| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/11/2015 | CN102969311B 阵列基板及其制作方法、显示装置 Array substrate and method of manufacturing the display device |
| 02/11/2015 | CN102916042B 逆导igbt器件结构及制造方法 Reverse Conducting igbt device structure and method of manufacture |
| 02/11/2015 | CN102915917B 一种互补型金属氧化物半导体场效应晶体管的制备方法 A method for preparing complementary metal oxide semiconductor field effect transistor |
| 02/11/2015 | CN102903622B 存储器的制造方法 Method of manufacturing the memory |
| 02/11/2015 | CN102881652B 用于amoled面板制造的分割掩模框架组件制造装置 Segmentation mask frame assembly for amoled panel manufacturing equipment manufacturing |
| 02/11/2015 | CN102856329B 一种硅通孔封装方法 A silicone encapsulation method vias |
| 02/11/2015 | CN102856290B 单芯片倒装先蚀刻后封装基岛埋入封装结构及其制造方法 After the first single flip-chip package substrate etching island buried package structure and manufacturing method |
| 02/11/2015 | CN102856288B 多芯片正装先蚀刻后封装基岛埋入封装结构及其制造方法 After etching the first multi-chip package being installed base island buried package structure and its manufacturing method |
| 02/11/2015 | CN102856212B 双面三维线路芯片倒装先封后蚀制造方法及其封装结构 Three-sided flip chip line first to win the title eclipse manufacturing method and package structure |
| 02/11/2015 | CN102856201B Mosfet及其制造方法 Mosfet and manufacturing method thereof |
| 02/11/2015 | CN102842618B 一种半导体结构及其制造方法 A semiconductor structure and its manufacturing method |
| 02/11/2015 | CN102830594B 曝光失焦的sem检查装置及其方法 Exposure sem inspection apparatus and method out of focus |
| 02/11/2015 | CN102820245B 具有存片槽的薄膜工艺系统及其存取片方法 With a piece of thin film technology system memory slots and access chip method |
| 02/11/2015 | CN102820205B 键合机上的力传感器的安装结构及键合机 Bonding force sensor on the unit mounting structure and bonding machine |
| 02/11/2015 | CN102790002B 柔性基板处理装置 Flexible substrate processing apparatus |
| 02/11/2015 | CN102789998B 检测方法及检测装置 Detection method and detection device |
| 02/11/2015 | CN102779769B 测算半导体器件井区注入离子横向扩散能力的方法 Estimates of the semiconductor device implanted ions wellblock lateral diffusion capacity method |
| 02/11/2015 | CN102779737B 一种提高gan基led发光效率的外延生长方法 Epitaxial growth method for improving gan group led luminous efficiency |
| 02/11/2015 | CN102751322B 槽形栅多晶硅结构的联栅晶体管及其制作方法 Joint-gate transistor and method of making the trough gate polysilicon structure |
| 02/11/2015 | CN102751210B 一种测量晶圆旋转参数的方法及系统 A method and system for measuring the parameters of the wafer rotation |
| 02/11/2015 | CN102738195B 有机发光显示器件及其制造方法 The organic light emitting display device and manufacturing method thereof |
| 02/11/2015 | CN102737999B 锗衬底上制备金属-氧化物-半导体场效应晶体管方法 Preparation of the germanium substrate metal - oxide - semiconductor field effect transistor method |
| 02/11/2015 | CN102737994B 一种半导体器件的制造方法 A method of manufacturing a semiconductor device |
| 02/11/2015 | CN102737967B 具有硫族元素掺杂区域的衬底和半导体器件 Has chalcogenide substrate doped region and the semiconductor device |
| 02/11/2015 | CN102737964B 一种晶体硅片及其扩散方法 A crystalline silicon and diffusion method |
| 02/11/2015 | CN102714226B Pin二极管 Pin Diodes |
| 02/11/2015 | CN102709302B 图像传感器与晶体管的制作方法 The method of making the image sensor of the transistor |
| 02/11/2015 | CN102693937B 一种超低介电常数薄膜生长中形成渐进二氧化硅层的方法 The method of an ultra-low dielectric constant incremental silicon dioxide layer formed of thin film growth |
| 02/11/2015 | CN102693900B 一种具有周期结构的半导体及其制备方法 A semiconductor structure and preparation period has |
