| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/04/2015 | CN104335354A 薄膜晶体管的半导体层用氧化物、薄膜晶体管、显示装置及溅射靶 The semiconductor thin-film transistor with an oxide layer, a thin film transistor, a display device, and sputtering target |
| 02/04/2015 | CN104335353A 薄膜晶体管 Thin film transistor |
| 02/04/2015 | CN104335349A 具有纳米线存取晶体管的dram Access transistor having a nanowire dram |
| 02/04/2015 | CN104335348A 用于集成电路中的双向esd保护的设备和方法 IC bidirectional esd protection device and method for |
| 02/04/2015 | CN104335340A 晶片堆叠的组装 Wafer stack assembly |
| 02/04/2015 | CN104335339A 顺应性的微型器件转移头部 Compliance micro device transfer head |
| 02/04/2015 | CN104335338A 氧化防止气体吹出单元 Antioxidant gas blowing unit |
| 02/04/2015 | CN104335337A 接合装置及半导体装置的制造方法 The method of manufacturing a semiconductor device bonding apparatus and |
| 02/04/2015 | CN104335336A 覆晶接合器以及覆晶接合方法 Flip chip bonding and flip chip bonding method is |
| 02/04/2015 | CN104335335A 半导体构造及形成半导体构造的方法 The semiconductor structure and a method of forming a semiconductor structure |
| 02/04/2015 | CN104335334A 具有改进跨接的耦合栅的分栅型非易失性浮栅存储单元阵列 Sub-gate type non-volatile floating gate memory cell array having improved crossovers coupling grating |
| 02/04/2015 | CN104335333A 含金属氧化物半导体层的制造方法和电子设备 An electronic device manufacturing method and a metal oxide semiconductor layer |
| 02/04/2015 | CN104335332A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 02/04/2015 | CN104335331A 悬浮液、研磨液套剂、研磨液、基体的研磨方法及基体 Suspensions, the polishing liquid set, the polishing liquid, the polishing method of substrate and substrate |
| 02/04/2015 | CN104335330A 半导体晶片的洗净方法 A method for cleaning a semiconductor wafer |
| 02/04/2015 | CN104335329A 半导体晶片加工用胶带 Semiconductor wafer processing tape |
| 02/04/2015 | CN104335328A 碳化硅半导体装置的制造方法以及由该方法制造的碳化硅半导体装置 The method of manufacturing a silicon carbide semiconductor device and a silicon carbide semiconductor device manufactured by the method of |
| 02/04/2015 | CN104335327A 用于热电应用的纳米颗粒压实体材料 Nanoparticles for thermoelectric applications compacts material |
| 02/04/2015 | CN104335326A 紧密式安瓿热管理系统 Tightly ampoule thermal management system |
| 02/04/2015 | CN104335325A 涂覆有钝化层的硅晶片 Coated with a passivation layer of the silicon wafer |
| 02/04/2015 | CN104335324A 基于恒定自旋螺旋的自旋逻辑 Based on constant spin spiral spin logic |
| 02/04/2015 | CN104335119A 图案形成方法、光化射线敏感或放射线敏感树脂组合物、抗蚀剂膜、电子器件的制造方法以及电子器件 Pattern forming method, an actinic ray-sensitive or radiation-sensitive resin composition, a resist film, a method of manufacturing an electronic device, and electronic device |
| 02/04/2015 | CN104335021A 波前测量方法及装置、以及曝光方法及装置 Wavefront measurement method and device, and exposure method and apparatus |
| 02/04/2015 | CN104334706A 具有改进的阻挡层相容性和清洁性能的cpm后配制物 After having improved barrier properties of compatibility and cleaning formulations cpm |
| 02/04/2015 | CN104334675A 悬浮液、研磨液套剂、研磨液、基体的研磨方法及基体 Suspensions, the polishing liquid set, the polishing liquid, the polishing method of substrate and substrate |
| 02/04/2015 | CN104334674A 包含氧化锆颗粒的cmp组合物及使用方法 Cmp compositions and methods of use comprising zirconium oxide particles |
| 02/04/2015 | CN104334333A 光学构件的制造方法、光学构件、带有保护膜的光学构件以及光学面板的制造方法 The method of manufacturing an optical member, the optical member, with a method for producing a protective film of an optical member and the optical panel |
| 02/04/2015 | CN104334286A 喷嘴单元以及具有该喷嘴单元的基板处理设备 Nozzle unit and the substrate processing apparatus having a nozzle unit |
| 02/04/2015 | CN104332541A 图形化衬底及其制备方法、外延片制作方法及外延片 -Patterned substrate and its preparation method, wafer and wafer production methods |
| 02/04/2015 | CN104332533A Led透镜封装工艺 Led lens packaging process |
| 02/04/2015 | CN104332526A 一种制备黑硅的方法 A method for the preparation of black silicon |
