Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2015
02/11/2015CN104347524A 半导体器件、半导体晶片结构和形成半导体晶片结构的方法 The method of the semiconductor device, a semiconductor wafer structure formed of a semiconductor wafer structure
02/11/2015CN104347523A 晶体管及其形成方法 Transistor and method of forming
02/11/2015CN104347522A 一种基于iii-v族氮化镓智能功率集成电路的实现方法 A Method iii-v race smart power integrated circuits based on gallium nitride
02/11/2015CN104347521A 半导体器件的制造方法 The method of manufacturing a semiconductor device
02/11/2015CN104347520A 非易失性存储器晶体管和包括该存储器晶体管的设备 Non-volatile memory device includes a transistor and the memory transistor
02/11/2015CN104347519A 使用栅极优先方法集成非易失性存储器和高k及金属栅极 The gate-first approach using integrated nonvolatile memory and high-k and metal gate
02/11/2015CN104347518A 分裂栅非易失性存储器单元 Split-gate nonvolatile memory cell
02/11/2015CN104347517A 半导体结构的形成方法 The method of forming a semiconductor structure
02/11/2015CN104347516A 一种制作嵌入式闪存的方法 A method of making embedded flash
02/11/2015CN104347515A 一种闪存存储器的制备方法 A process for preparing a flash memory
02/11/2015CN104347514A 一种嵌入式闪存的制作方法 An embedded flash production methods
02/11/2015CN104347513A 用于改进的栅极间隔件控制的利用多层外延硬掩膜的cmos制造方法 Methods of manufacturing a multilayer epitaxial cmos hard mask for improving control of the gate spacers
02/11/2015CN104347512A Cmos晶体管的形成方法 The method of forming a transistor Cmos
02/11/2015CN104347511A 半导体器件的形成方法 The method of forming a semiconductor device
02/11/2015CN104347510A 一种半导体器件及其制作的方法 A semiconductor device and method of making the
02/11/2015CN104347509A Cmos器件制造方法及cmos器件 Cmos cmos device manufacturing method and device
02/11/2015CN104347508A 半导体结构及其形成方法 And method of forming a semiconductor structure
02/11/2015CN104347507A 半导体器件的形成方法 The method of forming a semiconductor device
02/11/2015CN104347506A 一种制作半导体器件的方法 A method of fabricating a semiconductor device
02/11/2015CN104347505A 一种制作半导体器件的方法 A method of fabricating a semiconductor device
02/11/2015CN104347504A 混合信号集成电路制造方法 Mixed-signal integrated circuit manufacturing method
02/11/2015CN104347503A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof
02/11/2015CN104347502A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/11/2015CN104347501A 半导体器件的形成方法 The method of forming a semiconductor device
02/11/2015CN104347500A 晶片的分割方法 Segmentation of the wafer
02/11/2015CN104347499A 多源域集成电路以及相关电源管理系统 Multi-source domain of integrated circuits and associated power management system
02/11/2015CN104347498A 薄膜晶体管、其制造方法及制造平板显示器背板的方法 A thin film transistor, a manufacturing method thereof and a method of manufacturing a flat panel display backplanes
02/11/2015CN104347497A 显示装置的制造方法 A display device manufacturing method
02/11/2015CN104347496A 显示面板制作方法 Display panel production methods
02/11/2015CN104347495A 自对准硅化镍的制备方法 Preparation of nickel salicide
02/11/2015CN104347494A 硅通孔金属柱背面互联方法 TSV metallization interconnect the back pillar method
02/11/2015CN104347493A 半导体及其制造方法 The semiconductor manufacturing method thereof
02/11/2015CN104347492A 具有高深宽比的通孔结构及多晶片互联的制造方法 The method of manufacturing a via structure having a high aspect ratio multi-chip interconnection and
02/11/2015CN104347491A 钨沉积的方法 Tungsten deposition method
02/11/2015CN104347490A 硅通孔填充的方法 Silicon vias filling method
02/11/2015CN104347489A 导电插塞的形成方法 A method for forming conductive plug
02/11/2015CN104347488A 互连结构的形成方法 The method of forming an interconnect structure
02/11/2015CN104347487A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
02/11/2015CN104347486A 一种形成接触孔的方法 A method of forming a contact hole
02/11/2015CN104347485A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
02/11/2015CN104347484A 一种半导体器件以及制作半导体器件的方法 A semiconductor device and a method of fabricating a semiconductor device
02/11/2015CN104347483A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof
02/11/2015CN104347482A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof
02/11/2015CN104347481A 金属镀层处理方法 Metal plating treatment method
02/11/2015CN104347480A 半导体结构的制造方法 The method of manufacturing a semiconductor structure
02/11/2015CN104347479A 用于双大马士革结构的蚀刻方法 Etching method for dual damascene structures
02/11/2015CN104347478A 半导体结构的形成方法 The method of forming a semiconductor structure
02/11/2015CN104347477A 半导体结构的形成方法 The method of forming a semiconductor structure
02/11/2015CN104347476A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof
02/11/2015CN104347475A 具有沟槽隔离区的边缘终止结构 Has an edge termination structure trench isolation region
02/11/2015CN104347474A 用于改进的epi分布的利用多层外延硬掩膜的cmos制造方法 Methods of manufacturing a multilayer epitaxial cmos hard mask for improving the distribution of epi
