Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2009
10/14/2009CN100550399C Thin film transistor substrate, manufacturing method of thin film transistor, and display device
10/14/2009CN100550397C Active matrix TFT array substrate and method of manufacturing the same
10/14/2009CN100550396C Picture element and its forming method, storage capacitor, display panel and photoelectric device
10/14/2009CN100550395C Thin film transistor substrate and manufacturing method thereof
10/14/2009CN100550394C Semiconductor device and method of manufacturing the same
10/14/2009CN100550393C A multi-bit programmable non-volatile memory unit, array and the corresponding manufacturing method
10/14/2009CN100550392C Nonvolatile semiconductor memory device and manufacturing method thereof
10/14/2009CN100550391C Ferroelectric capacitor and ferroelectric field effect tube and manufacturing method thereof
10/14/2009CN100550389C System and methods for memory structure comprising embedded flash memory
10/14/2009CN100550388C Integrated circuit arrangement comprising isolating trenches and a field effect transistor, and associated production method
10/14/2009CN100550386C Complementary metal oxide semiconductor device
10/14/2009CN100550385C Method and structure for self-aligned device contacts
10/14/2009CN100550384C Integrated circuit arrangement with npn and pnp bipolar transistors and corresponding production method
10/14/2009CN100550383C Semiconductor device and electric device
10/14/2009CN100550382C Semiconductor structure and method of manufacturing the same
10/14/2009CN100550378C Image sensor and fabricating method thereof
10/14/2009CN100550376C Semiconductor device and fabricating method thereof
10/14/2009CN100550374C LED packaging structure and packaging method
10/14/2009CN100550373C Multichip packaging structure and its production method
10/14/2009CN100550366C Semiconductor chip
10/14/2009CN100550363C Terminal pad and solder junction structure, semiconductor device having the junction structure, and method of manufacturing the semiconductor device
10/14/2009CN100550362C A crystal wafer chip dimension encapsulation line and its making method
10/14/2009CN100550355C Substrate for mounting semiconductor chip and manufacturing method and semiconductor module
10/14/2009CN100550353C Semiconductor device and method of manufacturing the same
10/14/2009CN100550352C A stacked non-volatile memory device and methods for fabricating the same
10/14/2009CN100550351C Method of manufacturing flash memory device
10/14/2009CN100550350C CMOS device with metal and silicide gate electrodes and a method for making it
10/14/2009CN100550349C Method of manufacturing field effect transistors
10/14/2009CN100550348C Method of integrated circuit device and forming device using the same
10/14/2009CN100550347C Semiconductor device and method for manufacturing the same
10/14/2009CN100550346C Multi-metal intra-connection structure with optical shielding property and its production method
10/14/2009CN100550345C Method for manufacturing semiconductor device
10/14/2009CN100550344C Method for the production of an integrated circuit arrangement
10/14/2009CN100550343C Shallow groove isolation layer of semiconductor element and manufacturing method thereof
10/14/2009CN100550342C Method for obtaining a thin layer having a low density of holes
10/14/2009CN100550341C Method of forming isolation layer of semiconductor device
10/14/2009CN100550340C Method of manufacturing a semiconductor device
10/14/2009CN100550339C Method for fabricating semiconductor device having trench isolation
10/14/2009CN100550338C Polluting device for anti-slipping sheet
10/14/2009CN100550337C Sheet adhering apparatus
10/14/2009CN100550336C Appratus and methods for suppressing thermally induced motion of a workpiece
10/14/2009CN100550335C Surface form measuring apparatus and method, and stress measuring apparatus and stress measuring method
10/14/2009CN100550334C System and method for integrating in-situ metrology within a wafer process
10/14/2009CN100550333C Gold alloy wire for use as bonding wire
10/14/2009CN100550332C Gold alloy wire for use as bonding wire
10/14/2009CN100550331C Spiral contactor manufacturing method
10/14/2009CN100550330C Method for forming semiconductor package, and metal mold for forming the same
10/14/2009CN100550329C Method of connecting a semiconductor package to a printed wiring board
