Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2009
03/12/2009US20090068800 Method and/or system for forming a thin film
03/12/2009US20090068799 Manufacturing process for a quad flat non-leaded chip package structure
03/12/2009US20090068798 Imager die package and methods of packaging an imager die on a temporary carrier
03/12/2009US20090068797 Manufacturing process for a quad flat non-leaded chip package structure
03/12/2009US20090068796 Semiconductor connection component
03/12/2009US20090068795 Production methods of electronic devices
03/12/2009US20090068794 Manufacturing process for a quad flat non-leaded chip package structure
03/12/2009US20090068793 Manufacturing process for a chip package structure
03/12/2009US20090068792 Manufacturing process for a chip package structure
03/12/2009US20090068791 Method For Fabricating Stacked Semiconductor Components
03/12/2009US20090068790 Electrical Interconnect Formed by Pulsed Dispense
03/12/2009US20090068789 Manufacturing process for a chip package structure
03/12/2009US20090068787 Solid state image pickup device and method for manufacturing the same
03/12/2009US20090068786 Fabricating method of image sensor
03/12/2009US20090068785 Manufacturing method of image sensor device
03/12/2009US20090068782 Nano-elastic memory device and method of manufacturing the same
03/12/2009US20090068781 Method of manufacture for microelectromechanical devices
03/12/2009US20090068779 Method for manufacturing nitride semiconductor device
03/12/2009US20090068778 Buried Heterostructure Device Having Integrated Waveguide Grating Fabricated By Single Step MOCVD
03/12/2009US20090068777 Method for manufacturing pixel structure
03/12/2009US20090068776 Method for fabricating semiconductor substrate for optoelectronic components
03/12/2009US20090068775 Method for Fabricating Micro-Lens and Micro-Lens Integrated Optoelectronic Devices Using Selective Etch of Compound Semiconductor
03/12/2009US20090068774 LED Bonding Structures and Methods of Fabricating LED Bonding Structures
03/12/2009US20090068773 Method for fabricating pixel structure of active matrix organic light-emitting diode
03/12/2009US20090068772 Across reticle variation modeling and related reticle
03/12/2009US20090068771 Electro Chemical Deposition Systems and Methods of Manufacturing Using the Same
03/12/2009US20090068770 Tactile surface inspection during device fabrication or assembly
03/12/2009US20090068769 Method and Apparatus for Plasma Processing
03/12/2009US20090068768 Quantification of hydrophobic and hydrophilic properties of materials
03/12/2009US20090068767 Tuning via facet with minimal rie lag
03/12/2009US20090068766 Optical element mounting method and optical element mounting device
03/12/2009US20090068765 Method of manufacturing semiconductor device and apparatus for manufacturing semiconductor device
03/12/2009US20090068764 Semiconductor device and method of manufacturing the same
03/12/2009US20090068763 Method for manufacturing semiconductor device and its manufacturing method
03/12/2009US20090068762 Methods of Processing a Substrate and Forming a Micromagnetic Device
03/12/2009US20090068761 Method of Forming a Micromagnetic Device
03/12/2009US20090068572 Gray scale mask
03/12/2009US20090068556 Battery-operated wireless-communication apparatus and method
03/12/2009US20090068407 Method for producing a monocrystalline si wafer having an approximately polygonal cross-section and corresponding monocrystalline si wafer
03/12/2009US20090068356 High productivity plasma processing chamber
03/12/2009US20090067977 Seal device and method for operating the same and substrate processing apparatus comprising a vacuum chamber
03/12/2009US20090067976 Alignment Assembly
03/12/2009US20090067960 Wafer guide for preventing wafer breakage in semiconductor cleaning apparatus
03/12/2009US20090067959 Substrate processing apparatus, substrate transfer apparatus, substrate clamp apparatus, and chemical liquid treatment apparatus
03/12/2009US20090067958 Stacked process modules for a semiconductor handling system
03/12/2009US20090067957 Transport system with buffering
03/12/2009US20090067956 Cluster tool architecture for processing a substrate
03/12/2009US20090067955 Foup Door Positioning Device for Foup Opener
03/12/2009US20090067954 Automated systems and methods for adapting semiconductor fabrication tools to process wafers of different diameters
03/12/2009US20090067771 High Efficient Silicon-on-Lithium Niobate Modulator
03/12/2009US20090067463 Structures having lattice-mismatched single-crystalline semiconductor layers on the same lithographic level and methods of manufacturing the same
03/12/2009US20090067256 Thin gate stack structure for non-volatile memory cells and methods for forming the same
