Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2015
02/24/2015US8962492 Method to thin a silicon-on-insulator substrate
02/24/2015US8962491 Methods of fabricating semiconductor devices and semiconductor devices fabricated thereby
02/24/2015US8962490 Method for fabricating semiconductor device
02/24/2015US8962489 Method for etching film containing cobalt and palladium
02/24/2015US8962488 Synchronized radio frequency pulsing for plasma etching
02/24/2015US8962487 Method for making microchannels on a substrate, and substrate including such microchannels
02/24/2015US8962486 Method of forming opening on semiconductor substrate
02/24/2015US8962485 Reusing active area mask for trench transfer exposure
02/24/2015US8962484 Method of forming pattern for semiconductor device
02/24/2015US8962483 Interconnection designs using sidewall image transfer (SIT)
02/24/2015US8962482 Multi-layer interconnect with isolation layer
02/24/2015US8962481 Chip-on-wafer structures and methods for forming the same
02/24/2015US8962480 ESD network circuit with a through wafer via structure and a method of manufacture
02/24/2015US8962479 Interconnect structures containing nitrided metallic residues
02/24/2015US8962478 Method to use self-repair Cu barrier to solve barrier degradation due to Ru CMP
02/24/2015US8962477 High temperature anneal for stress modulation
02/24/2015US8962476 Method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis
02/24/2015US8962475 Multi-layer circuit substrate fabrication method providing improved transmission line integrity and increased routing density
02/24/2015US8962474 Method for forming an air gap around a through-silicon via
02/24/2015US8962473 Method of forming hybrid diffusion barrier layer and semiconductor device thereof
02/24/2015US8962472 Semiconductor device with self-aligned air gap and method for fabricating the same
02/24/2015US8962471 Bump, method for forming the bump, and method for mounting substrate having the bump thereon
02/24/2015US8962470 Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
02/24/2015US8962469 Methods of stripping resist after metal deposition
02/24/2015US8962468 Formation of ohmic contacts on wide band gap semiconductors
02/24/2015US8962467 Metal fuse structure for improved programming capability
02/24/2015US8962466 Low temperature transition metal oxide for memory device
02/24/2015US8962465 Methods of forming gated devices
02/24/2015US8962464 Self-alignment for using two or more layers and methods of forming same
02/24/2015US8962463 Semiconductor device with dual work function gate stacks and method for fabricating the same
02/24/2015US8962462 Overvoltage tolerant HFETs
02/24/2015US8962461 GaN HEMTs and GaN diodes
02/24/2015US8962460 Methods of selectively forming metal-doped chalcogenide materials, methods of selectively doping chalcogenide materials, and methods of forming semiconductor device structures including same
02/24/2015US8962459 Diffusion sources from liquid precursors
02/24/2015US8962458 Methods of growing nitride semiconductors and methods of manufacturing nitride semiconductor substrates
02/24/2015US8962457 Insulated gate type transistor and display device
02/24/2015US8962456 Group III nitride semiconductor single crystal, method for producing the same, self-standing substrate, and semiconductor device
02/24/2015US8962455 Method of fabricating semiconductor device
02/24/2015US8962454 Method of depositing dielectric films using microwave plasma
02/24/2015US8962453 Single crystal growth on a mis-matched substrate
02/24/2015US8962452 Semiconductor die singulation apparatus and method
02/24/2015US8962451 Wafer processing method
02/24/2015US8962450 Method for manufacturing a semiconductor-on-insulator structure having low electrical losses
02/24/2015US8962449 Methods for processing semiconductor devices
02/24/2015US8962448 Computer readable medium encoded with a program for fabricating 3D integrated circuit device using interface wafer as permanent carrier
02/24/2015US8962447 Bonded strained semiconductor with a desired surface orientation and conductance direction
02/24/2015US8962446 Methods of forming oxides, methods of forming semiconductor constructions, and methods of forming isolation regions
02/24/2015US8962445 Method of manufacture of semiconductor isolation structure
02/24/2015US8962444 Semiconductor device and method of manufacturing the same
