Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2009
10/22/2009US20090263976 Apparatus for manufacturing semiconductor device and method for manufacturing semiconductor device
10/22/2009US20090263975 Film formation method and apparatus for forming silicon-containing insulating film doped with metal
10/22/2009US20090263974 Substrate processing system for performing exposure process in gas atmosphere
10/22/2009US20090263973 Fin mask and method for fabricating saddle type fin using the same
10/22/2009US20090263972 Boron nitride and boron-nitride derived materials deposition method
10/22/2009US20090263971 Method of manufacturing semiconductor device and substrate processing apparatus
10/22/2009US20090263970 Method of forming fine pattern of semiconductor device using sige layer as sacrificial layer, and method of forming self-aligned contacts using the same
10/22/2009US20090263969 Hidden plating traces
10/22/2009US20090263968 Method of fabricating semiconductor device
10/22/2009US20090263967 Method of forming noble metal layer using ozone reaction gas
10/22/2009US20090263966 Apparatus for sputtering and a method of fabricating a metallization structure
10/22/2009US20090263965 Self-aligned barrier layers for interconnects
10/22/2009US20090263964 Interconnections for integrated circuits
10/22/2009US20090263963 Semiconductor device and manufacturing method therefor
10/22/2009US20090263962 Non-volatile memory cell device and methods
10/22/2009US20090263961 Hardware set for growth of high k & capping material films
10/22/2009US20090263960 Semiconductor device with recess gate and method of fabricating the same
10/22/2009US20090263959 Method of manufacturing semiconductor wafer
10/22/2009US20090263958 Clathrate compounds and methods of manufacturing
10/22/2009US20090263957 Method of fabricating semiconductor device
10/22/2009US20090263956 Spray method for producing semiconductor nano-particles
10/22/2009US20090263955 GaN single crystal substrate and method of making the same
10/22/2009US20090263954 Semiconductor Wafer Sawing System and Method
10/22/2009US20090263953 Method for low temperature bonding and bonded structure
10/22/2009US20090263952 Semiconductor device fabrication using spacers
10/22/2009US20090263951 Method for fabricating semiconductor device
10/22/2009US20090263950 Semiconductor device
10/22/2009US20090263949 Transistors having asymmetric strained source/drain portions
10/22/2009US20090263948 Metal oxide semiconductor field-effect transistor (mosfet) and method of fabricating the same
10/22/2009US20090263947 Bottom source LDMOSFET structure and method
10/22/2009US20090263946 Device Having Pocketless Regions and Methods of Making the Device
10/22/2009US20090263945 Manufacturing method of cmos type semiconductor device, and cmos type semiconductor device
10/22/2009US20090263944 Method for making low Vt gate-first light-reflective-layer covered dual metal-gates on high-k CMOSFETs
10/22/2009US20090263943 Method of fabricating semiconductor integrated circuit device
10/22/2009US20090263942 Semiconductor device and method for manufacturing the same
10/22/2009US20090263941 Multi-channel type thin film transistor and method of fabricating the same
10/22/2009US20090263940 Molding cleaning sheet and method of producing semiconductor devices using the same
10/22/2009US20090263939 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
10/22/2009US20090263938 Method for manufacturing semiconductor device
10/22/2009US20090263937 Leadframe package for mems microphone assembly
10/22/2009US20090263936 Insulating Liquid Die-Bonding Agent And Semiconductor Device
10/22/2009US20090263935 Recycling faulty multi-die packages
10/22/2009US20090263929 Methods for producing solid-state imaging device and electronic device
10/22/2009US20090263927 Isolation structures for cmos image sensor chip scale packages
10/22/2009US20090263926 Optical semiconductor device having active layer of p-type quantum dot structure and its manufacture method
10/22/2009US20090263922 Reflective Positive Electrode And Gallium Nitride-Based Compound Semiconductor Light-Emitting Device Using The Same
10/22/2009US20090263921 Thin film transistor substrate with color filter and method for fabricting the same
10/22/2009US20090263920 Protection of cavities opening onto a face of a microstructured element
10/22/2009US20090263919 Plasma oxidation processing method
10/22/2009US20090263918 Methods and apparatuses for determining thickness of a conductive layer
