Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2009
10/29/2009US20090269904 Semiconductor device and manufacturing method thereof
10/29/2009US20090269903 Methods for fabricating active devices on a semiconductor-on-insulator substrate utilizing multiple depth shallow trench isolations
10/29/2009US20090269902 Capacitor having tapered cylindrical storage node and method for manufacturing the same
10/29/2009US20090269901 Capacitor element manufacturing jig and capacitor element manufacturing method
10/29/2009US20090269900 Semiconductor device and manufacture method thereof
10/29/2009US20090269899 Semiconductor integrated circuit device with reduced leakage current
10/29/2009US20090269898 Metal oxide semiconductor (mos) field effect transistor having trench isolation region and method of fabricating the same
10/29/2009US20090269897 Methods of fabricating dual-depth trench isolation regions for a memory cell
10/29/2009US20090269896 Technique for Controlling Trench Profile in Semiconductor Structures
10/29/2009US20090269895 Method of Manufacturing Non-Volatile Memory Device
10/29/2009US20090269894 Semiconductor device and method of fabricating the same cross-reference to related applications
10/29/2009US20090269893 Semiconductor integrated circuit device and method of producing the same
10/29/2009US20090269892 Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus
10/29/2009US20090269891 Thermal enhanced package
10/29/2009US20090269890 Semiconductor device
10/29/2009US20090269889 Apparatus for Manufacturing Semiconductor Package for Wide Lead Frame and Method of Constructing Semiconductor Package Using the Same
10/29/2009US20090269888 Chip-based thermo-stack
10/29/2009US20090269887 Apparatus for Manufacturing Semiconductor Package for Wide Lead Frame and Method of Constructing Semiconductor Package Using the Same
10/29/2009US20090269886 Manufacturing Method of Semiconductor Device
10/29/2009US20090269885 Packaged semiconductor device with dual exposed surfaces and method of manufacturing
10/29/2009US20090269884 Active socket for facilitating proximity communication
10/29/2009US20090269883 Controlling Flip-Chip Techniques for Concurrent Ball Bonds in Semiconductor Devices
10/29/2009US20090269882 Rotary chip attach
10/29/2009US20090269881 Manufacturing method of thin film transistor including low resistance conductive thin films
10/29/2009US20090269880 Method for manufacturing thin film transistor
10/29/2009US20090269879 Metalorganic Chemical Vapor Deposition of Zinc Oxide
10/29/2009US20090269878 Embedded waveguide detectors
10/29/2009US20090269877 Method and apparatus for achieving low resistance contact to a metal based thin film solar cell
10/29/2009US20090269875 Method for manufacturing photoelectric conversion device
10/29/2009US20090269873 Liquid-crystal electro-optical apparatus and method of manufacturing the same
10/29/2009US20090269872 Array substrate for liquid crystal display device and method of fabricating the same
10/29/2009US20090269870 Light emitting element, light emitting device and semiconductor device
10/29/2009US20090269869 Multiple reflection layer electrode, compound semiconductor light emitting device having the same and methods of fabricating the same
10/29/2009US20090269868 Methods of Manufacture for Quantum Dot optoelectronic devices with nanoscale epitaxial lateral overgrowth
10/29/2009US20090269867 Method of manufacturing nitride semiconductor and nitride semiconductor element
10/29/2009US20090269866 Method of manufacturing organic light emitting display
10/29/2009US20090269865 Method for PMOS Device Processing Using a Polysilicon Footing Characteristic to Achieve Low Leakage
10/29/2009US20090269864 Method for fabricating a semiconductor device by considering the extinction coefficient during etching of an interlayer insulating film
10/29/2009US20090269863 Method of manufacturing semiconductor device
10/29/2009US20090269862 Alignment method of chips
10/29/2009US20090269861 Device and method for manufacturing a semiconductor wafer
10/29/2009US20090269682 Method of forming etching mask, etching method using the etching mask, and method of fabricating semiconductor device including the etching method
10/29/2009US20090269681 Method of detecting exposure boundary position, and method of fabricating semiconductor device
10/29/2009US20090269593 Functionalized, hydrogen-passivated silicon surfaces
10/29/2009US20090269182 Container for storing plates for electronic circuits and relative method
10/29/2009US20090269178 Method and Apparatus for the Placement of Electronic Components, in Particular Semi Conductor Chips on a Substrate
10/29/2009US20090269171 Substrate processing apparatus and substrate transfer method adopted therein
10/29/2009US20090268774 Vertical cavity surface emitting laser and method of manufacturing the same
