Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2015
02/12/2015WO2015020176A1 Connection terminal, power module, and energization unit
02/12/2015WO2015020161A1 SELF-STANDING GaN SUBSTRATE, GaN CRYSTAL, METHOD FOR PRODUCING GaN SINGLE CRYSTAL, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
02/12/2015WO2015020089A1 Horizontal multi-joint robot and production method for horizontal multi-joint robot
02/12/2015WO2015020088A1 Industrial robot
02/12/2015WO2015020082A1 Polishing tool and processing method for member
02/12/2015WO2015020071A1 Industrial robot
02/12/2015WO2015019971A1 Peeling method
02/12/2015WO2015019961A1 Resist underlayer film forming composition containing polymer which contains nitrogen-containing ring compound
02/12/2015WO2015019931A1 Solid state image pickup device and image pickup device
02/12/2015WO2015019923A1 Stamper for microcontact printing and method for producing structure using same
02/12/2015WO2015019911A1 Slurry for cmp
02/12/2015WO2015019893A1 Circulation cooling and heating device
02/12/2015WO2015019879A1 Method for producing substrate for holding wafer, and substrate for holding wafer
02/12/2015WO2015019877A1 Polishing material, polishing material slurry
02/12/2015WO2015019868A1 Sheet member conveyance device, sheet member support device, sheet member inspection device, and sheet member conveyance method
02/12/2015WO2015019864A1 Supporting air plate and gas flow resistor therefor
02/12/2015WO2015019862A1 Trench gate mos semiconductor device and method for manufacturing same
02/12/2015WO2015019857A1 Semiconductor device, display device, and method for manufacturing semiconductor device
02/12/2015WO2015019849A1 Slurry for cmp
02/12/2015WO2015019848A1 Slurry for cmp
02/12/2015WO2015019846A1 Resin sheet for hollow electronic device encapsulation and method for manufacturing hollow electronic device package
02/12/2015WO2015019817A1 Method for producing semiconductor package
02/12/2015WO2015019816A1 Method for producing semiconductor package
02/12/2015WO2015019771A1 Oxide semiconductor layer and production method therefor, oxide semiconductor precursor, oxide semiconductor layer, semiconductor element, and electronic device
02/12/2015WO2015019765A1 Plasma processing device and plasma processing method
02/12/2015WO2015019763A1 Group of separator-provided electronic-device-sealing resin sheets, and method for selecting separator-provided electronic-device-sealing resin sheet
02/12/2015WO2015019734A1 Silicon carbide semiconductor substrate, method for producing same, and method for producing silicon carbide semiconductor device
02/12/2015WO2015019733A1 Silicon carbide semiconductor substrate, method for producing same, and method for producing silicon carbide semiconductor device
02/12/2015WO2015019731A1 Silicon carbide semiconductor device
02/12/2015WO2015019717A1 Method for producing metal oxide film and method for producing transistor
02/12/2015WO2015019707A1 Silicon carbide semiconductor substrate, method for producing same, and method for producing silicon carbide semiconductor device
02/12/2015WO2015019706A1 Method for producing polished object and composition kit for polishing
02/12/2015WO2015019677A1 Semiconductor device manufacturing method
02/12/2015WO2015019540A1 Semiconductor element substrate, and method for producing same
02/12/2015WO2015019539A1 Method for manufacturing recycled substrate
02/12/2015WO2015019519A1 Dc-dc converter module
02/12/2015WO2015019470A1 Semiconductor device
02/12/2015WO2015019469A1 Semiconductor device
02/12/2015WO2015019444A1 Semiconductor device manufacturing method and semiconductor device
02/12/2015WO2015019411A1 Semiconductor integrated circuit device
02/12/2015WO2015019242A2 Illumination device
02/12/2015WO2015019018A1 Process, stack and assembly for separating a structure from a substrate by electromagnetic radiation
02/12/2015WO2015018784A1 Process for manufacturing a semiconductor structure with temporary bonding via metal layers
02/12/2015WO2015018717A1 Method for dividing a composite into semiconductor chips, and semiconductor chip
02/12/2015WO2015018643A1 Method for structuring and planarizing a layer sequence
02/12/2015WO2015018637A1 Silicate aerogel and method for the production thereof
02/12/2015WO2015018174A1 First-etched and later-packaged three-dimensional system-in- package normal chip stack package structure and processing method thereof
02/12/2015WO2015018173A1 First-packaged and later-etched normal chip three dimension system-in-package metal circuit board structure and processing method thereof
02/12/2015WO2015018170A1 Strip-shaped cellular structure of vdmos device and manufacturing method therefor
