| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/17/2009 | US7504300 Method for fabricating semiconductor memory device having cylinder type storage node |
| 03/17/2009 | US7504299 Folded node trench capacitor |
| 03/17/2009 | US7504298 Method for forming memory cell and device |
| 03/17/2009 | US7504297 Semiconductor device and a method of manufacturing the same |
| 03/17/2009 | US7504296 Semiconductor memory device and method for fabricating the same |
| 03/17/2009 | US7504295 Methods for fabricating dynamic random access memory cells having laterally offset storage nodes |
| 03/17/2009 | US7504294 Method of manufacturing an electrically erasable programmable read-only memory (EEPROM) |
| 03/17/2009 | US7504293 Fabrication method for semiconductor device |
| 03/17/2009 | US7504292 Short channel effect engineering in MOS device using epitaxially carbon-doped silicon |
| 03/17/2009 | US7504291 MOS transistor on an SOI substrate with a body contact and a gate insulating film with variable thickness |
| 03/17/2009 | US7504290 Thin film transistor array panel for a liquid crystal display and a method for manufacturing the same |
| 03/17/2009 | US7504289 Process for forming an electronic device including transistor structures with sidewall spacers |
| 03/17/2009 | US7504288 Method for laser-processing semiconductor device |
| 03/17/2009 | US7504287 Methods for fabricating an integrated circuit |
| 03/17/2009 | US7504286 Semiconductor memory devices and methods for fabricating the same |
| 03/17/2009 | US7504285 Carrierless chip package for integrated circuit devices, and methods of making same |
| 03/17/2009 | US7504284 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices |
| 03/17/2009 | US7504283 Stacked-flip-assembled semiconductor chips embedded in thin hybrid substrate |
| 03/17/2009 | US7504282 Method of manufacturing the substrate for packaging integrated circuits without multiple photolithography/etching steps |
| 03/17/2009 | US7504281 Substrate based unmolded package |
| 03/17/2009 | US7504279 Method for producing semi-conducting devices and devices obtained with this method |
| 03/17/2009 | US7504278 Image sensor and method for manufacturing the same |
| 03/17/2009 | US7504277 Method for fabricating a high performance PIN focal plane structure using three handle wafers |
| 03/17/2009 | US7504276 Micro device having micro system structure and method for method for manufacturing the same |
| 03/17/2009 | US7504275 Layout design and fabrication of SDA micro motor for low driving voltage and high lifetime application |
| 03/17/2009 | US7504274 Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition |
| 03/17/2009 | US7504273 Scribing method and apparatus of liquid crystal panel, method for fabricating liquid crystal panel |
| 03/17/2009 | US7504272 Method for producing color-converting light-emitting device using electrophoresis |
| 03/17/2009 | US7504271 Integrated circuit package substrate having a thin film capacitor structure |
| 03/17/2009 | US7504270 Methods of quantifying variations resulting from manufacturing-induced corner rounding of various features, and structures for testing same |
| 03/17/2009 | US7504268 Adaptive shape substrate support method |
| 03/17/2009 | US7504267 Apparatus and method for cleaning glass substrates using a cool hydrogen flame |
| 03/17/2009 | US7504266 Magnetic tunnel junction structures and methods of fabrication |
| 03/17/2009 | US7504199 Multilayer wiring pattern of low resistivity metal formed in simple manner at low cost; metals constituting respective layers can be freely selected according to intended application; forming photocatalytic film layer, water-soluble polymer layer, exposing layers to light to form latent image; plating |
| 03/17/2009 | US7504182 Scanning beam of metallic ions over defect to dope to reducing transparency; implanting gallium atoms to reduce transmission and quartz can be etched |
| 03/17/2009 | US7504155 Suppression of chemical reactivity on semiconductor surfaces |
| 03/17/2009 | US7504040 Plasma processing apparatus and plasma processing method |
| 03/17/2009 | US7503983 Partially surrounding surface of the brush with a plurality of meniscus-forming ports in the housing; applying meniscus-forming ports proximate to wafer surface; scrubbing wafer surface using the surface of the brush and simultaneously activating meniscus-forming ports to form a meniscus on wafer surface |
| 03/17/2009 | US7503982 wetting agents comprising mixture of acyclic ethers-2+, acyclic acids-2+ and water, used for removing impurities from surfaces of electronics |
| 03/17/2009 | US7503980 Substrate supporting apparatus |
| 03/17/2009 | US7503978 Substrate processing apparatus and substrate processing method which performs predetermined processing on a substrate which is positioned approximately horizontally at a substrate processing position |
| 03/17/2009 | US7503975 Semiconductor device and fabrication method therefor |
| 03/17/2009 | US7503830 Apparatus for reduction of defects in wet processed layers |
| 03/17/2009 | US7503479 Semiconductor device and an information management system therefor |
| 03/17/2009 | US7503448 Break-away positioning conveyor mount for accommodating conveyor belt bends |
| 03/17/2009 | US7503334 Apparatus and methods for processing semiconductor substrates using supercritical fluids |
| 03/17/2009 | US7503155 Method for packaging a tape substrate |
