Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2015
02/19/2015US20150048460 Gate structure for semiconductor device
02/19/2015US20150048458 Semiconductor device and manufacturing method thereof
02/19/2015US20150048457 Mask Optimization for Multi-Layer Contacts
02/19/2015US20150048456 Metal gate features of semiconductor die
02/19/2015US20150048450 Semiconductor device and method for manufacturing semiconductor device
02/19/2015US20150048441 Semiconductor arrangement with one or more semiconductor columns
02/19/2015US20150048437 Semiconductor memory device and method for manufacturing the same
02/19/2015US20150048434 Structure and Method of Manufacturing a Stacked Memory Array for Junction-Free Cell Transistors
02/19/2015US20150048433 Contact Formation for Split Gate Flash Memory
02/19/2015US20150048431 Method for forming a contact on a semiconductor substrate and semiconductor device
02/19/2015US20150048429 Sidewall image transfer with a spin-on hardmask
02/19/2015US20150048424 Standard cell layout, semiconductor device having engineering change order (eco) cells and method
02/19/2015US20150048422 A method for forming a crystalline compound iii-v material on a single element substrate
02/19/2015US20150048420 Integrated Circuit with First and Second Switching Devices, Half Bridge Circuit and Method of Manufacturing
02/19/2015US20150048415 Semiconductor device and manufacturing method of the same
02/19/2015US20150048385 Light emitting diode substrate
02/19/2015US20150048383 Silicon carbide semiconductor element and fabrication method thereof
02/19/2015US20150048382 Silicon carbide semiconductor device and method for manufacturing the same
02/19/2015US20150048381 Method for the reuse of gallium nitride epitaxial substrates
02/19/2015US20150048380 Optical substrate, semiconductor light-emitting element and method of manufacturing semiconductor light-emitting element
02/19/2015US20150048373 Method and layout for detecting die cracks
02/19/2015US20150048371 Method for manufacturing semiconductor device
02/19/2015US20150048360 Semiconductor device and semiconductor device manufacturing method
02/19/2015US20150048313 Strip-shaped gate tunneling field effect transistor with double-diffusion and a preparation method thereof
02/19/2015US20150048310 System and method for providing an electron blocking layer with doping control
02/19/2015US20150048301 Engineered substrates having mechanically weak structures and associated systems and methods
02/19/2015US20150048282 Transparent compound semiconductor and production method therefor
02/19/2015US20150048062 Dynamic optical valve for mitigating non-uniform heating in laser processing
02/19/2015US20150047788 Automatic tape setting apparatus
02/19/2015US20150047784 Method for applying a temporary bonding layer
02/19/2015US20150047783 Pressure transfer plate for pressure transfer of a bonding pressure
02/19/2015US20150047677 Substrate processing apparatus and heater cleaning method
02/19/2015US20150047674 Method and apparatus for removal of photoresist using improved chemistry
02/19/2015US20150047430 Integrated humidity sensor and method for the manufacture thereof
02/19/2015US20150047417 Core-shell nanoparticle, method of fabricating the same and gas sensor using the same
02/19/2015DE112013002901T5 Herstellungsverfahren für Halbleiterwafer Manufacturing method for semiconductor wafers
02/19/2015DE112013002558T5 Halbleiterbauelement Semiconductor device
02/19/2015DE112013002538T5 Halbleiterbauelement Semiconductor device
02/19/2015DE112013002516T5 Halbleitervorrichtung Semiconductor device
02/19/2015DE112013002353T5 Außenumfangspoliervorrichtung für scheibenförmige Werkstücke Outer circumference polishing apparatus for disc-shaped workpieces
02/19/2015DE112013002217T5 IGBT (Insulated Gate Bipolar Transistor - Bipolartransistor mit isoliertem Gate) mit hoher Emitter-Gate-Kapazität IGBT (Insulated Gate Bipolar Transistor - insulated gate bipolar transistor) of high emitter-gate capacitance
02/19/2015DE112013001555T5 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device
02/19/2015DE112008002615B4 Verfahren zur Prüfung eines Testsubstrats unter definierten thermischen Bedingungen und thermisch konditionierbarer Prober A method for testing of a test substrate under defined thermal conditions and thermal conditionable Prober
02/19/2015DE10318921B4 Herstellungsverfahren für eine Halbleitereinrichtung Manufacturing method of a semiconductor device
02/19/2015DE102014216337A1 Bearbeitungsvorrichtung Processing apparatus
02/19/2015DE102014111653A1 Integrierte Schaltung mit ersten und zweiten Schaltvorrichtungen, Halbbrückenschaltung und Verfahren zur Herstellung An integrated circuit comprising first and second switching devices, half-bridge circuit and methods for making
02/19/2015DE102014111279A1 Halbleiterchip mit integrierten Serienwiderständen Semiconductor chip with integrated series resistors
02/19/2015DE102014110933A1 Mehrchip-Gehäuse auf Glasbasis Multi-chip package on glass base
02/19/2015DE102013216282A1 Elektrisches Bauteil mit einer elektrisch zu kontaktierenden Stelle sowie Verfahren zur Vorbereitung eines elektrischen Bauteils für einen Lötprozess Electrical component with an electrically contacting point, as well as process for preparing an electrical component for a soldering process
