Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2009
10/22/2009DE102006062381B4 EEPROM und Verfahren zum Betreiben und Herstellen desselben EEPROM thereof and methods of operating and manufacturing
10/22/2009DE102006050330B4 Verfahren zum gleichzeitigen Auftrennen von wenigstens zwei zylindrischen Werkstücken in eine Vielzahl von Scheiben A method for simultaneously severing at least two cylindrical workpieces in a plurality of discs
10/22/2009DE102006042327B4 Vorrichtung und Verfahren zur Ausbildung dünner Siliciumnitridschichten auf Oberflächen von kristallinen Silicium-Solarwafern Apparatus and method for forming thin silicon nitride films on surfaces of crystalline silicon solar wafers
10/22/2009DE10196441B4 Verfahren zur Herstellung eines MOSFET A method for producing a MOSFET
10/22/2009DE10157280B4 Verfahren zum Anschließen von Schaltungseinheiten Method for connecting circuit units
10/22/2009DE10127622B4 Verfahren zur Herstellung eines mit HDPCVD-Oxid gefüllten Isolationsgrabens A process for preparing a filled isolation trench with oxide HDPCVD
10/22/2009CA2721671A1 Semiconductor device
10/22/2009CA2721668A1 Semiconductor device and method of manufacturing the same
10/22/2009CA2721363A1 Methods of making lateral junction field effect transistors using selective epitaxial growth
10/22/2009CA2721298A1 Method for the selective doping of silicon and silicon substrate treated therewith
10/21/2009EP2110857A1 Bipolar semiconductor device, method for manufacturing the bipolar semiconductor device and method for controlling zener voltage
10/21/2009EP2110856A1 Thin film semiconductor device fabrication method and thin film semiconductor device
10/21/2009EP2110855A1 Thin film transistor and its manufacturing method
10/21/2009EP2110854A2 Floating Gate Memory Device with Interpoly Charge Trapping Structure
10/21/2009EP2110850A2 Device for the mutual contacting of two wafers
10/21/2009EP2110849A2 Interconnect Structure Including Hybrid Frame Panel
10/21/2009EP2110848A1 Modifier for low dielectric constant film, and method for production thereof
10/21/2009EP2110847A1 Method for correcting mask pattern and method for manufacturing acceleration sensor and angular velocity sensor by using same
10/21/2009EP2109892A2 Semiconductor device
10/21/2009EP2109884A1 Method for preparing a germanium layer from an silicon-germanium on-insulator substrate
10/21/2009EP2109883A1 Method of fabrication of highly heat dissipative substrates
10/21/2009EP2109882A1 Method of forming openings in selected material
10/21/2009EP2109881A1 Semiconductor wafter coated with a filled, spin-coatable material
10/21/2009EP2109880A2 Post-supported microbolometer pixel
10/21/2009EP2109879A2 Semiconductor device and method of manufacturing the same
10/21/2009EP2109878A1 System and method for chemical vapor deposition process control
10/21/2009EP2109662A1 Nonflammable compositions comprising fluorinated compounds and use of these compositions
10/21/2009EP2109648A1 Chemical mechanical planarization composition, system, and method of use
10/21/2009EP1966825B1 Process for the collective fabrication of 3d electronic modules
10/21/2009EP1845553B1 Semiconductor manufacturing apparatus, abnormality detection in such semiconductor manufacturing apparatus, method for specifying abnormality cause or predicting abnormality, and recording medium wherein computer program for executing such method is recorded
10/21/2009EP1719153B1 Purging of a wafer conveyance container
10/21/2009EP1665375B1 Solvent-modified resin compositions and methods of use thereof
10/21/2009EP1623462B1 Bit line structure and production method therefor
10/21/2009EP1603612B1 Protective sheath for a cannula
10/21/2009EP1395615B1 Oxime ester photoinitiators having a combined structure
10/21/2009EP1309998B1 Method for electrically connecting a semiconductor component to an electrical subassembly
10/21/2009EP0997935B1 Printed wiring board
10/21/2009CN201332104Y Processing unit for improving work stability of solar cells
10/21/2009CN201332091Y Multiple-suction nozzle type structure of discharge machine
10/21/2009CN201332090Y Packaging mould for electronic devices and components in semi package
10/21/2009CN201332089Y Multi-chemical co-cavity processing device
10/21/2009CN201332088Y Automatic dust remover
10/21/2009CN201329543Y Chemical mechanical grinding device
10/21/2009CN101563783A Memory device with improved performance and method of manufacturing such a memory device
10/21/2009CN101563782A Semiconductor device and method for manufacturing semiconductor device
10/21/2009CN101563772A Integrated circuit capacitor having antireflective dielectric
10/21/2009CN101563771A A susceptor and method of forming a LED device using such susceptor