| 02/11/2015 | CN102690607B 金属用研磨液及其应用 Metal polishing liquid and its application |
| 02/11/2015 | CN102656683B 半导体装置 Semiconductor device |
| 02/11/2015 | CN102651397B 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof |
| 02/11/2015 | CN102646639B 具有嵌埋的低介电系数金属化的半导体器件 Embedded with a low dielectric constant of the metal semiconductor devices |
| 02/11/2015 | CN102640273B 形成鳍片场效晶体管的方法 Forming a fin field effect transistor, the method |
| 02/11/2015 | CN102610571B 一种形成双应力刻蚀阻挡层及前金属介电质层的方法 A method of forming an etch stop layer and two stress before the metal dielectric layer |
| 02/11/2015 | CN102549730B 焊接劈刀 Welding chopper |
| 02/11/2015 | CN102544108B 一种氧化锌薄膜晶体管的制备方法 Preparation method of zinc oxide thin film transistors |
| 02/11/2015 | CN102543830B 沟槽填充方法及成膜装置 Trench filling method and film forming apparatus |
| 02/11/2015 | CN102543671B 半导体晶片的制造方法 The method of manufacturing a semiconductor wafer |
| 02/11/2015 | CN102540604B 用于ffs模式液晶显示器件的阵列基板及其制造方法 Ffs array substrate and manufacturing method for mode liquid crystal display device |
| 02/11/2015 | CN102522325B 一种亚微米多层金属电极的制作方法 A method of making sub-micron multi-layer metal electrodes |
| 02/11/2015 | CN102483569B 光化射线敏感或辐射敏感树脂组合物及使用该组合物形成图案的方法 Actinic radiation-sensitive or radiation-sensitive resin compositions and methods of use of the composition for forming a pattern |
| 02/11/2015 | CN102466932B 液晶面板、tft阵列基板及其制造方法 LCD panel, tft array substrate and its manufacturing method |
| 02/11/2015 | CN102460656B 太阳能电池的制造方法 The method of manufacturing a solar cell |
| 02/11/2015 | CN102428553B 用于提供穿硅通孔(tsv)冗余度的方法与设备 To provide through-silicon vias (tsv) methods and equipment redundancy |
| 02/11/2015 | CN102376545B 形成精细图案的方法 The method of forming a fine pattern |
| 02/11/2015 | CN102244023B 基板处理装置及基板处理方法 Substrate processing apparatus and substrate processing method |
| 02/11/2015 | CN102226988B 双沟槽隔离结构的形成方法 The method of forming a dual trench isolation structure |
| 02/11/2015 | CN102151986B 激光加工装置 The laser processing apparatus |
| 02/11/2015 | CN102134710B 成膜装置 Film forming apparatus |
| 02/11/2015 | CN102130048B 半导体管芯切单方法 Semiconductor die singulation method |
| 02/11/2015 | CN102082117B 通过自对准镶嵌工艺在半导体器件中形成侧接触的方法 The method by a damascene process is formed self-aligned contact in a semiconductor device side |
| 02/11/2015 | CN102044495B 制造具有掩埋栅极的半导体器件的方法 The method of manufacturing a semiconductor device having the buried gate |
| 02/11/2015 | CN102024747B 功率器件的铝插塞制作方法 Aluminum power devices plug production methods |
| 02/11/2015 | CN101937859B 在ONO制造工艺中检测Cu含量的方法 The method of detecting the content of Cu in the manufacturing process ONO |
| 02/11/2015 | CN101840937B 晶体管、具有该晶体管的半导体装置及它们的制造方法 Transistor, the transistor having a semiconductor device and manufacturing method thereof |
| 02/11/2015 | CN101826475B 掩模检查装置和方法以及虚拟图产生装置和方法 Mask inspection apparatus and method, and a virtual map generation apparatus and method |
| 02/10/2015 | US8954948 Obsolescence tolerant flash memory architecture and physical building block (PBB) implementation |
| 02/10/2015 | US8954916 Test circuit, integrated circuit, and test circuit layout method |
| 02/10/2015 | US8954287 Systems and methods for calibrating end effector alignment using at least a light source |
| 02/10/2015 | US8954184 Tool performance by linking spectroscopic information with tool operational parameters and material measurement information |