02/19/2015DE102013216195A1 Verfahren zur Nachdotierung einer Halbleiterscheibe A method for subsequent doping of a semiconductor wafer
02/19/2015DE102013214877A1 Verfahren zum Herstellen eines Abdeckelements und eines optoelektronischen Bauelements, Abdeckelement und optoelektronisches Bauelement A method for manufacturing a cover member and an optoelectronic component, cover member and optoelectronic device
02/19/2015DE102013214436A1 Verfahren zum Bilden einer Halbleiterstruktur, die silizidierte und nicht silizidierte Schaltkreiselemente umfaßt A method of forming a semiconductor structure, the silicided and non-silicided circuit elements comprises
02/19/2015DE102013214400A1 Herstellung eines Schichtelements für einen optoelektronischen Halbleiterchip Producing a layered element for an optoelectronic semiconductor chip
02/19/2015DE102013107875A1 Substrathaltevorrichtung und Prozesskammer Substrate holder and process chamber
02/19/2015DE102013104015B4 Verfahren für die Ausbildung eines Halbleiterbauteils A method for forming a semiconductor device
02/19/2015DE102013016697A1 Chipmontage Chip Assembly
02/19/2015DE102013011968A1 Elektrische Prüfeinrichtung für eine elektrische Berührungskontaktierung eines elektrischen Prüflings Electrical test equipment for electrical touch contacting an electrical device under test
02/19/2015DE102011075232B4 Verfahren zum Herstellen von n-dotierten Silizium-haltigen Schichten und entsprechend hergestellte Schichten A process for producing n-doped silicon-containing layers and layers produced in accordance with
02/19/2015DE102011002423B4 Verfahren zum Herstellen einer organischen lichtemittierenden Anzeigeeinrichtung A method of manufacturing an organic light emitting display device
02/19/2015DE102007055880B4 Verfahren zur Herstellung eines Isoliermaterials, insbesondere in einer Halbleiteranordnung A process for producing an insulating material, particularly in a semiconductor device
02/19/2015DE102006005875B4 Halbleitersubstrat mit Gettereffekt, Herstellungsverfahren und Verwendung Semiconductor substrate having gettering, production method and use
02/19/2015DE102005055302B4 Multi-Bit-Speicherelement mit einer Grabenstruktur und Verfahren zum Herstellen eines Multi-Bit-Speicherelementes mit einer Grabenstruktur Multi-bit storage element with a grave structure and method of manufacturing a multi-bit memory element with a structure grave
02/19/2015DE102005029130B4 Vorrichtung und Verfahren zum Auftragen von Klebstoff auf ein Substrat Apparatus and method for applying adhesive to a substrate
02/18/2015EP2838328A1 Ball mounting method and substrate-working machine
02/18/2015EP2838130A1 Light extraction body for semiconductor light-emitting element, and light-emitting element
02/18/2015EP2838120A1 Graded band gap p-n homojunction formation method in silicon
02/18/2015EP2838118A1 Electronic device, method for manufacturing same, and image display device
02/18/2015EP2838116A1 Stacked packaging structure
02/18/2015EP2838113A1 Complementary gallium nitride integrated circuits and methods of their fabrication
02/18/2015EP2838112A1 Etching method
02/18/2015EP2838111A1 Methods for cleaning a wafer edge including a notch
02/18/2015EP2838110A1 Polishing apparatus
02/18/2015EP2837969A1 Exposure apparatus, exposure method, and method for producing device
02/18/2015EP2837918A1 Flow rate sensor and method for making same
02/18/2015EP2837710A1 High-purity copper-manganese-alloy sputtering target
02/18/2015EP2837668A1 Adhesive composition, adhesive film, and bonding method
02/18/2015EP2837047A1 Functionalization of a substrate
02/18/2015EP2837034A1 3d non-volatile storage with additional word line select gates
02/18/2015EP2837025A1 End handler
02/18/2015EP2837024A1 Wafer shipper
02/18/2015EP2837023A1 Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods
02/18/2015EP2837022A1 Methods for depositing manganese and manganese nitrides
02/18/2015EP2837021A1 A method for manufacturing a semiconductor method device based on epitaxial growth.
02/18/2015EP2837020A1 Sic substrate with sic epitaxial film
02/18/2015EP2837019A1 Method for manufacturing photo cured material
02/18/2015EP2836823A1 Systems and methods for sample inspection and review
02/18/2015EP2836627A1 Method for preparing a coarse-grain crystallised silicon layer
02/17/2015US8959461 Pattern measurement device and pattern measurement method
02/17/2015US8958907 Robot arm apparatus
02/17/2015US8958667 Optical bus in 3D integrated circuit stack
02/17/2015US8958468 System and method for canceling radio frequency interferers (RFI's) in xDSL signals
02/17/2015US8958448 Thermal management in laser diode device
02/17/2015US8958227 Accessing or interconnecting integrated circuits
02/17/2015US8958118 Method and apparatus for adjusting size of object included in printing target to be printed at predetermined reduction ratio
02/17/2015US8958076 Surface shape measuring apparatus
02/17/2015US8958061 Heated wafer carrier profiling
02/17/2015US8958049 Liquid crystal display panel and repair method thereof
02/17/2015US8958011 Bi-directional camera module and flip chip bonder including the same
02/17/2015US8957962 Defect correcting method and defect correcting device for an electronic circuit pattern
02/17/2015US8957695 Semiconductor device having plural semiconductor chip stacked with one another
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