Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2009
03/19/2009US20090071807 Mems switch and method of fabricating the same
03/19/2009US20090071710 Flip-Chip Component and Method for its Production
03/19/2009US20090071695 Boron nitride agglomerated powder
03/19/2009US20090071605 Method for depositing a film using a charged particle beam, method for performing selective etching using the same, and charged particle beam equipment therefor
03/19/2009US20090071540 Combined etching and doping media
03/19/2009US20090071525 Cooling Hot-Spots by Lateral Active Heat Transport
03/19/2009US20090071404 Method of forming titanium film by CVD
03/19/2009US20090071402 Metal film vapor phase deposition method and vapor phase deposition apparatus
03/19/2009US20090071394 AlxInyGa1-x-yN MIXTURE CRYSTAL SUBSTRATE, METHOD OF GROWING AlxInyGa1-x-yN MIXTURE CRYSTAL SUBSTRATE AND METHOD OF PRODUCING AlxInyGa1-x-yN MIXTURE CRYSTAL SUBSTRATE
03/19/2009US20090070996 Printed circuit board manufacturing method
03/19/2009US20090070946 Apparatus for and method of processing substrate
03/19/2009DE19838574B4 Verfahren zum Herstellen eines Bauelements A method of manufacturing a device
03/19/2009DE19825274B4 Prüfstation mit innerer und äußerer Abschirmung Test station with inner and outer shield
03/19/2009DE19804568B4 Vorrichtung bestehend aus einem Feldeffekttransistor (FET) in Verbindung mit einer Vorspannungs-Versorgungseinrichtung und einem kapazitiven Element und Verfahren zu deren Ansteuerung Device consisting of a field effect transistor (FET) in conjunction with a bias supply means, and a capacitive element and driving method thereof
03/19/2009DE10316552B4 Verfahren zur Herstellung einer Erkennungsvorrichtung für eine dynamische Größe A method for preparing a detection device for dynamic quantity
03/19/2009DE10310646B4 Package mit Substrat hoher Wärmeleitfähigkeit Package substrate with high thermal conductivity
03/19/2009DE10249605B4 Halbleiterspeicherbauelement und Testverfahren The semiconductor memory device and test method
03/19/2009DE10221891B4 Leistungshalbleitervorrichtung Power semiconductor device
03/19/2009DE102008046985A1 Maskenrohling und Verfahren zur Herstellung einer Maske Mask blank and process for the preparation of a mask
03/19/2009DE102007044414A1 Semiconductor component e.g. MOS field effect transistor, has intermediate zones arranged on ditch walls, where intermediate zones are high-impedance with respect to loading compensation zones and drift zones
03/19/2009DE102007043902A1 Method for isolating semiconductor components with metallization of compound, involves separating portions of metallization according to partition into semiconductor components by residual portion of photo resist layer
03/19/2009DE102007043526A1 Verfahren zum Herstellen einer Vielzahl von Chips und entsprechend hergestellter Chip A method of manufacturing a plurality of chips and chip correspondingly produced
03/19/2009DE102006060801B4 Verfahren zur Herstellung eines Chipkartenmoduls und Chipkartenmodul A process for producing a chip card module and the smart card module
03/19/2009DE102004060365B4 Bauelement mit Halbleiterübergang und Verfahren zur Herstellung Component with a semiconductor junction and methods for preparing
03/19/2009DE102004055640B4 LDMOS-Transistorvorrichtung, Integrierter Schaltkreis und Herstellungsverfahren hiervon LDMOS transistor device, integrated circuit and manufacturing method thereof
03/19/2009CA2698119A1 Polymer-ceramic composites with excellent tcc
03/18/2009EP2037721A1 Plasma processing apparatus, plasma processing method and photoelectric conversion element
03/18/2009EP2037508A1 ZnO-BASED SEMICONDUCTOR ELEMENT
03/18/2009EP2037506A1 Variable period, variable composition superlattice and devices including the same
03/18/2009EP2037496A1 Semiconductor device and semiconductor manufacturing method
03/18/2009EP2037495A1 Method for recycling a substrate, laminated wafer fabricating method and suitable recycled donor substrate
03/18/2009EP2037494A2 Method of using pre-applied underfill encapsulant
03/18/2009EP2037493A2 Method of mounting conductive ball and conductive ball mounting apparatus
03/18/2009EP2037492A1 Multiple gate field effect transistor structure and method for fabricating same
03/18/2009EP2037491A1 METHOD OF FORMING TaSiN FILM
03/18/2009EP2037490A2 Method of fabricating a semiconductor device using tilted implants
03/18/2009EP2037489A2 Exposure apparatus and device producing method
03/18/2009EP2037488A1 Pattern formation method, pattern formation device, exposure method, exposure device, and device manufacturing method
03/18/2009EP2037487A1 Apparatus with mobile body, exposure apparatus, exposure method and device manufacturing method
03/18/2009EP2037486A1 Exposure method and apparatus, maintenance method and device manufacturing method
03/18/2009EP2037485A1 Fabrication apparatus and fabrication method of semiconductor device produced by heating a substrate
