Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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02/11/2015 | CN104347424A 具有单元沟槽结构和接触点的半导体器件及其制造方法 Semiconductor device and manufacturing method of the trench structure and having a cell contact point |
02/11/2015 | CN104347423A 集成结和接触件的形成以形成晶体管 Integrated junction and contacts are formed to form a transistor |
02/11/2015 | CN104347422A 带静电释放保护电路的沟槽式mos晶体管的制造方法 Method of producing the electrostatic discharge protection circuit trench mos transistors |
02/11/2015 | CN104347421A 鳍式场效应管的形成方法 The method for forming fin FET |
02/11/2015 | CN104347420A Ldmos器件及其形成方法 Device and method for forming Ldmos |
02/11/2015 | CN104347419A 一种esd保护器件及其制作方法 One kind esd protection device and manufacturing method thereof |
02/11/2015 | CN104347418A Mos晶体管的形成方法 Mos transistor forming method |
02/11/2015 | CN104347417A Mos晶体管的形成方法 Mos transistor forming method |
02/11/2015 | CN104347416A 鳍式场效应晶体管及其形成方法 Fin field-effect transistor and method of forming |
02/11/2015 | CN104347415A 鳍式场效应晶体管及其形成方法 Fin field-effect transistor and method of forming |
02/11/2015 | CN104347414A 鳍式场效应管的形成方法 The method for forming fin FET |
02/11/2015 | CN104347413A 一种制作FinFET半导体器件的方法 A method of fabricating a semiconductor device FinFET |
02/11/2015 | CN104347412A Vvmos管的制作方法及vvmos管 Production methods Vvmos tube and pipe vvmos |
02/11/2015 | CN104347411A 金属栅电极等效功函数调节方法 Equivalent metal gate electrode work function tuning method |
02/11/2015 | CN104347410A 鳍式场效应晶体管及其形成方法 Fin field-effect transistor and method of forming |
02/11/2015 | CN104347409A 半导体结构的形成方法 The method of forming a semiconductor structure |
02/11/2015 | CN104347408A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
02/11/2015 | CN104347407A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
02/11/2015 | CN104347406A 双极晶体管、半导体装置以及双极晶体管的制造方法 The method of manufacturing a bipolar transistor, a semiconductor device and a bipolar transistor |
02/11/2015 | CN104347405A 一种绝缘栅双极晶体管的制造方法 A method of manufacturing an insulated gate bipolar transistor |
02/11/2015 | CN104347404A 一种绝缘栅双极性晶体管的制造方法 A method of manufacturing an insulated gate bipolar transistor |
02/11/2015 | CN104347403A 一种绝缘栅双极性晶体管的制造方法 A method of manufacturing an insulated gate bipolar transistor |
02/11/2015 | CN104347402A 一种绝缘栅双极型晶体管的制造方法 A method of manufacturing an insulated gate bipolar transistor |
02/11/2015 | CN104347401A 一种绝缘栅双极性晶体管的制造方法 A method of manufacturing an insulated gate bipolar transistor |
02/11/2015 | CN104347400A 非穿通型绝缘栅双极晶体管的制造方法 Non-punch-through method of manufacturing insulated gate bipolar transistor |
02/11/2015 | CN104347399A 绝缘栅双极型晶体管igbt制造方法 Insulated gate bipolar transistor igbt manufacturing method |
02/11/2015 | CN104347398A 一种igbt的制造方法 A method of producing igbt |
02/11/2015 | CN104347397A 注入增强型绝缘栅双极型晶体管的制造方法 Implantation process enhanced insulated gate bipolar transistors |
02/11/2015 | CN104347396A 注入增强型绝缘栅双极型晶体管的制造方法 Implantation process enhanced insulated gate bipolar transistors |
02/11/2015 | CN104347395A 硅晶片及其制造方法 Silicon wafer and manufacturing method thereof |
02/11/2015 | CN104347394A 一种湿法刻蚀装置 One kind of wet etching device |
02/11/2015 | CN104347393A 去除接触窗底部自然氧化层的方法 Removing natural oxide layer bottom of a contact method |
02/11/2015 | CN104347392A 图形化方法 Graphical Method |
02/11/2015 | CN104347391A 一种深沟槽刻蚀设备及其方法 A dark trench etching apparatus and method |