| 02/04/2015 | CN104332504A 一种GaN基异质结肖特基二极管器件及其制作方法 One kind of GaN-based heterostructure Schottky diode device and manufacturing method thereof |
| 02/04/2015 | CN104332503A 一种高压快恢复二极管芯片及其生产工艺 A high voltage fast recovery diode chip and its manufacturing process |
| 02/04/2015 | CN104332502A 一种互补隧穿场效应晶体管及其制作方法 A complementary tunneling field effect transistor and its manufacturing method |
| 02/04/2015 | CN104332501A Nldmos器件及其制造方法 Nldmos device and manufacturing method |
| 02/04/2015 | CN104332500A 一种阻变栅隧穿场效应晶体管及制备方法 A resistor variable gate tunneling field effect transistor and method of preparation |
| 02/04/2015 | CN104332499A 一种vdmos器件及其终端结构的形成方法 Vdmos device and method for forming a terminal structure |
| 02/04/2015 | CN104332498A 一种斜场板功率器件及斜场板功率器件的制备方法 Preparation of a field plate oblique oblique field plate power devices and power devices |
| 02/04/2015 | CN104332495A 一种绝缘栅双极晶体管及其制造方法 An insulated gate bipolar transistor and its manufacturing method |
| 02/04/2015 | CN104332494A 一种绝缘栅双极晶体管及其制造方法 An insulated gate bipolar transistor and its manufacturing method |
| 02/04/2015 | CN104332492A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 02/04/2015 | CN104332491A 采用金属延伸、多晶截止场板的终端单元结构及制造方法 Metal extension, the terminal unit structure and manufacturing method of a polycrystalline cutoff field plate |
| 02/04/2015 | CN104332487A 一种显示屏及其制备方法 One kind of display and its preparation method |
| 02/04/2015 | CN104332478A 阵列基板及其制作方法、显示装置 Array substrate and method of manufacturing the display device |
| 02/04/2015 | CN104332477A 薄膜晶体管组件、阵列基板及其制作方法、和显示装置 Thin film transistor component array substrate and production methods, and display devices |
| 02/04/2015 | CN104332476A 单元像素、阵列基板、显示装置及其制造方法 The unit pixels, the array substrate, a display device and manufacturing method thereof |
| 02/04/2015 | CN104332475A 阵列基板及其制作方法、显示装置 Array substrate and method of manufacturing the display device |
| 02/04/2015 | CN104332474A 一种阵列基板及其制作方法和显示装置 One kind of array substrate and a display device and manufacturing method thereof |
| 02/04/2015 | CN104332473A 一种阵列基板、其制备方法、显示面板和显示装置 An arrayed substrate, its preparation method, a display panel and a display device |
| 02/04/2015 | CN104332471A 一种sonos闪存器件及其编译方法 One kind of flash devices and compile method sonos |
| 02/04/2015 | CN104332470A 一种集成电路装置 An integrated circuit device |
| 02/04/2015 | CN104332469A n沟道非易失性存储元件及其编译方法 n-channel non-volatile storage element and compiled method |
| 02/04/2015 | CN104332465A 一种3d封装结构及其工艺方法 One kind of 3d package structure and process methods |
| 02/04/2015 | CN104332464A 一种功率器件与控制器件的集成工艺 An integrated process control devices and power devices |
| 02/04/2015 | CN104332462A 一种芯片倾斜堆叠的圆片级封装单元及其封装方法 A chip tilt unit stacked wafer level packaging and packaging method |
| 02/04/2015 | CN104332460A 沟槽形貌监控方法以及沟槽形貌监控结构制作方法 Trench morphology monitoring methods and method of making the trench structure morphology monitoring |
| 02/04/2015 | CN104332458A 功率芯片互连结构及其互连方法 Power chip interconnect structure and interconnection method |
| 02/04/2015 | CN104332457A 高密度IO互连PoP堆叠封装结构及其制造工艺 High-density IO Interconnect PoP stacked package structure and manufacturing process |
| 02/04/2015 | CN104332456A 晶圆级扇出型堆叠封装结构及其制造工艺 Fan-out wafer level stacked package structure and manufacturing process |
| 02/04/2015 | CN104332455A 一种基于硅通孔的片上半导体器件结构及其制备方法 An on-chip silicon vias semiconductor device structure based on its preparation method |
| 02/04/2015 | CN104332450A 用于玻璃胶涂布的掩膜板和采用该掩膜板的涂布方法 Mask for glass, plastic coating and the coating method using the mask plate |
| 02/04/2015 | CN104332448A 溢出通路 Overflow passage |
| 02/04/2015 | CN104332447A 电极的构造,构成材料及其制造方法 Electrode configuration, the constituent material and manufacturing method thereof |
