedded semiconductor rod arrays
03/05/2009US20090057838 Manufacturing Method for Semiconductor Chips, and Semiconductor Chip
03/05/2009US20090057835 Group III nitride semiconductor and a manufacturing method thereof
03/05/2009US20090057834 Method for Chemical Mechanical Planarization of Chalcogenide Materials
03/05/2009US20090057831 Semiconductor device and method of forming a semiconductor device
03/05/2009US20090057830 Semidoncudtor device and method of manufacturing the same
03/05/2009US20090057828 Metal-insulator-metal capacitor and method for manufacturing the same
03/05/2009US20090057827 Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer
03/05/2009US20090057826 Semiconductor Devices and Methods of Manufacture Thereof
03/05/2009US20090057825 Semiconductor Device and a Method for Fabricating the Same
03/05/2009US20090057824 Inductor of semiconductor device and method for manufacturing the same
03/05/2009US20090057822 Semiconductor component and method of manufacture
03/05/2009US20090057817 Microelectromechanical System and Process of Making the Same
03/05/2009US20090057816 Method to reduce residual sti corner defects generated during spe in the fabrication of nano-scale cmos transistors using dsb substrate and hot technology
03/05/2009US20090057813 Method for self-aligned removal of a high-k gate dielectric above an sti region
03/05/2009US20090057812 Semiconductor device having multiple element formation regions and manufacturing method thereof
03/05/2009US20090057811 Simox wafer manufacturing method and simox wafer
03/05/2009US20090057810 Method of Fabricating an Integrated Circuit
03/05/2009US20090057809 Stress transfer in an interlayer dielectric by providing a stressed dielectric layer above a stress-neutral dielectric material in a semiconductor device
03/05/2009US20090057807 Schottky barrier diode and manufacturing method thereof
03/05/2009US20090057802 Image Sensor and Method for Manufacturing the Same
03/05/2009US20090057799 Sensor semiconductor device and method for fabricating the same
03/05/2009US20090057798 Method of producing semiconductor device, solid-state imaging device, method of producing electric apparatus, and electric apparatus
03/05/2009US20090057793 Spin transistor and method of manufacturing same
03/05/2009US20090057791 Microchip and soi substrate for manufacturing microchip
03/05/2009US20090057786 Semiconductor device and method of manufacturing semiconductor device
03/05/2009US20090057785 Method of fabricating extended drain mos transistor
03/05/2009US20090057783 Semiconductor device and method of fabricating metal gate of the same
03/05/2009US20090057780 Finfet structure including multiple semiconductor fin channel heights
03/05/2009US20090057779 Semiconductor Device and Method of Fabricating the Same
03/05/2009US20090057778 Integrated circuit and method of manufacturing an integrated circuit
03/05/2009US20090057776 Method of forming fully silicided nmos and pmos semiconductor devices having independent polysilicon gate thicknesses, and related device
03/05/2009US20090057775 Semiconductor Device and Method for Manufacturing Semiconductor Device
03/05/2009US20090057771 Semiconductor device and method of manufacturing the same
03/05/2009US20090057770 Semiconductor device and method of fabricating the same
03/05/2009US20090057769 Cmos device having gate insulation layers of different type and thickness and a method of forming the same
03/05/2009US20090057767 Semiconductor device, method for manufacturing the same, and method for driving the same
03/05/2009US20090057766 Integration of silicon boron nitride in high voltage and small pitch semiconductors
03/05/2009US20090057765 Finfet structure using differing gate dielectric materials and gate electrode materials
03/05/2009US20090057763 Semiconductor memory device and manufacturing method thereof
03/05/2009US20090057761 Fin field effect transistor and method of manufacturing the same
03/05/2009US20090057760 Semiconductor device and fabricating method thereof
03/05/2009US20090057759 Mos device and process having low resistance silicide interface using additional source/drain implant
03/05/2009US20090057758 Thin silicon-on-insulator high voltage transistor with body ground
03/05/2009US20090057757 Trench gate semiconductor device and method of manufacturing the same
03/05/2009US20090057756 Trench MOSFET with Trench Termination and manufacture thereof
03/05/2009US20090057755 Spacer undercut filler, method of manufacture thereof and articles comprising the same
03/05/2009US20090057752 Non-volatile memory and method for manufacturing the same
03/05/2009US20090057748 Memory and manufacturing method thereof
03/05/2009US20090057745 Inverted nonvolatile memory device, stack module, and method of fabricating the same
03/05/2009US20090057744 Thickened sidewall dielectric for memory cell
03/05/2009US20090057743 Integrated Circuit Including Structures Arranged at Different Densities and Method of Forming the Same
03/05/2009US20090057742 Cmos varactor
03/05/2009US20090057741 Dram cell with enhanced capacitor area and the method of manufacturing the same
03/05/2009US20090057740 Memory with surface strap
03/05/2009US20090057739 Ge channel device and method for fabricating ge channel device
03/05/2009US20090057737 Integrated circuit with dielectric layer
03/05/2009US20090057736 Semiconductor Device Having Reduced Single Bit Fails and a Method of Manufacture Thereof
03/05/2009US20090057735 Image sensor having reduced dark current
03/05/2009US20090057730 Methods for forming self-aligned borderless contacts for strain engineered logic devices and structure thereof
03/05/2009US20090057729 Semiconductor device and methods for fabricating same
03/05/2009US20090057728 Dynamic random access memory having junction field effect transistor cell access device
03/05/2009US20090057726 Manufacturing method of semiconductor device, semiconductor device, and electronic device
03/05/2009US20090057725 Image Sensor and Manufacturing Method Thereof
03/05/2009US20090057721 Semiconductor device, epitaxial wafer, and method of manufacturing the same
03/05/2009US20090057719 Compound semiconductor device with mesa structure
03/05/2009US20090057718 High Temperature Ion Implantation of Nitride Based HEMTS
03/05/2009US20090057717 Low capacitance semiconductor device
03/05/2009US20090057716 Epitaxial surge protection device
03/05/2009US20090057714 Thyristor and methods for producing a thyristor
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