| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/17/2015 | US8956938 Epitaxial semiconductor resistor with semiconductor structures on same substrate |
| 02/17/2015 | US8956937 Method of depositing the metal barrier layer comprising silicon dioxide |
| 02/17/2015 | US8956935 Method for manufacturing compound semiconductor device |
| 02/17/2015 | US8956933 Method of forming an active pattern, display substrate formed by the same, and method of manufacturing the display substrate |
| 02/17/2015 | US8956932 U-shaped semiconductor structure |
| 02/17/2015 | US8956930 Process for production of thin film transistor substrate |
| 02/17/2015 | US8956929 Method for manufacturing semiconductor device |
| 02/17/2015 | US8956928 Contact structure for a semiconductor device and methods of making same |
| 02/17/2015 | US8956927 Method of manufacturing epitaxial silicon wafer and epitaxial silicon wafer manufactured by the method |
| 02/17/2015 | US8956926 Method for manufacturing self-aligned thin film transistor |
| 02/17/2015 | US8956925 Silicon controlled rectifier structure with improved junction breakdown and leakage control |
| 02/17/2015 | US8956924 Method of forming a semiconductor device including a silicon controlled rectifier |
| 02/17/2015 | US8956923 Methods of fabricating semiconductor devices and underfill equipment for the same |
| 02/17/2015 | US8956922 Coating method for an optoelectronic chip-on-board module |
| 02/17/2015 | US8956921 Method of molding semiconductor package |
| 02/17/2015 | US8956920 Leadframe for integrated circuit die packaging in a molded package and a method for preparing such a leadframe |
| 02/17/2015 | US8956919 Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof |
| 02/17/2015 | US8956918 Method of manufacturing a chip arrangement comprising disposing a metal structure over a carrier |
| 02/17/2015 | US8956917 Semiconductor device, and manufacturing method and manufacturing apparatus of the same |
| 02/17/2015 | US8956916 Multi-chip module with stacked face-down connected dies |
| 02/17/2015 | US8956915 Method of manufacturing a three-dimensional packaging semiconductor device |
| 02/17/2015 | US8956914 Integrated circuit package system with overhang die |
| 02/17/2015 | US8956913 Semiconductor device and manufacturing method thereof |
| 02/17/2015 | US8956912 Method for manufacturing semiconductor device |
| 02/17/2015 | US8956911 LED phosphor and fabricating method thereof |
| 02/17/2015 | US8956909 Method of fabricating an electronic device comprising photodiode |
| 02/17/2015 | US8956908 Image sensors and methods of manufacturing the same |
| 02/17/2015 | US8956907 Method for producing field effect transistor, field effect transistor, display device, image sensor, and X-ray sensor |
| 02/17/2015 | US8956906 Method and device for producing a semiconductor layer |
| 02/17/2015 | US8956905 Methods for thick films thermoelectric device fabrication |
| 02/17/2015 | US8956904 Apparatus and method of wafer bonding using compatible alloy |
| 02/17/2015 | US8956903 Planar cavity MEMS and related structures, methods of manufacture and design structures |
| 02/17/2015 | US8956902 Process for manufacturing buried hetero-structure laser diodes |
| 02/17/2015 | US8956901 Method of manufacturing LED component by integrating epitaxial structure and package substrate together |
| 02/17/2015 | US8956900 Liquid crystal display device comprising first and second data link lines electrically connected to odd and even data lines respectively and crossing each other to connect even and odd data pad electrodes respectively |
| 02/17/2015 | US8956899 Method of fabricating a display device with step configuration in the insulating layer |
| 02/17/2015 | US8956898 Fabrication method for organic EL device |
| 02/17/2015 | US8956897 Method for producing an optoelectronic component and optoelectronic component |
| 02/17/2015 | US8956896 Metalorganic chemical vapor deposition (MOCVD) growth of high performance non-polar III-nitride optical devices |
| 02/17/2015 | US8956895 Light emitting device |
| 02/17/2015 | US8956893 Metiod of making LED with bat-wing emitting field lens |
| 02/17/2015 | US8956891 Light-emitting device and method for manufacturing the same |
| 02/17/2015 | US8956890 Method for producing group III nitride semiconductor light-emitting device |
| 02/17/2015 | US8956889 Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC) |
| 02/17/2015 | US8956888 Photovoltaic device and method and system for making photovoltaic device |
| 02/17/2015 | US8956887 Method for manufacturing semiconductor light-emitting element |
| 02/17/2015 | US8956886 Embedded test structure for trimming process control |
| 02/17/2015 | US8956885 Method and process to reduce stress based overlay error |