10/14/2009CN100550328C Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip
10/14/2009CN100550327C A common ball-limiting metallurgy for i/o site and its forming method
10/14/2009CN100550326C Method for manufacturing FinFET transistor
10/14/2009CN100550325C A thin film transistor and its making method
10/14/2009CN100550324C Tri-gate transistors and methods to fabricate same
10/14/2009CN100550323C Semiconductor element, semiconductor device and its manufacture method
10/14/2009CN100550322C Semiconductor on insulator apparatus and method
10/14/2009CN100550321C Method for manufacturing a semiconductor device with nitride and oxide layers
10/14/2009CN100550320C Method for fabricating semiconductor device
10/14/2009CN100550319C Vertical batch processing apparatus
10/14/2009CN100550318C Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics
10/14/2009CN100550317C Method for forming a capacitor dielectric and method for manufacturing capacitor using the capacitor dielectric
10/14/2009CN100550316C Method for forming semiconductor structure and semiconductor structure
10/14/2009CN100550315C Ashing method and ashing apparatus
10/14/2009CN100550314C Device for and method of polishing peripheral edge of semiconductor wafer
10/14/2009CN100550313C Semiconductor device including semiconductor memory element and method for producing same
10/14/2009CN100550312C Multilayer substrate cleaning method, substrate bonding method, and bonded wafer manufacturing method
10/14/2009CN100550311C Polishing pad for CMP, method for polishing substrate using it and method for producing polishing pad for CMP
10/14/2009CN100550310C Method for incising wafer
10/14/2009CN100550309C Method of fabricating semiconductor device, and plating apparatus
10/14/2009CN100550308C Semiconductor device manufacture method
10/14/2009CN100550307C Semiconductor device with bulb-type recessed channel and method for fabricating the same
10/14/2009CN100550306C Method for fabricating semiconductor device with gate stack structure
10/14/2009CN100550305C Flash memory device
10/14/2009CN100550304C TFT substrate for liquid crystal display apparatus and method of manufacturing the same
10/14/2009CN100550303C Group III nitride crystal, method of its manufacture
10/14/2009CN100550302C III nitride semi-conductor material and growing method thereof
10/14/2009CN100550301C Production of poly-silicon thin film
10/14/2009CN100550300C Temperature setting method for heat treating plate, temperature setting device for heat treating plate
10/14/2009CN100550299C Exposure condition setting method, substrate processing unit and computer program
10/14/2009CN100550298C Maintenance system, substrate processing device, remote operation device, and communication method
10/14/2009CN100550297C Method for fabricating fine pattern in semiconductor device
10/14/2009CN100550296C Method for fabricating semiconductor device having bulb-shaped recess gate
10/14/2009CN100550295C Substrate having film pattern and manufacturing method of the same, manufacturing method of semiconductor device
10/14/2009CN100550294C Vacuum processing apparatus
10/14/2009CN100550293C Vacuum processing apparatus
10/14/2009CN100550292C Vacuum processing apparatus
10/14/2009CN100550291C Liquid processing apparatus and method
10/14/2009CN100550290C Method for planarizing film of semiconductor device
10/14/2009CN100550289C Method for forming fine pattern of semiconductor device
10/14/2009CN100550288C Method for forming fine pattern of semiconductor device
10/14/2009CN100550287C Light emitting diodes with improved light extraction by roughening
10/14/2009CN100550286C Substrate processing system
10/14/2009CN100550285C Work piece transfer system for an ion beam implanter
10/14/2009CN100550284C Laser treatment apparatus, laser treatment method, and manufacturing method of semiconductor device
10/14/2009CN100550283C Apparatus for manufacturing flat-panel display
10/14/2009CN100550272C Process for endpoint detection in processing chambers
10/14/2009CN100550271C Showerhead electrode design for semiconductor processing reactor
10/14/2009CN100550254C Antistatic film forming composition, and producing method for conductive film pattern
10/14/2009CN100550193C Storage device using resistance varying storage element and reference resistance value decision method for the device
10/14/2009CN100550185C Semiconductor device
10/14/2009CN100550184C Semiconductor device