| 02/10/2015 | US8953298 Electrostatic chuck robotic system |
| 02/10/2015 | US8953144 Lithographic apparatus and device manufacturing method |
| 02/10/2015 | US8952716 Method of detecting defects in a semiconductor device and semiconductor device using the same |
| 02/10/2015 | US8952595 Micro-electro-mechanical transducers |
| 02/10/2015 | US8952554 Semiconductor device including a buffer layer structure for reducing stress |
| 02/10/2015 | US8952552 Semiconductor package assembly systems and methods using DAM and trench structures |
| 02/10/2015 | US8952550 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same |
| 02/10/2015 | US8952545 Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof |
| 02/10/2015 | US8952544 Semiconductor device and manufacturing method thereof |
| 02/10/2015 | US8952543 Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devices |
| 02/10/2015 | US8952542 Method for dicing a semiconductor wafer having through silicon vias and resultant structures |
| 02/10/2015 | US8952541 Method of fabricating metal-insulator-semiconductor tunneling contacts using conformal deposition and thermal growth processes |
| 02/10/2015 | US8952540 In situ-built pin-grid arrays for coreless substrates, and methods of making same |
| 02/10/2015 | US8952539 Methods for fabrication of an air gap-containing interconnect structure |
| 02/10/2015 | US8952537 Conductive bump structure with a plurality of metal layers |
| 02/10/2015 | US8952536 Semiconductor device and method of fabrication |
| 02/10/2015 | US8952535 Semiconductor transistor device with barrier interconnects |
| 02/10/2015 | US8952534 Semiconductor device and semiconductor assembly with lead-free solder |
| 02/10/2015 | US8952532 Integrated circuit package with spatially varied solder resist opening dimension |
| 02/10/2015 | US8952531 Packaging method using solder coating ball and package having solder pattern including metal pattern |
| 02/10/2015 | US8952529 Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voids |
| 02/10/2015 | US8952528 Semiconductor package and fabrication method thereof |
| 02/10/2015 | US8952526 Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry |
| 02/10/2015 | US8952525 Semiconductor module and method for manufacturing semiconductor module |
| 02/10/2015 | US8952524 Re-workable heat sink attachment assembly |
| 02/10/2015 | US8952522 Wafer level package and fabrication method |
| 02/10/2015 | US8952521 Semiconductor packages with integrated antenna and method of forming thereof |
| 02/10/2015 | US8952519 Chip package and fabrication method thereof |
| 02/10/2015 | US8952508 Lead frame, semiconductor manufacturing apparatus, and semiconductor device |
| 02/10/2015 | US8952507 Wiring board and method for manufacturing wiring board |
| 02/10/2015 | US8952506 Through silicon via structure |
| 02/10/2015 | US8952503 Organic module EMI shielding structures and methods |
| 02/10/2015 | US8952502 Semiconductor patterning |
| 02/10/2015 | US8952501 Chip package and method for forming the same |
| 02/10/2015 | US8952497 Scribe lines in wafers |
| 02/10/2015 | US8952494 Group III nitride semiconductor substrate having a sulfide in a surface layer |
| 02/10/2015 | US8952492 High-precision resistor and trimming method thereof |
| 02/10/2015 | US8952491 Capacitive element |
| 02/10/2015 | US8952490 Redox capacitor and manufacturing method thereof |