Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2009
10/27/2009US7608873 Buried-gated photodiode device and method for configuring and operating same
10/27/2009US7608871 Solid image pick-up element with a single layer electrode structure and method of producing the same
10/27/2009US7608870 Isolation trench geometry for image sensors
10/27/2009US7608864 High electron mobility transistor with mesa structure and reduced gate leakage current
10/27/2009US7608860 Light emitting devices suitable for flip-chip bonding
10/27/2009US7608855 Polymer dielectrics for memory element array interconnect
10/27/2009US7608854 Electronic device and method of making the same
10/27/2009US7608853 Semiconductor light emitting diode that uses silicon nano dot and method of manufacturing the same
10/27/2009US7608844 Charged particle beam drawing apparatus
10/27/2009US7608810 Semiconductor device, module, and electronic device including a conversion circuit having a second switch rendered conductive together with a first switch
10/27/2009US7608802 Heating device for heating semiconductor wafers in thermal processing chambers
10/27/2009US7608549 Method of forming non-conformal layers
10/27/2009US7608548 Etching silicon-germanium layers; cleaning with ammonium hydroxide and hydrogen peroxide
10/27/2009US7608547 Sulfuric acid, hydrogen sulfate of alkali metal, and deionized water
10/27/2009US7608546 Method for fabricating a semiconductor device
10/27/2009US7608545 Semiconductor device
10/27/2009US7608544 Etching method and storage medium
10/27/2009US7608543 Method for planarizing thin layer of semiconductor device
10/27/2009US7608542 Large-size glass substrate for photomask and making method, computer-readable recording medium, and mother glass exposure method
10/27/2009US7608541 Method of forming fine pattern, liquid crystal display device having a fine pattern and fabricating method thereof
10/27/2009US7608539 ALD method and apparatus
10/27/2009US7608538 Formation of vertical devices by electroplating
10/27/2009US7608536 Method of manufacturing contact opening
10/27/2009US7608535 Method for forming metal contact in semiconductor device
10/27/2009US7608533 Semiconductor die attachment for high vacuum tubes
10/27/2009US7608532 Method of growing nitride semiconductor material
10/27/2009US7608531 Semiconductor device, electronic device, and method of manufacturing semiconductor device
10/27/2009US7608530 Hetero-crystalline structure and method of making same
10/27/2009US7608529 Method for selective laser crystallization and display panel fabricated by using the same
10/27/2009US7608528 Substrate cover, and charged particle beam writing apparatus and method
10/27/2009US7608527 Laser irradiation method and method for manufacturing crystalline semiconductor film
10/27/2009US7608526 Strained layers within semiconductor buffer structures
10/27/2009US7608525 Method for manufacturing nitride semiconductor substrate
10/27/2009US7608524 Method of and system for forming SiC crystals having spatially uniform doping impurities
10/27/2009US7608523 Wafer processing method and adhesive tape used in the wafer processing method
10/27/2009US7608522 Method for fabricating a hybrid orientation substrate
10/27/2009US7608521 Producing SOI structure using high-purity ion shower
10/27/2009US7608520 Method for bonding substrate, bonded substrate, and direct bonded substrate
10/27/2009US7608519 Method of fabricating trench isolation of semiconductor device
10/27/2009US7608518 Semiconductor device and method for fabricating the same
10/27/2009US7608517 Method for forming capacitor of semiconductor device
10/27/2009US7608516 Semiconductor pixel arrays with reduced sensitivity to defects
10/27/2009US7608515 Diffusion layer for stressed semiconductor devices
10/27/2009US7608514 MSM binary switch memory
10/27/2009US7608513 Dual gate LDMOS device fabrication methods
10/27/2009US7608512 Integrated circuit structure with improved LDMOS design
10/27/2009US7608511 Fabrication method of trenched power MOSFET with low gate impedance
10/27/2009US7608510 Alignment of trench for MOS
10/27/2009US7608509 Method of manufacturing a flash memory device having compensation members formed on edge portions of a tunnel oxide layer
10/27/2009US7608508 Method for manufacturing semiconductor device
10/27/2009US7608507 NAND flash memory devices and methods of fabricating the same