02/24/2015US8962443 Semiconductor device having an airbridge and method of fabricating the same
02/24/2015US8962442 Janus complementary MEMS transistors and circuits
02/24/2015US8962441 Transistor device with improved source/drain junction architecture and methods of making such a device
02/24/2015US8962440 Semiconductor device and method of manufacturing semiconductor device
02/24/2015US8962439 Memory cell
02/24/2015US8962437 Method for fabricating capacitor with high aspect ratio
02/24/2015US8962436 Lateral bipolar transistors having partially-depleted intrinsic base
02/24/2015US8962435 Method of forming semiconductor device having embedded strain-inducing pattern
02/24/2015US8962434 Field effect transistors with varying threshold voltages
02/24/2015US8962433 MOS transistor process
02/24/2015US8962432 Semiconductor device with self aligned end-to-end conductive line structure and method for forming the same
02/24/2015US8962431 Methods of forming metal silicide-comprising material and methods of forming metal silicide-comprising contacts
02/24/2015US8962430 Method for the formation of a protective dual liner for a shallow trench isolation structure
02/24/2015US8962429 Integrated circuits with improved spacers and methods for fabricating same
02/24/2015US8962428 Method of manufacturing a semiconductor device
02/24/2015US8962427 Method of producing semiconductor device
02/24/2015US8962426 Method of manufacture for a semiconductor device
02/24/2015US8962425 Semiconductor device and method of forming junction enhanced trench power MOSFET having gate structure embedded within trench
02/24/2015US8962424 N-type silicon solar cell with contact/protection structures
02/24/2015US8962423 Multilayer MIM capacitor
02/24/2015US8962422 Method of fabricating semiconductor devices
02/24/2015US8962421 Methods for fabricating integrated circuits including semiconductive resistor structures in a FinFET architecture
02/24/2015US8962420 Semiconductor device comprising a buried poly resistor
02/24/2015US8962419 Complementary stress memorization technique layer method
02/24/2015US8962418 Manufacturing method of semiconductor device having semiconductor layers with different thicknesses
02/24/2015US8962417 Method and structure for pFET junction profile with SiGe channel
02/24/2015US8962416 Split gate non-volatile memory cell
02/24/2015US8962415 Methods of forming gates of semiconductor devices
02/24/2015US8962414 Reduced spacer thickness in semiconductor device fabrication
02/24/2015US8962413 Methods of forming spacers on FinFETs and other semiconductor devices
02/24/2015US8962412 Integrated circuit having raised source drains devices with reduced silicide contact resistance and methods to fabricate same
02/24/2015US8962411 Circuit pattern with high aspect ratio and method of manufacturing the same
02/24/2015US8962410 Transistors with different threshold voltages
02/24/2015US8962409 Semiconductor device and fabrication method
02/24/2015US8962408 Replacement gate self-aligned carbon nanostructure transistor
02/24/2015US8962407 Method and device to achieve self-stop and precise gate height
02/24/2015US8962406 Flatband shift for improved transistor performance
02/24/2015US8962405 Method of manufacturing semiconductor device by mounting and positioning a semiconductor die using detection marks
02/24/2015US8962404 Method for manufacturing fan-out lines on array substrate
02/24/2015US8962403 Manufacturing method for switch and array substrate using etching solution comprising amine
02/24/2015US8962402 Lateral diffusion metal oxide semiconductor (LDMOS) device with tapered drift electrode
02/24/2015US8962401 Double gated 4F2 dram CHC cell and methods of fabricating the same
02/24/2015US8962400 In-situ doping of arsenic for source and drain epitaxy
02/24/2015US8962399 Method of making a semiconductor layer having at least two different thicknesses
02/24/2015US8962398 Body contacted hybrid surface semiconductor-on-insulator devices
02/24/2015US8962397 Multiple well drain engineering for HV MOS devices
02/24/2015US8962396 Fabrication method of carrier-free semiconductor package
02/24/2015US8962395 QFN package and manufacturing process thereof
02/24/2015US8962394 Semiconductor device and method of manufacturing the same
02/24/2015US8962393 Integrated circuit packaging system with heat shield and method of manufacture thereof
02/24/2015US8962392 Underfill curing method using carrier
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