03/12/2009US20090067234 Flash Memory Device and Fabrication Method Thereof
03/12/2009US20090067228 Phase change memory device, manufacturing method thereof and operating method thereof
03/12/2009US20090067210 Three dimensional structure memory
03/12/2009US20090067114 Non Contact Substrate Chuck
03/12/2009US20090067107 Electrostatic Discharge Protective Circuit and Semiconductor Integrated Circuit Using the Same
03/12/2009US20090067033 Micromachine structure system and method for manufacturing same
03/12/2009US20090066967 Method of measuring micro-structure, micro-structure measurement apparatus, and micro-structure analytical system
03/12/2009US20090066943 Apparatus And Method For Inspecting Pattern
03/12/2009US20090066926 Image forming method and apparatus
03/12/2009US20090066872 Tft substrate, liquid crystal display panel and liquid crystal display device having the substrate, and method of manufacturing tft substrate
03/12/2009US20090066626 Pixel structure and forming method and driving method thereof
03/12/2009US20090066414 Gain control methods and systems in an amplifier assembly
03/12/2009US20090065955 Method and structures for accelerated soft-error testing
03/12/2009US20090065953 Chip module and a fabrication method thereof
03/12/2009US20090065952 Semiconductor Chip with Crack Stop
03/12/2009US20090065951 Stacked die package
03/12/2009US20090065948 Package structure for multiple die stack
03/12/2009US20090065947 Semiconductor device having circularly connected plural pads via through holes and method of evaluating the same
03/12/2009US20090065944 Reworked integrated circuit device and reworking method thereof
03/12/2009US20090065943 Microelectronic Assembly Having Second Level Interconnects Including Solder Joints Reinforced with Crack Arrester Elements and Method of Forming Same
03/12/2009US20090065942 Semiconductor device, display device, and method of manufacturing semiconductor device
03/12/2009US20090065940 Metal wiring of a semiconductor device and method of forming the same
03/12/2009US20090065939 Method for integrating selective ruthenium deposition into manufacturing of a semiconductior device
03/12/2009US20090065938 Semiconductor Element and Method for Manufacturing Same
03/12/2009US20090065937 Structure of high performance combo chip and processing method
03/12/2009US20090065936 Substrate, electronic component, electronic configuration and methods of producing the same
03/12/2009US20090065935 Systems and methods for ball grid array (bga) escape routing
03/12/2009US20090065934 Wiring substrate, tape package having the same, display device having the tape package, method of manufacturing the wiring substrate, method of manufacturing a tape package having the same and method of manufacturing a display device having the tape package
03/12/2009US20090065933 Semiconductor device and method of manufacturing the same
03/12/2009US20090065932 Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby
03/12/2009US20090065931 Packaged integrated circuit and method of forming thereof
03/12/2009US20090065927 Semiconductor Device and Methods of Manufacturing Semiconductor Devices
03/12/2009US20090065923 Semiconductor package with improved size, reliability, warpage prevention, and head dissipation and method for manufacturing the same
03/12/2009US20090065920 Semiconductor package embedded in substrate, system including the same and associated methods
03/12/2009US20090065916 Semiconductor die mount by conformal die coating
03/12/2009US20090065915 Singulated semiconductor package
03/12/2009US20090065914 Semiconductor device with leaderframe including a diffusion barrier
03/12/2009US20090065912 Semiconductor Package and Method of Assembling a Semiconductor Package
03/12/2009US20090065911 Semiconductor package and manufacturing method thereof
03/12/2009US20090065910 Semiconductor device and manufacturing method of the same
03/12/2009US20090065907 Semiconductor packaging process using through silicon vias
03/12/2009US20090065906 Semiconductor device and producing method of the same
03/12/2009US20090065905 Conductive metal structure applied to a module IC and method of manufacturing the same
03/12/2009US20090065904 Substrate having through-wafer vias and method of forming
03/12/2009US20090065902 Method of forming a semiconductor die having a sloped edge for receiving an electrical connector
03/12/2009US20090065901 Semiconductor Element and Manufacturing Method Thereof
03/12/2009US20090065897 Semiconductor device and method of fabricating the same
03/12/2009US20090065896 CAPACITOR HAVING Ru ELECTRODE AND TiO2 DIELECTRIC LAYER FOR SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
1 ... 2262 2263 2264 2265 2266 2267 2268 2269 2270 2271 2272 2273 2274 2275 2276 2277 2278 2279 2280 2281 2282 ... 6590