Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2009
10/21/2009CN101562142A Method for mounting semiconductor element and method for manufacturing semiconductor device
10/21/2009CN101562141A Method and apparatus for manufacturing electronic device
10/21/2009CN101562140A Packaging method of improving antistatic capability of integrated circuit chip
10/21/2009CN101562139A Luminescence chip encapsulating structure for avoiding reducing luminous efficiency and manufacture method thereof
10/21/2009CN101562138A Method for producing semiconductor packaging part
10/21/2009CN101562137A Method for making double-diffusion drain electrode in high operation voltage MOS
10/21/2009CN101562136A Method for flattening medium surface in heterojunction bipolar transistor (HBT) process
10/21/2009CN101562135A Method of monitoring planarization process of medium
10/21/2009CN101562134A Method for preparing tunnel window
10/21/2009CN101562133A Film formation method and apparatus for forming silicon-containing insulating film doped with metal
10/21/2009CN101562132A Method for corroding submicron emitter in InGaAs/InP HBT by wet process
10/21/2009CN101562131A Method for manufacturing gate structure
10/21/2009CN101562130A Method of fabricating a photomask using self assembly molecule
10/21/2009CN101562129A Method of making inverted trapezoidal cross-section structure by S18 series of positive photoresist
10/21/2009CN101562128A Nitride semiconductor substrate and processing method thereof
10/21/2009CN101562127A Marking device and multi-shaft marking device
10/21/2009CN101562126A Vacuum container and plasma processing apparatus
10/21/2009CN101562125A Method of forming fine patterns of semiconductor device
10/21/2009CN101562124A Cluster apparatus for processing substrate and method for processing substrate using cluster apparatus
10/21/2009CN101562123A Apparatus and method for conveying tabular member
10/21/2009CN101562122A Dry etching method and silicon wafer etching method
10/21/2009CN101562121A Method for monitoring end point of small opening density structure by dry etching
10/21/2009CN101562049A Nanotube-based switching elements and logic circuits
10/21/2009CN101561729A Method for producing transparent substrate double-sided conductive film of touch control circuit
10/21/2009CN101561632A Photoresist resin, and method for forming pattern and method for manufacturing display panel using the same
10/21/2009CN101561629A Method for manufacturing gradual slope of medium edge by photoresist with inverse trapezium section
10/21/2009CN101561628A Method of making air-bridge
10/21/2009CN101561609A Active array substrate, liquid crystal display panel and method for manufacturing active array substrate
10/21/2009CN101561605A Liquid crystal display and method for manufacturing the same
10/21/2009CN101561604A TFT-LCD array substrate structure and manufacturing method thereof
10/21/2009CN101561598A Array basal plate of liquid crystal display as well as manufacturing method and maintaining method thereof
10/21/2009CN101561594A Array basal plate of FFS mode display device and production method thereof
10/21/2009CN101560663A Method for electrochemically preparing nano-array structure materials on basis of nano-mask preparation technique
10/21/2009CN101560373A Polishing slurry for monox, additive liquid and polishing method
10/21/2009CN101560323A Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound
10/21/2009CN101560279A A composition and a multipolymer used in organic antireflective coating
10/21/2009CN101559669A Manufacturing method and device of thin film pattern layer
10/21/2009CN101559628A Ultraviolet laser device for cutting large-width Micro Phone chip
10/21/2009CN100553408C Substrate with embedded element and manufacturing method thereof
10/21/2009CN100553406C Method of forming an integrated circuit substrate
10/21/2009CN100553400C Method for manufacturing plasma processing apparatus
10/21/2009CN100553081C Linear actuator comprising velocity sensor
10/21/2009CN100553032C Transmission line pair
10/21/2009CN100553007C Pixel array of electroluminescent cell
10/21/2009CN100552992C Technology for package of high power luminous element
10/21/2009CN100552986C Method for preparing polysilicon solar battery matte under magnetic field
10/21/2009CN100552978C Split gate memory unit and its array manufacturing method
10/21/2009CN100552977C Thin film transistor, flat panel display device, and method of fabricating the same