02/11/2015 | CN104347390A 一种等离子体刻蚀基片的方法 A plasma etching method of substrate |
02/11/2015 | CN104347389A 等离子体刻蚀方法 Plasma etching method |
02/11/2015 | CN104347388A 使用聚合物共混物的定向自组装形成具有亚光刻间距的特征的方法 Use of the polymer blend directed self-assembly method of forming features having a pitch of sublithographic |
02/11/2015 | CN104347387A 一种用于湿法腐蚀晶片的装置 A device for wet etching of the wafer |
02/11/2015 | CN104347386A 一种用于制备图形衬底的一体化湿法腐蚀设备 Integrated wet etching apparatus for the preparation of graphic substrates |
02/11/2015 | CN104347385A 一种半导体器件的选择性刻蚀方法及bsi图像传感器制作方法 Selective etching method of a semiconductor device and method of manufacturing the image sensor bsi |
02/11/2015 | CN104347384A 晶片清洗装置及晶片清洗方法 Device wafer cleaning and wafer cleaning method |
02/11/2015 | CN104347383A 蓝宝石盘片抛光垫修整器的制造方法 Sapphire disc manufacturing method of the pad dresser |
02/11/2015 | CN104347382A 基板处理设备 The substrate processing apparatus |
02/11/2015 | CN104347381A 半导体装置的制造方法 The method of manufacturing a semiconductor device |
02/11/2015 | CN104347380A 形成包含硅化及非硅化电路组件的半导体结构的方法 The method comprises forming a silicide and non silicide circuit assembly semiconductor structure |
02/11/2015 | CN104347379A 包括多层栅极的半导体器件、电子器件及其形成方法 Comprising a multilayer gate semiconductor device and method of forming an electronic device |
02/11/2015 | CN104347378A 一种应用于沟槽型mos器件的沟槽栅的制备方法 Applied to Preparation trench mos device trench gate |
02/11/2015 | CN104347377A Nmos金属栅极晶体管的形成方法 The method of forming a metal gate transistor Nmos |
02/11/2015 | CN104347376A 于金属氧化物半导体场效应晶体管中形成遮蔽栅极的方法 The method of forming a gate masking metal oxide semiconductor field effect transistor |
02/11/2015 | CN104347375A 使用氧化膜做阻挡层对栅极多晶硅进行刻蚀的方法 The method of using the oxide film to make the barrier layer on the gate polysilicon etching |
02/11/2015 | CN104347374A 半导体器件制造方法 The semiconductor device manufacturing method |
02/11/2015 | CN104347373A 横向双扩散金属氧化物半导体晶体管的制造方法 Manufacturing method lateral double diffused metal oxide semiconductor transistors |
02/11/2015 | CN104347372A 半导体器件的制备方法 The method for preparing a semiconductor device |
02/11/2015 | CN104347371A 半导体结构的形成方法 The method of forming a semiconductor structure |
02/11/2015 | CN104347370A 提高pmos器件栅极的负偏压温度稳定性方法 Negative bias temperature stability of ways to improve the gate pmos devices |
02/11/2015 | CN104347369A 激光照射装置 Laser irradiation device |
02/11/2015 | CN104347368A 多激光的激光退火装置及方法 Laser annealing apparatus and method for multi-laser |
02/11/2015 | CN104347367A 一种改善栅氧击穿时漏电偏大的方法 When the gate oxide breakdown of a way to improve the leakage is too large |
02/11/2015 | CN104347366A 使用微波辐射活化掺杂剂的方法和系统 Using microwave radiation dopant activation method and system |
02/11/2015 | CN104347365A 外延结构及其形成方法 Epitaxial structure and method of forming |
02/11/2015 | CN104347364A 三维堆叠器件的制备方法 Preparation of three-dimensional stacked devices |
02/11/2015 | CN104347363A 一种去除深沟槽刻蚀工艺后的圆片的硬质掩蔽层的方法 A method for removing a hard mask layer wafer deep trench etching process after method |
02/11/2015 | CN104347362A 小尺寸图形的制作方法 Small graphic production methods |
02/11/2015 | CN104347361A 设计和制造光学微影掩膜的方法及系统 Design and manufacture of optical lithography mask method and system |
02/11/2015 | CN104347360A 双重图形结构及其形成方法 Dual graph structure and method of forming |
02/11/2015 | CN104347359A 一种高效的衬底剥离方法 An efficient method for peeling the substrate |
02/11/2015 | CN104347358A 改善器件等离子体损伤的方法 Ways to improve the device plasma damage |