| 03/17/2009 | US7503112 Methods for manufacturing lead frame connectors for optical transceiver modules |
| 03/12/2009 | WO2009033126A2 Transport system with buffering |
| 03/12/2009 | WO2009033076A1 Transparent nanocrystalline diamond contacts to wide bandgap semiconductor devices |
| 03/12/2009 | WO2009033067A2 Combinatorial process system |
| 03/12/2009 | WO2009032990A1 Polishing apparatus and method for polishing semiconductor wafers using load-unload stations |
| 03/12/2009 | WO2009032960A1 Multi-region processing system and heads |
| 03/12/2009 | WO2009032958A1 Vapor based combinatorial processing |
| 03/12/2009 | WO2009032815A1 Tool for making microstructured articles |
| 03/12/2009 | WO2009032801A1 Polarized broadband wafer inspection |
| 03/12/2009 | WO2009032681A1 Systems and method for simultaneously inspecting a specimen with two distinct channels |
| 03/12/2009 | WO2009032678A1 Semiconductor device and method for manufacturing thereof |
| 03/12/2009 | WO2009032620A1 Sacrificial nitride and gate replacement |
| 03/12/2009 | WO2009032612A1 Quick changeover apparatus and methods for wafer handler |
| 03/12/2009 | WO2009032582A1 Method to reduce residual sti corner defects generated during spe in the fabrication of nano-scale cmos transistors using dsb substrate and hot technology |
| 03/12/2009 | WO2009032576A2 Method to fabricate adjacent silicon fins of differing heights |
| 03/12/2009 | WO2009032575A2 Semiconductor device having reduced single bit fails and a method of manufacture thereof |
| 03/12/2009 | WO2009032566A2 Techniques for terminal insulation in an ion implanter |
| 03/12/2009 | WO2009032539A2 Semiconductor assemblies and methods of manufacturing such assemblies |
| 03/12/2009 | WO2009032536A2 Method for manufacturing a semiconductor die and a semiconductor device comprising the semiconductor die obtained thereby |
| 03/12/2009 | WO2009032530A2 Thickened sidewall dielectric for memory cell |
| 03/12/2009 | WO2009032488A1 Improved low k porous sicoh dielectric and integration with post film formation treatment |
| 03/12/2009 | WO2009032458A1 Method of manufacturing a semiconductor device having improved transistor performance |
| 03/12/2009 | WO2009032448A2 Zwitterionic block copolymers and methods |
| 03/12/2009 | WO2009032411A1 Dual gate oxide device integration |
| 03/12/2009 | WO2009032409A1 Semiconductor device test system having reduced current leakage |
| 03/12/2009 | WO2009032389A1 Method of packaging an integrated circuit die |
| 03/12/2009 | WO2009032344A1 Package for micromirror device |
| 03/12/2009 | WO2009032230A2 A cmos device having gate insulation layers of different type and thickness and method of forming the same |
| 03/12/2009 | WO2009032197A1 Glass-ceramic and glass-ceramic/ceramic composite semiconductor manufacturing article support devices |
| 03/12/2009 | WO2009032095A1 Method and apparatus for diagnosing status of parts in real time in plasma processing equipment |
| 03/12/2009 | WO2009032065A1 Copper cmp composition containing ionic polyelectrolyte and method |
| 03/12/2009 | WO2009031830A2 Exhaust unit, exhaust method using the exhaust unit, and substrate processing apparatus including the exhaust unit |
| 03/12/2009 | WO2009031829A2 Substrate processing apparatus |
| 03/12/2009 | WO2009031828A1 Showerhead, substrate processing apparatus including the showerhead, and plasma supplying method using the showerhead |
| 03/12/2009 | WO2009031731A1 Method and apparatus for recycling photoresist stripper waste |
| 03/12/2009 | WO2009031696A1 Composite substrate for forming light emitting element and method for manufacturing the composite substrate |
| 03/12/2009 | WO2009031681A1 Switching device and method for manufacturing the same |
| 03/12/2009 | WO2009031677A1 Semiconductor device |
| 03/12/2009 | WO2009031656A1 Suspending apparatus and exposure apparatus |
| 03/12/2009 | WO2009031654A1 Drive control method, drive control apparatus, stage control method, stage control apparatus, exposure method, exposure apparatus and measuring apparatus |
| 03/12/2009 | WO2009031586A1 Circuit board and method for manufacturing circuit board |
| 03/12/2009 | WO2009031583A1 Method for manufacturing semiconductor device and semiconductor device |
| 03/12/2009 | WO2009031582A1 Method for manufacturing semiconductor device |
| 03/12/2009 | WO2009031566A1 Method for manufacturing gas supply structure in electrostatic chuck apparatus, gas supply structure in electrostatic chuck apparatus, and electrostatic chuck apparatus |
| 03/12/2009 | WO2009031541A1 Device mounting module and its manufacturing method |
| 03/12/2009 | WO2009031534A1 Manufacturing method of semiconductor laser element |
| 03/12/2009 | WO2009031525A1 Carbon nanotube structure, and thin film transistor |
| 03/12/2009 | WO2009031522A1 Semiconductor element, semiconductor element manufacturing method, and mounting structure having semiconductor element mounted thereon |
| 03/12/2009 | WO2009031520A1 Plasma treatment apparatus, plasma treatment method, and semiconductor element |
| 03/12/2009 | WO2009031515A1 Water-soluble cutting fluid for loose abrasive type wire saw slicing machines, slurry and cutting process |
| 03/12/2009 | WO2009031502A1 Semiconductor device and method for manufacturing the same |
| 03/12/2009 | WO2009031482A1 Semiconductor device and method for manufacturing the same |
| 03/12/2009 | WO2009031472A1 Adhesive and connecting structure using the same |