| 02/04/2015 | CN104332444A 在3d管芯对管芯堆叠过程中管芯翘曲的解决方案 In 3d die stack of die during die warpage solution |
| 02/04/2015 | CN104332443A Sonos器件的工艺方法 Process for Sonos devices |
| 02/04/2015 | CN104332442A 一种锗基cmos的制备方法 One kind of production method, a germanium-cmos |
| 02/04/2015 | CN104332441A 生产半导体器件的方法 The method of manufacturing a semiconductor device |
| 02/04/2015 | CN104332440A 液晶面板取放装置 LCD panel handling equipment |
| 02/04/2015 | CN104332439A 一种晶片盘推送装置 A wafer tray pusher |
| 02/04/2015 | CN104332438A 太阳能硅片传送矫正机构 Solar wafer transfer correctional institutions |
| 02/04/2015 | CN104332437A 基于塑封式ipm引线框架的料盒结构 Based on the structure of plastic-type material box ipm leadframe |
| 02/04/2015 | CN104332436A 一种刻蚀机内部的水冷卡盘结构 Water-cooled chuck structure inside a etcher |
| 02/04/2015 | CN104332435A 一种半导体工艺设备的参数调整方法 Parameter adjustment method of a semiconductor process equipment |
| 02/04/2015 | CN104332434A 旋转工作台的吸嘴升降驱动机构 Rotary table nozzle elevation drive mechanism |
| 02/04/2015 | CN104332433A 一种清针片及其清针方法 An acupuncture needle method clean sheet and clear |
| 02/04/2015 | CN104332432A 一种新型贴蜡装置及其加工方法 A novel apparatus and method of processing paste wax |
| 02/04/2015 | CN104332431A 一种led芯片退火装置 One kind of led chip annealing device |
| 02/04/2015 | CN104332430A 一种硅片在线称重控制系统及其控制方法 One kind of silicon-line weighing control system and control method |
| 02/04/2015 | CN104332429A 一种提高外延机台产能的装置与方法 An apparatus and method for improving epitaxy machine capacity |
| 02/04/2015 | CN104332428A 基于激光热应力成形的芯片引脚整形装置及方法 Chip pin shaping device and method of forming a laser-based thermal stress |
| 02/04/2015 | CN104332427A 具有等离子体能力的半导体反应室 A semiconductor plasma reaction chamber capacity |
| 02/04/2015 | CN104332426A 非接触式扫描抛光片表面粗糙度的检测设备和检测方法 Non-contact scanning polished surface roughness testing equipment and testing methods |
| 02/04/2015 | CN104332425A 硅片表面金属离子测试装置 The silicon surface of the metal ion testing device |
| 02/04/2015 | CN104332424A 太阳能组件静压测试机 Solar modules hydrostatic testing machine |
| 02/04/2015 | CN104332423A 一种多功能综合检测网版 A multifunctional Comprehensive Test Screen |
| 02/04/2015 | CN104332422A 一种不同方向集成电路版图的缺陷检测方法 Defect detection method for integrated circuit layout in different directions |
| 02/04/2015 | CN104332421A 一种检测扫描机台的性能方法 A method of scanning machine performance testing |
| 02/04/2015 | CN104332420A 用于多晶硅层的失效点定位的方法 Failure point positioning method for polycrystalline silicon layer |
| 02/04/2015 | CN104332419A 倒装形式的芯片封装方法 Flip-chip packaging method form |
| 02/04/2015 | CN104332418A 芯片级封装方法 Chip-level packaging method |
| 02/04/2015 | CN104332417A 内埋式半导体封装件的制作方法 Production methods within the buried semiconductor package |
| 02/04/2015 | CN104332416A 一种柔性显示器的制备方法和柔性显示器 Method for preparing a flexible display and a flexible display |
| 02/04/2015 | CN104332415A 一种半导体芯片的安装定位方法及定位制具 Positioning a semiconductor chip mounting method and positioning system with |
| 02/04/2015 | CN104332414A 嵌入式芯片的制造方法 Manufacture of embedded chips |
| 02/04/2015 | CN104332413A 一体化集成t/r组件芯片的3d组装方法 3d one integrated assembly method t / r chip components |
| 02/04/2015 | CN104332412A 封装基板、封装结构以及封装基板的制作方法 The method of making a package substrate, the package structure and the package substrate |
| 02/04/2015 | CN104332411A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 02/04/2015 | CN104332410A 一种鳍式场效应晶体管的制造方法 A method of manufacturing a fin-type field effect transistor |
| 02/04/2015 | CN104332409A 基于深n阱工艺隔离隧穿场效应晶体管的制备方法 Preparation wear based field effect transistor isolation tunnel deep n-well process |
| 02/04/2015 | CN104332408A 一种鳍式场效应晶体管鳍部的制作方法 A method of manufacturing FinFET fin portion |