10/29/2009US20090268773 Surface emitting laser element, surface emitting laser element array, method of fabricating a surface emitting laser element
10/29/2009US20090268771 Multi-Stripe Laser Diode Desings Which Exhibit a High Degree of Manufacturability
10/29/2009US20090268768 Method of making nitride semiconductor laser, method of making epitaxial wafer, and nitride semiconductor laser
10/29/2009US20090268519 Semiconductor integrated circuit device and data processor device
10/29/2009US20090268513 Memory device with different types of phase change memory
10/29/2009US20090268510 Dynamic random access memory circuit, design structure and method
10/29/2009US20090268508 Reverse leakage reduction and vertical height shrinking of diode with halo doping
10/29/2009US20090268500 Wordline resistance reduction method and structure in an integrated circuit memory device
10/29/2009US20090268495 Electric circuit, use of a semiconductor component and method for manufacturing a semiconductor component
10/29/2009US20090268357 Hybrid ESD Clamp
10/29/2009US20090268189 Masks, lithography device and semiconductor component
10/29/2009US20090268118 Active device array substrate, liquid crystal display panel, electro-optical device, method for fabricating the same, and methods for driving the same
10/29/2009US20090267689 High efficiency amplifier with reduced parasitic capacitance
10/29/2009US20090267686 Semiconductor integrated circuit device
10/29/2009US20090267504 Organic light emitting apparatus and method of producing the same
10/29/2009US20090267492 Method of manufacturing substrate and organic emitting display decive having the substrate
10/29/2009US20090267268 Imprint system and imprint method
10/29/2009US20090267241 Substrate with Check Mark and Method of Inspecting Position Accuracy of Conductive Glue Dispensed on the Substrate
10/29/2009US20090267240 Method of manufacturing an overlay mark
10/29/2009US20090267238 Bridges for interconnecting interposers in multi-chip integrated circuits
10/29/2009US20090267234 Semiconductor Device and Method of Manufacturing a Semiconductor Device
10/29/2009US20090267233 Bonded semiconductor structure and method of making the same
10/29/2009US20090267232 Method of manufacturing an integrated circuit
10/29/2009US20090267230 Package structure for integrated circuit device and method of the same
10/29/2009US20090267228 Intermetallic diffusion block device and method of manufacture
10/29/2009US20090267225 Semiconductor device and method for manufacturing the same
10/29/2009US20090267220 3-d stacking of active devices over passive devices
10/29/2009US20090267219 Ultra-thin chip packaging
10/29/2009US20090267216 Inkjet printed leadframes
10/29/2009US20090267215 Power module substrate, method for manufacturing power module substrate, and power module
10/29/2009US20090267214 Electronic circuit device and method for manufacturing same
10/29/2009US20090267210 Integrated circuit package and manufacturing method thereof
10/29/2009US20090267207 Semiconductor device and manufacturing method thereof
10/29/2009US20090267202 Semiconductor package
10/29/2009US20090267200 Method for manufacturing a semiconductor substrate including laser annealing
10/29/2009US20090267199 Isolation layer having a bilayer structure for a semiconductor device and method for forming the same
10/29/2009US20090267198 Semiconductor device, method for manufacturing semiconductor device and apparatus for manufacturing semiconductor
10/29/2009US20090267197 Semiconductor device for preventing the leaning of storage nodes and method for manufacturing the same
10/29/2009US20090267195 Semiconductor element and method for manufacturing semiconductor element
10/29/2009US20090267193 Semiconductor device and method for manufacturing the same
10/29/2009US20090267192 Cmp methods avoiding edge erosion and related wafer
10/29/2009US20090267191 Semiconductor device and process for producing the same
10/29/2009US20090267190 Freestanding III-Nitride Single-Crystal Substrate and Method of Manufacturing Semiconductor Device Utilizing the Substrate
10/29/2009US20090267189 Photo-patterned carbon electronics
10/29/2009US20090267188 Gallium nitride material processing and related device structures
10/29/2009US20090267187 Method for manufacturing an energy storage device and structure therefor
10/29/2009US20090267186 Semiconductor structure including trench capacitor and trench resistor
10/29/2009US20090267185 Method of manufacturing semiconductor device
10/29/2009US20090267184 Metal-insulator-metal (mim) capacitor structure and methods of fabricating same
10/29/2009US20090267183 Through-substrate power-conducting via with embedded capacitance
10/29/2009US20090267182 Method of increasing the quality factor of an inductor in a seimiconductor device
10/29/2009US20090267181 Semiconductor device and manufacturing method thereof
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