| 02/17/2015 | US8956884 Process for reconditioning semiconductor surface to facilitate bonding |
| 02/17/2015 | US8956882 Method of manufacturing magnetoresistive element |
| 02/17/2015 | US8956881 Method of manufacturing a FeRAM device |
| 02/17/2015 | US8956802 Pattern forming method, chemical amplification resist composition and resist film |
| 02/17/2015 | US8956801 Resist composition and method of forming resist pattern |
| 02/17/2015 | US8956789 Methods for fabricating integrated circuits including multi-patterning of masks for extreme ultraviolet lithography |
| 02/17/2015 | US8956698 Process and hardware for deposition of complex thin-film alloys over large areas |
| 02/17/2015 | US8956689 Method for producing ferroelectric thin film |
| 02/17/2015 | US8956560 Method of manufacturing mold |
| 02/17/2015 | US8956546 Substrate processing method and substrate processing apparatus |
| 02/17/2015 | US8956500 Methods to eliminate “M-shape” etch rate profile in inductively coupled plasma reactor |
| 02/17/2015 | US8956498 Apparatuses facilitating fluid flow into via holes, vents, and other openings communicating with surfaces of substrates of semiconductor device components |
| 02/17/2015 | US8956486 Manufacturing method for monolithic ceramic electronic component |
| 02/17/2015 | US8956465 Liquid processing method, liquid processing device, and storage medium |
| 02/17/2015 | US8956462 Treatment liquid for inhibiting pattern collapse in microstructure and method of manufacturing microstructure using the same |
| 02/17/2015 | US8956459 Joined assembly, wafer holding assembly, attaching structure thereof and method for processing wafer |
| 02/17/2015 | US8956458 Vapor deposition device and vapor deposition method |
| 02/17/2015 | US8956457 Thermal processing system for curing dielectric films |
| 02/17/2015 | US8956453 Method for producing a crystalline germanium layer on a substrate |
| 02/17/2015 | US8956098 Automated warehouse |
| 02/17/2015 | US8955724 Valve impact type dispensing pump |
| 02/17/2015 | US8955579 Plasma processing apparatus and plasma processing method |
| 02/17/2015 | US8955530 System and method for cleaning a wafer chuck |
| 02/17/2015 | US8955529 Device and method for wet treating disc-shaped articles |
| 02/17/2015 | US8955406 Workpiece transfer apparatus |
| 02/17/2015 | US8955357 System and methods of embedding material in a glass substrate |
| 02/17/2015 | US8955218 Method for fabricating package substrate |
| 02/17/2015 | US8955216 Method of making a compliant printed circuit peripheral lead semiconductor package |
| 02/12/2015 | WO2015021417A1 Adaptive local threshold and color filtering |
| 02/12/2015 | WO2015021411A1 Multi-spot illumination for improved detection sensitivity |
| 02/12/2015 | WO2015021297A1 Substrate backside texturing |
| 02/12/2015 | WO2015021277A2 Microelectronic package with integrated bearing surfaces |
| 02/12/2015 | WO2015021206A1 Setting up a wafer inspection process using programmed defects |
| 02/12/2015 | WO2015021188A1 Improved hard mask for source/drain epitaxy control |
| 02/12/2015 | WO2015021026A1 Methods and apparatus for patterned wafer characterization |
| 02/12/2015 | WO2015020918A1 Adaptive electrical testing of wafers |
| 02/12/2015 | WO2015020852A1 Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods |
| 02/12/2015 | WO2015020814A1 Photonic activation of reactants for sub-micron feature formation using depleted beams |
| 02/12/2015 | WO2015020813A1 Locally heated multi-zone substrate support |
| 02/12/2015 | WO2015020810A1 Electrostatic carrier for thin substrate handling |
| 02/12/2015 | WO2015020792A1 Method and apparatus for precleaning a substrate surface prior to epitaxial growth |
| 02/12/2015 | WO2015020791A1 In-situ removable electrostatic chuck |
| 02/12/2015 | WO2015020786A2 Methods and apparatuses for forming multiple radio frequency (rf) components associated with different rf bands on a chip |
| 02/12/2015 | WO2015020760A1 Three-dimensional (3d) processing and printing with plasma sources |
| 02/12/2015 | WO2015020725A2 Method for increasing adhesion of copper to polymeric surfaces |
| 02/12/2015 | WO2015020610A1 Method to transfer two dimensional film grown on metal-coated wafer to the wafer itself in a face-to-face manner |
| 02/12/2015 | WO2015020474A1 Epitaxial reactor |
| 02/12/2015 | WO2015020392A1 Semiconductor device and method for manufacturing same |
| 02/12/2015 | WO2015020353A1 Probe apparatus for kelvin test |
| 02/12/2015 | WO2015020243A1 Texture-etching solution composition for crystalline silicon wafers and texture-etching method |
| 02/12/2015 | WO2015020233A1 Group-iii nitride semiconductor epitaxial substrate, group-iii nitride semiconductor light-emission element, and production method for these |
| 02/12/2015 | WO2015020219A1 Method for producing silicon carbide semiconductor device |