02/11/2015CN104347473A 浅沟槽隔离结构及其形成方法 Shallow trench isolation structure and method of forming
02/11/2015CN104347472A 一种浅沟槽隔离的制造方法 A method for manufacturing a shallow trench isolation
02/11/2015CN104347471A 半导体器件的制备方法 The method for preparing a semiconductor device
02/11/2015CN104347470A 半导体器件的制备方法 The method for preparing a semiconductor device
02/11/2015CN104347469A 热压键合过程中固定多个半导体器件的设备和键合方法 Thermocompression bonding process the plurality of fixing devices and bonding method of a semiconductor device
02/11/2015CN104347468A 衬底固持模块和包含所述衬底固持模块的衬底处理设备 Retaining module substrate and the substrate holding module containing substrate processing apparatus
02/11/2015CN104347467A 衬底固持模块和包含所述衬底固持模块的衬底处理设备 Retaining module substrate and the substrate holding module containing substrate processing apparatus
02/11/2015CN104347466A 晶圆承载装置 Wafer carrying device
02/11/2015CN104347465A 晶圆承载装置 Wafer carrying device
02/11/2015CN104347464A 一种电木吸嘴 One kind of Bakelite nozzle
02/11/2015CN104347463A 经切片的电子零件的搬送装置及搬送方法 After slicing the electronic component conveyance device and transfer method
02/11/2015CN104347462A 回流处理单元及基板处理装置 Reflow treatment unit and the substrate processing apparatus
02/11/2015CN104347461A 用于发光二极管的热传输送装置 Heat transfer means for feeding the light emitting diodes
02/11/2015CN104347460A 晶圆传递腔室 Wafer transfer chamber
02/11/2015CN104347459A 一种盖板、承载装置及等离子体加工设备 One kind of cover, carrying device and a plasma processing apparatus
02/11/2015CN104347458A 一种新型石墨舟 A new graphite boat
02/11/2015CN104347457A 一种适于顶针快速更换的芯片剥离装置 A chip peeling device suitable for rapid replacement thimble
02/11/2015CN104347456A 高压硅堆管芯化学处理装置 High voltage silicon stack die chemical processing device
02/11/2015CN104347455A 光照射装置以及光照射方法 The light irradiation device and light irradiation method
02/11/2015CN104347454A 热处理装置用的腔室及热处理装置 Heat treatment apparatus and heat treatment chamber device
02/11/2015CN104347453A 处理基板的装置和方法 A substrate processing apparatus and method
02/11/2015CN104347452A 回流处理单元及基板处理装置 Reflow treatment unit and the substrate processing apparatus
02/11/2015CN104347451A 基板处理系统、包含在系统中的层压装置及基板处理方法 A substrate processing system, the system comprising a laminated substrate processing apparatus and method
02/11/2015CN104347450A 一种半导体干燥装置及方法 A semiconductor device and method for drying
02/11/2015CN104347449A 一种剥离装置及剥离方法 An apparatus and method for peeling peeling
02/11/2015CN104347448A 半导体测试治具的形成方法 The method for forming a semiconductor test fixture
02/11/2015CN104347447A 一种eva交联率的测试方法 One kind of test method eva cross-linking rate
02/11/2015CN104347446A 半导体结构中的温度监视和控制 Semiconductor structure to monitor and control temperature
02/11/2015CN104347445A 探测装置 Detection device
02/11/2015CN104347444A 用于测试磁场传感器的装置及其方法 Apparatus and method for testing the magnetic field sensor
02/11/2015CN104347443A 一种晶圆套刻的水平方向突变的测试方法 Test method for wafer overlay horizontal mutations
02/11/2015CN104347442A 一种检测经平坦化处理的晶片的平坦程度的方法 A flattening process by the degree of flatness of a wafer detection method
02/11/2015CN104347441A 离子注入的监控方法 A method of monitoring ion implantation
02/11/2015CN104347440A 用于建立材料锁合连接和功率半导体模块的方法 Material lock connection for establishing the power semiconductor module and a method
02/11/2015CN104347439A 打线结构的制法 Wire structure system of law
02/11/2015CN104347438A 玻璃基板与金属基板的结合方法 Combined with a glass substrate and the metal substrate
02/11/2015CN104347437A 制造半导体器件的方法 The method of manufacturing a semiconductor device
02/11/2015CN104347436A 倒装芯片接合装置 Flip-chip bonding means
02/11/2015CN104347435A 吸附筒夹和芯片接合器 And chip suction collet adapter
02/11/2015CN104347434A 用于制造芯片布置的方法和芯片布置 The method for manufacturing the chip layout and chip layout
02/11/2015CN104347433A 基板封装件及其制造方法 Package and method of manufacturing the substrate
02/11/2015CN104347432A 用于注入与吸出半导体模块封装用液体的工装结构 Injection and aspiration for the semiconductor module package with tooling structure of liquid
02/11/2015CN104347431A 一种暴露器件顶面和底面的封装结构及其制作方法 A device the top and bottom of the package structure and production methods exposed
02/11/2015CN104347430A 芯片引脚的制作方法 Pin chip production methods
02/11/2015CN104347429A 微通道热沉的制造方法 Manufacturing method microchannel heat sink
02/11/2015CN104347428A 制造半导体器件的方法及半导体器件 The method of manufacturing a semiconductor device and semiconductor device
02/11/2015CN104347427A 一种鳍式场效应晶体管的制造方法 A method of manufacturing a fin-type field effect transistor
02/11/2015CN104347426A 形成用于晶体管的替换闸极结构的方法及其造成的装置 The method of forming the replacement gate structure for the transistor and the apparatus caused by
02/11/2015CN104347425A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
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