10/27/2009US7608506 Body-contacted semiconductor structures and methods of fabricating such body-contacted semiconductor structures
10/27/2009US7608505 Method of manufacturing non-volatile memory device
10/27/2009US7608504 Memory and manufacturing method thereof
10/27/2009US7608503 Side wall active pin memory and manufacturing method
10/27/2009US7608502 Method for manufacturing semiconductor device
10/27/2009US7608501 Technique for creating different mechanical strain by forming a contact etch stop layer stack having differently modified intrinsic stress
10/27/2009US7608500 Method of forming semiconductor device includeing forming control gate layer over each region and removing a portion of the tunnel insulating layer on the low voltage region
10/27/2009US7608499 Semiconductor structure comprising field effect transistors with stressed channel regions and method of forming the same
10/27/2009US7608498 Method of manufacturing semiconductor device
10/27/2009US7608497 Passivated tiered gate structure transistor and fabrication method
10/27/2009US7608496 High speed GE channel heterostructures for field effect devices
10/27/2009US7608495 Transistor forming methods
10/27/2009US7608494 Thin film transistor array panel and a method for manufacturing the same
10/27/2009US7608493 Thin-film transistor substrate and method of manufacturing the same
10/27/2009US7608492 Method for manufacturing semiconductor device and heat treatment method
10/27/2009US7608491 Method for manufacturing a SOI substrate associating silicon based areas and GaAs based areas
10/27/2009US7608490 Semiconductor device and manufacturing method thereof
10/27/2009US7608489 High performance stress-enhance MOSFET and method of manufacture
10/27/2009US7608488 Semiconductor memory device and method of manufacturing the same
10/27/2009US7608487 B-stageable underfill encapsulant and method for its application
10/27/2009US7608486 Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier
10/27/2009US7608485 Highly reliable, cost effective and thermally enhanced AuSn die-attach technology
10/27/2009US7608484 Non-pull back pad package with an additional solder standoff
10/27/2009US7608483 Method of machining wafer
10/27/2009US7608482 Integrated circuit package with molded insulation
10/27/2009US7608481 Method for producing semiconductor package
10/27/2009US7608480 Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
10/27/2009US7608479 Method of manufacturing semiconductor device and method of treating electrical connection section
10/27/2009US7608478 On-chip igniter and method of manufacture
10/27/2009US7608477 Process for substrate incorporating component
10/27/2009US7608476 Electronic device
10/27/2009US7608475 Buffer layer for promoting electron mobility and thin film transistor having the same
10/27/2009US7608474 Method for manufacturing optical element
10/27/2009US7608473 Image sensor device and manufacturing method thereof
10/27/2009US7608472 Light emitting element and method of making same
10/27/2009US7608471 Method and apparatus for integrating III-V semiconductor devices into silicon processes
10/27/2009US7608470 Interconnection device including one or more embedded vias and method of producing the same
10/27/2009US7608469 Method of fabricating a chip
10/27/2009US7608468 Apparatus and methods for determining overlay and uses of same
10/27/2009US7608467 Switchable resistive perovskite microelectronic device with multi-layer thin film structure
10/27/2009US7608381 Polymer compound, positive resist composition and process for forming resist pattern
10/27/2009US7608380 a polyimide from a bis(aminophenyl)methane or sulfone and a diphenyl(methane or sulfone)-3,3'4,4'-tetracarboxylic acid; photolithographic dispersions; spin coatings for semiconductor wafers
10/27/2009US7608368 Pattern forming method, photomask manufacturing method, semiconductor device manufacturing method, and computer program product
10/27/2009US7608328 Water-permeable adhesive tape
10/27/2009US7608295 Heat resistance, chemical resistance, waterproofing; curing, cyclization polyamic acids
10/27/2009US7608214 Laser beam machining method
10/27/2009US7608196 Method of forming high aspect ratio apertures
10/27/2009US7608195 High aspect ratio contacts
10/27/2009US7608163 Substrate processing apparatus and method
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