10/21/2009CN100552976C Semiconductor device and method for fabricating the same
10/21/2009CN100552975C Semiconductor device and manufacturing method thereof
10/21/2009CN100552974C Semiconductor element and its forming method
10/21/2009CN100552973C Strained channel transistor fabricating method
10/21/2009CN100552971C Field effect transistors having a strained silicon channel and methods of fabricating same
10/21/2009CN100552968C Pixel unit of electroluminescence display and its manufacture method
10/21/2009CN100552966C Solid-state image sensor and method for producing the same
10/21/2009CN100552965C Image sensor and method of manufacture
10/21/2009CN100552964C Image sensor and method for forming the same
10/21/2009CN100552963C Integrated circuit package body and manufacturing method thereof
10/21/2009CN100552962C Method for producing crystal structure electrodes for oriented pzt capacitors
10/21/2009CN100552959C Semiconductor device and method of manufacturing the same
10/21/2009CN100552958C Operation method of multi-bit non-volatile memory device
10/21/2009CN100552956C Semiconductor integrated circuit apparatus and its manufacturing method
10/21/2009CN100552955C Floating set grid storage unit and its manufacturing method
10/21/2009CN100552954C Semiconductor device and manufacturing method thereof
10/21/2009CN100552953C Semiconductor device
10/21/2009CN100552951C Semiconductor device possessing compressed device isolation structure
10/21/2009CN100552948C Semiconductor chip mounting structure and method for manufacturing same
10/21/2009CN100552947C Electronic circuit device of power control system
10/21/2009CN100552945C White light LED packaging structure with silica substrate and its production method
10/21/2009CN100552942C Connecting module structure with passive element and its manufacturing method
10/21/2009CN100552939C Electrostatic discharge protection device and manufacturing method thereof
10/21/2009CN100552936C Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon
10/21/2009CN100552935C Substrates bar, substrate structure and manufacturing method thereof
10/21/2009CN100552934C Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same
10/21/2009CN100552929C Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus and wiring substrate
10/21/2009CN100552927C Flip chip packaging structure with girth member and packaging method thereof
10/21/2009CN100552926C Semiconductor device, wiring board and manufacturing method thereof
10/21/2009CN100552925C Pixel structure and manufacturing method therefor
10/21/2009CN100552924C 显示装置及其制造方法 Display device and method of manufacturing
10/21/2009CN100552923C Method of manufacturing EEPROM device
10/21/2009CN100552922C Method of manufacturing a flash memeory device
10/21/2009CN100552921C Semiconductor device and its making method
10/21/2009CN100552920C Semiconductor component and its manufacturing method
10/21/2009CN100552919C Method of forming a semiconductor device and structure therefor
10/21/2009CN100552918C Method and system for making IC design
10/21/2009CN100552917C Semiconductor component manufacture method
10/21/2009CN100552916C Method for manufacturing semiconductor device by using dual damascene process and method for manufacturing article having communicating hole
10/21/2009CN100552915C Method for reducing area isolation size of high voltage technology
10/21/2009CN100552914C Position correctable bearing tray
10/21/2009CN100552913C Power supply apparatus and deposition method using the power supply apparatus
10/21/2009CN100552912C Thimble for silicon chip up-down in etching equipment
10/21/2009CN100552911C Adjusting mechanism and its adjusting method and producing method of chip
10/21/2009CN100552910C On-line measurement apparatus for high-temperature mechanics behavior of multi-layer film basal body structure
10/21/2009CN100552909C Method for measuring distortion of epitaxial growth picture
10/21/2009CN100552908C Method and apparatus for flip-chip bonding
10/21/2009CN100552907C LED chip packaging structure with thick guide feet and manufacturing method thereof
10/21/2009CN100552906C Multi-layer substrates mutual coupling structure manufacture method and the mutual coupling structure
10/21/2009CN100552905C Method for forming a strained channel in a semiconductor device
10/21/2009CN100552904C Semiconductor structure and its forming method
10/21/2009CN100552903C Method for implementing double-layer grid power MOS structure
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