10/21/2009CN101563770A Annulus clamping and backside gas cooled electrostatic chuck
10/21/2009CN101563769A Disc holding apparatus and defect/foreign material detecting apparatus
10/21/2009CN101563768A Substrate handling system and method
10/21/2009CN101563767A Mask position detection
10/21/2009CN101563766A Semiconductor integrated circuit having heat release pattern
10/21/2009CN101563765A Electronic, in particular microelectronic, functional group and method for its production
10/21/2009CN101563764A Method and device for placing liquid material
10/21/2009CN101563763A Methods and systems for low interfacial oxide contact between barrier and copper metallization
10/21/2009CN101563762A Showerhead electrode assembly with gas flow modification for extended electrode life
10/21/2009CN101563761A Megasonic precision cleaning of semiconductor process equipment components and parts
10/21/2009CN101563760A Method for flattening solid surface with gas cluster ion beam, and solid surface flattening device
10/21/2009CN101563759A Method of working solid surface with gas cluster ion beam
10/21/2009CN101563758A Methods and systems for barrier layer surface passivation
10/21/2009CN101563757A Fast gas switching plasma processing apparatus
10/21/2009CN101563756A Wafer level bumpless method of making a flip chip mounted semiconductor device package
10/21/2009CN101563751A Techniques for low temperature ion implantation
10/21/2009CN101563749A Terminal structure of an ion implanter
10/21/2009CN101563652A Composition for resist lower layer film formation and method for pattern formation
10/21/2009CN101562445A Switching circuit and semiconductor device
10/21/2009CN101562205A Nano-structure and a manufacturing method thereof
10/21/2009CN101562198A Thin-film transistor structure and production method thereof
10/21/2009CN101562197A Thin film transistor, thin film transistor substrate and electronic apparatus
10/21/2009CN101562196A Multi-source common-drain thin-film transistor and preparation method thereof
10/21/2009CN101562194A Semiconductor device and method for manufacturing same
10/21/2009CN101562192A Organic electroluminescent luminous display and manufacturing method thereof
10/21/2009CN101562191A Photoelectric packaging part with cavity and production method thereof
10/21/2009CN101562190A Semiconductor apparatus and fabrication method of the same
10/21/2009CN101562189A Thin film transistor array panel and method for manufacturing the same
10/21/2009CN101562186A Pixel structure and repair method thereof
10/21/2009CN101562184A Single gate nonvolatile memory cell with transistor and capacitor and making method thereof
10/21/2009CN101562183A Single gate nonvolatile memory cell with transistor and capacitor and making method thereof
10/21/2009CN101562182A Integrated hemt and a combination, method as well as a system of a horizontal field effect rectifier
10/21/2009CN101562176A A device of a chip module comprising a frequency enlarging device and a method
10/21/2009CN101562174A LED chip encapsulating structure for backlight module and preparing method thereof
10/21/2009CN101562171A Integrated circuit module and display device comprising same
10/21/2009CN101562170A Suspension board with circuit and production method thereof
10/21/2009CN101562168A Multiple-crystal grain modularized encapsulation structure and encapsulation method thereof
10/21/2009CN101562164A Light emitting diode seat body and forming method thereof
10/21/2009CN101562160A IC card packaging part and production method thereof
10/21/2009CN101562159A Semiconductor device and manufacturing method thereof
10/21/2009CN101562155A Light-emitting device and manufacturing method thereof
10/21/2009CN101562154A Manufacturing method of thin film transistor
10/21/2009CN101562153A Semiconductor device and method for manufacturing the same
10/21/2009CN101562152A Manufacturing method of active element array substrate
10/21/2009CN101562151A Semiconductor structure with metal silicide and method for forming metal silicide
10/21/2009CN101562150A Semiconductor device and fabrication method thereof
10/21/2009CN101562149A Panel, liquid crystal display and formation method of panel
10/21/2009CN101562148A Method for carbon nano tube to achieve vertical interconnection of upper and lower layers of conductive material
10/21/2009CN101562147A Method for removing residual defects
10/21/2009CN101562146A A transmission unit
10/21/2009CN101562145A Method for improving wafer-stage electromigration performance test
10/21/2009CN101562144A Method for manufacturing a semiconductor device, method and structure for mounting the semiconductor device
10/21/2009CN101562143A Method for manufacturing a semiconductor device, method and structure for mounting the semiconductor device