03/18/2009EP2037484A2 Semiconductor processing parts having apertures with deposited coatings and methods for forming the same
03/18/2009EP2037453A1 Imprint mold structure, imprinting method using the same, and magnetic recording medium
03/18/2009EP2037288A1 Volume lifetime measurement
03/18/2009EP2037137A2 Stage device
03/18/2009EP2037012A1 PROCESS FOR PRODUCING SUBSTRATE OF AlN CRYSTAL, METHOD OF GROWING AlN CRYSTAL, AND SUBSTRATE OF AlN CRYSTAL
03/18/2009EP2037009A2 Method for producing a bonded SOI wafer
03/18/2009EP2037008A1 Solid-phase sheet growing substrate and solid-phase sheet manufacturing method
03/18/2009EP2037006A2 Metal plating composition and method for the deposition of Copper-Zinc-Tin suitable for manufacturing thin film solar cell
03/18/2009EP2036122A2 Memory devices having reduced interference between floating gates and methods of fabricating such devices
03/18/2009EP2036121A2 Wafer platform
03/18/2009EP2036120A2 A novel deposition-plasma cure cycle process to enhance film quality of silicon dioxide
03/18/2009EP2036118A1 Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type
03/18/2009EP2036117A1 Method of manufacturing silicon nanowires using silicon nanodot thin film
03/18/2009EP2036116A1 Adjustable capacity device and process thereof
03/18/2009EP2035518A2 Antireflective coating compositions comprising siloxane polymer
03/18/2009EP2035320A2 System for purging reticle storage
03/18/2009EP2035187A2 Abrasive articles, cmp monitoring system and method
03/18/2009EP2001042A9 Lighting optical system, exposure system, and device production method
03/18/2009EP2000840A9 Projection optical system, exposure apparatus and device manufacturing method
03/18/2009EP1604384B1 Installation for processing a substrate
03/18/2009EP1579482A4 Method and apparatus for planarizing a semiconductor wafer
03/18/2009EP1578559B1 Bonding method
03/18/2009EP1502308A4 Enhanced cutoff frequency silicon germanium transistor
03/18/2009EP1469981B1 Device for cutting a substrate layer, and corresponding method
03/18/2009EP1256030B1 Laser thermal processing apparatus and method
03/18/2009EP1186034B1 Robust interconnect structure
03/18/2009EP1139400B1 Method for machining/cleaning by hydroxide ion in ultrapure water
03/18/2009CN201210490Y Half-round silicon boat for heat processing semi-conductor device
03/18/2009CN201210489Y Compatible rhombic chip boat for heat processing semi-conductor device
03/18/2009CN201210488Y Oblique slot composite chip boat for heat processing semi-conductor device
03/18/2009CN101390253A Ceramic antenna module and methods of manufacture thereof
03/18/2009CN101390215A Junction structure of device
03/18/2009CN101390212A One-time programmable crosspoint memory with a diode as an antifuse
03/18/2009CN101390209A Method to enhance cmos transistor performance by inducing strain in the gate and channel
03/18/2009CN101390208A Contact formation
03/18/2009CN101390207A Mounting method
03/18/2009CN101390206A Electronic module and a method of assembling such a module
03/18/2009CN101390205A Soldering method, soldering apparatus and method for manufacturing semiconductor device
03/18/2009CN101390204A Novel structure and method for metal integration
03/18/2009CN101390203A Interconnect structure and method of fabrication of same
03/18/2009CN101390202A Cap layer for an aluminum copper bond pad
03/18/2009CN101390201A Field effect transistor, and multilayered epitaxial film for use in preparation of field effect transistor
03/18/2009CN101390200A Highly selective doped oxide etchant
03/18/2009CN101390199A Method for forming amorphous carbon film and method for manufacturing semiconductor device using same
03/18/2009CN101390198A Method of etching a silicon-based material
03/18/2009CN101390197A Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device
03/18/2009CN101390196A Gate-coupled eprom cell for printhead
03/18/2009CN101390195A Heat treatment equipment, heater and its manufacturing method
03/18/2009CN101390194A Maintenance method, exposure method and apparatus and device manufacturing method
03/18/2009CN101390193A A method of microminiaturizing a nano-structure
03/18/2009CN101390174A Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure
03/18/2009CN101389788A Process tuning gas injection from the substrate edge
03/18/2009CN101389464A Method and arrangement for forming electronic device
03/18/2009CN101389461A Method of manufacturing a semiconductor device and a semiconductor device produced thereby
03/18/2009CN101389179A Plasmer processing device, plasmer processing method and storage medium
03/18/2009CN101389178A Substrate processing apparatus having electrode member
03/18/2009CN101389161A Heating device
03/18/2009CN101388438A Organic electroluminescent device, fabrication process of organic electroluminescent device, display device, and fabrication process of display device
03/18/2009CN101388436A Patterning method, method of manufacturing organic field effect transistor, and method of manufacturing flexible printed circuit board