02/11/2015 | CN104347357A 减薄替代抛光及后序清洗的衬底加工方法 Polishing and subsequent thinning alternative cleaning substrate processing method |
02/11/2015 | CN104347356A 一种在GaN衬底上同质外延生长的方法 A method of epitaxially grown on the GaN substrate homogeneity |
02/11/2015 | CN104347355A 试验装置、试验方法 Test equipment, test methods |
02/11/2015 | CN104347354A 粘合带粘贴方法及粘合带粘贴装置 Methods and paste adhesive tape adhesive tape sticking device |
02/11/2015 | CN104347353A 硅膜的成膜方法、薄膜的成膜方法以及截面形状控制方法 Silicon film deposition method, a thin film deposition method as well as cross-sectional shape of the control method |
02/11/2015 | CN104347352A 一种基板处理装置及基板处理方法 A substrate processing apparatus and method for substrate processing |
02/11/2015 | CN104347351A 超结半导体器件及制造方法 Super junction semiconductor device and method of manufacture |
02/11/2015 | CN104347350A 半导体自对准图案化的方法 Semiconductor self-aligned patterning method |
02/11/2015 | CN104347349A 清洗用于混合接合的衬底表面的机制 Cleaning mechanism for engaging the surface of the substrate mix |
02/11/2015 | CN104347348A 移除制作工艺 Removal of the production process |
02/11/2015 | CN104347347A 多晶硅电阻的形成方法 The method for forming a polysilicon resistor |
02/11/2015 | CN104347346A 不同结构的深沟槽平坦化方法 Deep trench planarization method different structure |
02/11/2015 | CN104347345A 电容结构的形成方法 The method for forming the capacitor structure |
02/11/2015 | CN104347341A 用于蚀刻的快速气体切换 Fast gas switching for etching |
02/11/2015 | CN104347340A 蚀刻速率模拟及其在室内和室对室匹配中的用途 Etch rate simulate their use in indoor and outdoor rooms matching pair of |
02/11/2015 | CN104347337A 刻蚀机和利用刻蚀机刻蚀晶片的方法 Etching machine and use wafer etcher etching method |
02/11/2015 | CN104345580A 显影方法和显影装置 Developing method and a developing apparatus |
02/11/2015 | CN104345576A 形成图案的方法 The method of forming a pattern of |
02/11/2015 | CN104345568A 减小光刻胶图形线宽粗糙度的方法 Reduce the line width roughness of the resist pattern |
02/11/2015 | CN104345555A 焊料凸点形成用树脂组合物、焊料凸点形成方法和具备焊料凸点的构件 Solder bump forming member includes a solder bump forming method and the resin composition, the solder bump |
02/11/2015 | CN104345511A 像素结构及其制造方法、显示面板 Pixel structure and its manufacturing method, a display panel |
02/11/2015 | CN104342635A 薄膜沉积装置及方法,以及有机发光显示装置的制造方法 Thin film deposition apparatus and method, and an organic light emitting display device manufacturing method |
02/11/2015 | CN104342047A 带有切割胶带的芯片接合薄膜以及半导体装置的制造方法 And a method of manufacturing a thin film semiconductor device chip bonded with the dicing tape |
02/11/2015 | CN104339090A 光器件晶片的加工方法 Optical device wafer processing method |
02/11/2015 | CN104339087A 加工装置 Processing device |
02/11/2015 | CN103280429B 一种tft阵列基板的制造方法及tft阵列基板 A method of manufacturing an array substrate and tft tft array substrate |
02/11/2015 | CN103187363B 铜互连的制作方法 The method of making copper interconnects |
02/11/2015 | CN103178021B 一种氧化物薄膜晶体管阵列基板及制作方法、显示面板 An oxide thin film transistor array substrate and method of manufacturing the display panel |
02/11/2015 | CN103094210B 制作半导体器件的方法 The method of fabricating a semiconductor device |
02/11/2015 | CN103077925B 存储器的制造方法 Method of manufacturing the memory |
02/11/2015 | CN103000584B 位线结构及其制造方法 Bit line structure and manufacturing method |
02/11/2015 | CN102998865B 一种阵列基板及其制作方法、显示装置 One kind of array substrate and method of manufacturing the display device |
02/11/2015 | CN102983144B 图像传感器的晶圆级封装方法 Wafer-level packaging method of the image sensor |