10/22/2009US20090263749 Method of forming fine patterns of semiconductor device
10/22/2009US20090263735 Exposure apparatus
10/22/2009US20090263733 Photo mask, focus measuring method using the mask, and method of manufacturing semiconductor device
10/22/2009US20090263732 Mask patterns including gel layers for semiconductor device fabrication
10/22/2009US20090263716 Anode material having a uniform metal-semiconductor alloy layer
10/22/2009US20090263667 Method of making scratch resistant coated glass article including layer(s) resistant to fluoride-based etchant(s)
10/22/2009US20090263580 Apparatus for manufacturing a quantum-dot element
10/22/2009US20090263577 Liquid processing apparatus and liquid processing method
10/22/2009US20090263292 Method and apparatus for processing polysilazane film
10/22/2009US20090263230 Cluster apparatus for processing substrate and method for processing substrate using cluster apparatus
10/22/2009US20090263216 Method and Device for Removing Pollution From a Confined Environment
10/22/2009US20090263215 End effector for a cluster tool
10/22/2009US20090263214 Fixture for p-through silicon via assembly
10/22/2009US20090262773 Optoelectronic Semiconductor Component With Current Spreading Layer
10/22/2009US20090262771 Semiconductor laser device and method of manufacturing the same
10/22/2009US20090262764 Blue Extended Super Continuum Light Source
10/22/2009US20090262583 Floating gate memory device with interpoly charge trapping structure
10/22/2009US20090262575 Thin film magnetic memory device capable of conducting stable data read and write operations
10/22/2009US20090262572 Multilayer storage class memory using externally heated phase change material
10/22/2009US20090262510 Apparatus and arrangement for shielding a light emitting diode against electrostatic discharge
10/22/2009US20090262346 Optical apparatus of a stacked design, and method of producing same
10/22/2009US20090262327 Mask transport system configured to transport a mask into and out of a lithographic apparatus
10/22/2009US20090262293 Liquid crystal display device and method of fabricating the same
10/22/2009US20090262285 Method of fabricating liquid crystal display device
10/22/2009US20090262175 Heat generation sheet and method of fabricating the same
10/22/2009US20090261897 Applying trenched transient voltage suppressor (TVS) technology for distributed low pass filters
10/22/2009US20090261723 Organic electroluminescent display device and fabricating method thereof
10/22/2009US20090261484 Liquid resin composition, semi-conductor device, and process of fabricating the same
10/22/2009US20090261483 Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
10/22/2009US20090261482 Semiconductor package and method of making same
10/22/2009US20090261481 Wafer level package and method of fabricating the same
10/22/2009US20090261480 Integrated circuit and method of fabricating the same
10/22/2009US20090261478 Semiconductor device and method for manufacturing the same
10/22/2009US20090261477 Semiconductor device and method of manufacturing the same
10/22/2009US20090261476 Semiconductor device and manufacturing method thereof
10/22/2009US20090261473 Low fabrication cost, fine pitch and high reliability solder bump
10/22/2009US20090261472 Power Semiconductor Module with Pressure Element and Method for Fabricating a Power Semiconductor Module with a Pressure Element
10/22/2009US20090261471 Rf power transistor package
10/22/2009US20090261469 Semiconductor package and method for manufacturing the same
10/22/2009US20090261468 Semiconductor module
10/22/2009US20090261466 Semiconductor Device and Method of Forming Vertical Interconnect Structure Using Stud Bumps
10/22/2009US20090261465 Semiconductor device and its manufacturing method
10/22/2009US20090261464 Getter Formed By Laser-Treatment and Methods of Making Same
10/22/2009US20090261462 Semiconductor package with stacked die assembly
10/22/2009US20090261461 Semiconductor package with lead intrusions
10/22/2009US20090261459 Semiconductor device having a floating body with increased size and method for manufacturing the same
10/22/2009US20090261457 Die stacking with an annular via having a recessed socket
10/22/2009US20090261455 Method for the production of a component structure
10/22/2009US20090261454 Capacitor in semiconductor device and method of fabricating the same
10/22/2009US20090261451 Circuit protection device including resistor and fuse element
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