02/12/2015WO2015018145A1 Packaging-before-etching flip chip 3d system-level metal circuit board structure and technique thereof
02/12/2015WO2015018144A1 Etching-before-packaging horizontal chip 3d system-level metal circuit board structure and technique thereof
02/12/2015WO2015018143A1 Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological method
02/12/2015WO2015018130A1 Mosfet structure and manufacturing method therefor
02/12/2015WO2015017959A1 First-packaged and later-etched three-dimensional flip-chip system-in-package structure and processing method therefor
02/12/2015WO2015017933A1 Displacement devices and methods and apparatus for detecting and estimating motion associated with same
02/12/2015WO2015017899A1 A silicon carbide etching process
02/12/2015US20150045936 System and method for modular controller assembly supporting redundant configurations
02/12/2015US20150044947 Method of polishing a new or a refurbished electrostatic chuck
02/12/2015US20150044883 Composition for forming silica based insulating layer, silica based insulating layer and method for manufacturing silica based insulating layer
02/12/2015US20150044882 Flowable oxide film with tunable wet etch rate
02/12/2015US20150044881 Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
02/12/2015US20150044880 Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and program
02/12/2015US20150044879 Removing method
02/12/2015US20150044878 Semiconductor Processing System Having Multiple Decoupled Plasma Sources
02/12/2015US20150044877 Etching method
02/12/2015US20150044876 Resist underlayer film forming composition containing phenylindole-containing novolac resin
02/12/2015US20150044875 Method of forming pattern
02/12/2015US20150044874 Pattern formation method
02/12/2015US20150044873 Silicon containing confinement ring for plasma processing apparatus and method of forming thereof
02/12/2015US20150044872 SiCN and SiN Polishing Slurries and Polishing Methods Using The Same
02/12/2015US20150044871 Method for increasing adhesion of copper to polymeric surfaces
02/12/2015US20150044870 Method of manufacturing a semiconductor device using a self-aligned opl replacement contact and patterned hsq and a semiconductor device formed by same
02/12/2015US20150044869 Method to improve semiconductor surfaces and polishing
02/12/2015US20150044868 Semiconductor devices including spacers on sidewalls of conductive lines and methods of manufacturing the same
02/12/2015US20150044867 Barrier Layer for Copper Interconnect
02/12/2015US20150044866 Interconnection of several levels of a stack of supports for electronic components
02/12/2015US20150044865 Methods of making integrated circuits including air gaps around interconnect structures
02/12/2015US20150044862 Phase changing on-chip thermal heat sink
02/12/2015US20150044861 Gate silicidation
02/12/2015US20150044860 Multi-tiered semiconductor apparatuses including residual silicide in semiconductor tier
02/12/2015US20150044859 Compound semiconductor integrated circuit and method to fabricate same
02/12/2015US20150044858 Film-forming material
02/12/2015US20150044857 Dividing method for wafer
02/12/2015US20150044856 Method of separating semiconductor die using material modification
02/12/2015US20150044855 Methods of forming spacers on finfets and other semiconductor devices
02/12/2015US20150044854 Semiconductor device and method of fabricating the same
02/12/2015US20150044848 High voltage hybrid polymeric-ceramic dielectric capacitor
02/12/2015US20150044847 Method of manufacturing an integrated circuit
02/12/2015US20150044845 Method for forming metal semiconductor alloys in contact holes and trenches
02/12/2015US20150044843 Semiconductor fin on local oxide
02/12/2015US20150044842 Integrating Junction Formation of Transistors with Contact Formation
02/12/2015US20150044841 Method for forming doped areas under transistor spacers
02/12/2015US20150044840 Method for producing silicon carbide semiconductor device
02/12/2015US20150044839 Photoresist stripping and cleaning composition, method of its preparation and its use
02/12/2015US20150044838 Gate depletion drain extended mos transistor
02/12/2015US20150044837 Trench Power MOSFET
02/12/2015US20150044835 Nonvolatile semiconductor memory device and method for manufacturing same
02/12/2015US20150044834 Transistors, Semiconductor Constructions, and Methods of Forming Semiconductor Constructions
02/12/2015US20150044833 Dense arrays and charge storage devices
02/12/2015US20150044831 Semiconductor process
1 ... 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 ... 6590