Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2009
10/20/2009US7604925 Exposure apparatus and method
10/20/2009US7604922 Reciprocating device; mercury lamps
10/20/2009US7604912 manufacturing a semiconductor device; quantitatively correction by first calculating a effective numerical aperture to a pattern in the each region based on a light intensity distribution, then adjusting to form a desired pattern
10/20/2009US7604911 Coating an interpolymer hydrogen-bonded complex film of a proton donor polymer having a carboxylic or sulfonic acid group and a proton acceptor polymer having an amide group on the surface of a resist pattern to reduce the sizes of openings in the pattern
10/20/2009US7604910 Exposure mask, method of forming resist pattern and method of forming thin film pattern
10/20/2009US7604907 improve patterns at the boundaries of first and second exposure regions during a double exposure process; overlap the two exposure regions to offset the boundary between the binary pattern and the second halftone pattern
10/20/2009US7604905 Photomasks
10/20/2009US7604904 Pellicle for lithography
10/20/2009US7604868 Interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; superior low temperature rapid curability and a long pot life
10/20/2009US7604849 Plasma processing method and apparatus
10/20/2009US7604845 Filling the holes of the internal member with padding plugs each of which has a core member made from a metal material and a metal- resin composite layer covering surface of core; forming a ceramic coating film; extracting the padding plugs
10/20/2009US7604841 Method for extending time between chamber cleaning processes
10/20/2009US7604835 Resist pattern for metalization; catalyst on substrate exposed to vacuum ultraviolet radiation to break carbon to carbon double bonds; washed with surfactant to clean surface before metalization
10/20/2009US7604834 Substrate covered with porous DLC film having odd layers with no pores and even layers with closed pores filled with nitrogen to reduce intrinsic compressive stress; an opening in the film contains a conductor; for use in manufacturing semiconductor integrated circuits
10/20/2009US7604833 Circuit elements formed on a ceramic substrate surface and conductive balls are used as electronic part terminals; using rubber buffers having a concave part to house the balls to protect them when stress is applied tothe substrate to open surface division grooves to divide the substrate; chip resistor
10/20/2009US7604832 Controlling the nozzle discharge amount in an arbitrary position in a second column so as to compensate for the deviation amount obtained in an adjacent discharge position on the first column; continuous processing; automatic; adjustment; calibration; uniform thickness; photolithography; photoresists
10/20/2009US7604751 Polishing liquid composition
10/20/2009US7604750 Method for fabricating semiconductor device
10/20/2009US7604727 Electroplating method for a semiconductor device
10/20/2009US7604709 Plasma processing apparatus
10/20/2009US7604708 Cleaning of native oxide with hydrogen-containing radicals
10/20/2009US7604701 Method and apparatus for removing external components from a process chamber without compromising process vacuum
10/20/2009US7604697 Heteroepitaxial growth method for gallium nitride
10/20/2009US7604690 Composite material for ultra thin membranes
10/20/2009US7604469 Degating device
10/20/2009US7604449 Equipment front end module
10/20/2009US7604439 Non-contact support platforms for distance adjustment
10/20/2009US7604424 Substrate processing apparatus
10/20/2009US7604153 Forming solder balls on substrates
10/20/2009US7604042 Cooling mechanism with coolant, and treatment device with cooling mechanism
10/20/2009US7604010 Film formation apparatus and method of using the same
10/20/2009US7603963 Controlled zone microwave plasma system
10/20/2009US7603772 Methods of fabricating substrates including one or more conductive vias
10/20/2009US7603765 Device for inspecting and rotating electronic components
10/20/2009US7603763 Method for manufacturing a magnetoresistive multilayer film
10/20/2009CA2607856C Polishing composition
10/20/2009CA2412855C Thick single crystal diamond layer method for making it and gemstones produced from the layer
10/15/2009WO2009126922A2 Methods and apparatus for recovery of silicon and silicon carbide from spent wafer-sawing slurry
10/15/2009WO2009126910A2 Laser scribe inspection methods and systems
10/15/2009WO2009126899A2 Laser-scribing platform
10/15/2009WO2009126891A1 Methods for etching carbon nano-tube films for use in non-volatile memories
10/15/2009WO2009126827A2 Plasma processing apparatus and method
10/15/2009WO2009126823A2 A polishing system having a track
10/15/2009WO2009126576A2 Lower liner with integrated flow equalizer and improved conductance
10/15/2009WO2009126529A2 Apparatus including heating source reflective filter for pyrometry
10/15/2009WO2009126501A2 Reliability improvement in a compound semiconductor mmic
10/15/2009WO2009126491A1 Double patterning method
10/15/2009WO2009126490A1 Double patterning method
10/15/2009WO2009126488A1 Modified darc stack for resist patterning
10/15/2009WO2009126478A1 Bpsg film deposition with undoped capping
10/15/2009WO2009126412A1 Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking
10/15/2009WO2009126377A2 Anode for lithium-ion cell and method of making the same
10/15/2009WO2009126352A2 Novel micropores and methods of making and using thereof
10/15/2009WO2009126204A2 High aspect ratio openings
10/15/2009WO2009126148A1 A method of monitoring a surfactant in a microelectronic process by absorbance
10/15/2009WO2009126147A1 A method of monitoring a surfactant in a microelectronic process by fluorescence
10/15/2009WO2009125896A1 Wafer testing apparatus and processing equipment having the same
10/15/2009WO2009125867A1 Stage device, exposure apparatus, and method for manufacturing device
10/15/2009WO2009125844A1 Method for manufacturing bonded substrate
10/15/2009WO2009125835A1 Polishing apparatus, polishing auxiliary apparatus and polishing method
10/15/2009WO2009125806A1 Resin composition for energy ray-curable layer and sheet for forming through hole
10/15/2009WO2009125805A1 Surface inspecting method and surface inspecting apparatus
10/15/2009WO2009125787A1 Diffusing agent composition for ink-jet, and method for production of electrode or solar battery using the composition
10/15/2009WO2009125780A1 Electrodeposited wire tool and method of producing same
10/15/2009WO2009125763A1 Adhesive injection device
10/15/2009WO2009125762A1 Process for producing nanostructure and apparatus for producing nanostructure
10/15/2009WO2009125752A1 Photosensitive resin composition, and photosensitive resin laminate comprising the same
10/15/2009WO2009125748A1 Support device for resonator
10/15/2009WO2009125745A1 Gas discharge chamber
10/15/2009WO2009125731A1 Group iii nitride semiconductor element and epitaxial wafer
10/15/2009WO2009125727A1 Annealing apparatus
10/15/2009WO2009125704A1 Compound for organic thin-film transistor and organic thin-film transistor using the compound
10/15/2009WO2009125697A1 Mold, process for producing the same, and process for producing substrate having transferred fine pattern
10/15/2009WO2009125651A1 Sheet-peeling apparatus and peeling method
10/15/2009WO2009125650A1 Apparatus and method for attaching sheet
10/15/2009WO2009125649A1 Apparatus and method for attaching sheet
10/15/2009WO2009125642A1 Functional solution supply system
10/15/2009WO2009125616A1 Article storage facility
10/15/2009WO2009125615A1 Article transportation facility
10/15/2009WO2009125609A1 Bonding apparatus and bonding method
10/15/2009WO2009125603A1 Specimen observation method and device, and inspection method and device using the method and device
10/15/2009WO2009125595A1 Semiconductor integrated circuit device
10/15/2009WO2009125557A1 Method and device for cutting substrate
10/15/2009WO2009125530A1 Light source device, exposure device and manufacturing method
10/15/2009WO2009125529A1 Method of generating mask pattern and method of forming pattern
10/15/2009WO2009125520A1 Bonding device, method for recognizing position of bonding object used in bonding device, and recording medium on which program for recognizing position of bonding object is recorded
10/15/2009WO2009125511A1 Spatial light modulating unit, illumination optical system, aligner, and device manufacturing method
10/15/2009WO2009125509A1 Crystalline semiconductor stripe transistor and method for fabricating thereof
10/15/2009WO2009125477A1 Cathode electrode for plasma cvd and plasma cvd apparatus
10/15/2009WO2009125459A1 Semiconductor device and method for manufacturing same
10/15/2009WO2009125256A1 Poly-resistor, and linear amplifier
10/15/2009WO2009125255A1 Surface treatment in semiconductor manufacturing
10/15/2009WO2009125250A1 Integrated circuit package, method of manufacturing an integrated circuit package and printed circuit board
10/15/2009WO2009125143A2 Method for forming a priming layer for depositing a metal on a substrate
10/15/2009WO2009124921A1 Self-assembly of chips by substrate
10/15/2009WO2009124886A1 Method of transfer using a ferroelectric substrate
10/15/2009WO2009105556A3 Dual-layer light-sensitive developer-soluble bottom anti-reflective coatings for 193-nm lithography
10/15/2009WO2009105434A3 Apparatus and methods for supplying fuel employed by abatement systems to effectively abate effluents
10/15/2009WO2009105433A3 Methods and apparatus for heating reagents and effluents in abatement systems
10/15/2009WO2009102871A3 Closed loop control and process optimization in plasma doping processes using a time of flight ion detector