Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2009
10/29/2009WO2009132004A2 Multi-rate resist method to form organic tft electrode and electrodes formed by same
10/29/2009WO2009132003A2 Methods and apparatus for low cost and high performance polishing tape for substrate bevel and edge polishing in semiconductor manufacturing
10/29/2009WO2009131945A2 High throughput chemical mechanical polishing system
10/29/2009WO2009131913A2 Thermal interconnect and interface materials, methods of production and uses thereof
10/29/2009WO2009131902A2 Yttrium and titanium high-k dielectric films
10/29/2009WO2009131892A2 Methods and apparatus for measuring substrate edge thickness during polishing
10/29/2009WO2009131889A2 Method and apparatus for excimer curing
10/29/2009WO2009131857A2 A hardware set for growth of high k and capping material films
10/29/2009WO2009131845A2 Junction formation on wafer substrates using group iv nanoparticles
10/29/2009WO2009131825A2 Adhesion and electromigration improvement between dielectric and conductive layers
10/29/2009WO2009131803A2 Templates for imprint lithography and methods of fabricating and using such templates
10/29/2009WO2009131724A2 Insulated nanogap devices and methods of use thereof
10/29/2009WO2009131587A1 Junction formation on wafer substrates using group iv nanoparticles
10/29/2009WO2009131379A2 Polycrystalline silicon film, a thin-film transistor comprising the same, and a production method thereof
10/29/2009WO2009131364A2 Printed circuit board for electronic devices and method of manufacturing the same
10/29/2009WO2009131346A2 Mems probe card and manufacturing method thereof
10/29/2009WO2009131270A1 Substrate quality tester
10/29/2009WO2009131178A1 Lead-free solder alloy suppressed in occurrence of shrinkage cavity
10/29/2009WO2009131169A1 Al ALLOY FILM FOR DISPLAY DEVICE, DISPLAY DEVICE, AND SPUTTERING TARGET
10/29/2009WO2009131133A1 Polishing agent and method for polishing substrate using the polishing agent
10/29/2009WO2009131132A1 Semiconductor device and method for manufacturing the same
10/29/2009WO2009131106A1 Polyurethane foam and polishing pad
10/29/2009WO2009131100A1 Probe card
10/29/2009WO2009131064A1 Process for producing si(1-v-w-x)cwalxnv base material, process for producing epitaxial wafer, si(1-v-w-x)cwalxnvbase material, and epitaxial wafer
10/29/2009WO2009131063A1 Process for producing si(1-v-w-x)cwalxnv base material, process for producing epitaxial wafer, si(1-v-w-x)cwalxnv base material, and epitaxial wafer
10/29/2009WO2009131051A1 Semiconductor device and method for manufacturing the same
10/29/2009WO2009131048A1 Plasma processing apparatus and plasma processing method using the same
10/29/2009WO2009131035A1 Thin-film transistor manufacturing method, and thin-film transistor
10/29/2009WO2009131016A1 Retainer and substrate storage container provided with same retainer
10/29/2009WO2009130996A1 Melting furnace
10/29/2009WO2009130956A1 Reflective mask blank for euv lithography, and reflective mask for euv lithography
10/29/2009WO2009130922A1 Active matrix substrate, liquid crystal panel, liquid crystal display device, liquid crystal display unit, and television receiver
10/29/2009WO2009130847A1 Method for formation of oxide film for silicon wafer
10/29/2009WO2009130846A1 Laser exposure method, photoresist layer working method, and pattern molding manufacturing method
10/29/2009WO2009130844A1 Layout structure of standard cell, standard cell library, and layout structure of semiconductor integrated circuit
10/29/2009WO2009130841A1 Method for manufacturing thin film transistor substrate
10/29/2009WO2009130822A1 Multilayer wiring, semiconductor device, substrate for display and display
10/29/2009WO2009130794A1 Test system and probe apparatus
10/29/2009WO2009130793A1 Test system and probe apparatus
10/29/2009WO2009130791A1 Matrix substrate manufacturing apparatus
10/29/2009WO2009130790A1 Tray transfer type inline film forming apparatus
10/29/2009WO2009130746A1 Method for manufacturing thin film transistor substrate
10/29/2009WO2009130738A1 Ferromagnetic thin wire element
10/29/2009WO2009130648A1 Semiconductor devices including a field reducing structure and methods of manufacture thereof
10/29/2009WO2009130629A1 A fin fet and a method of manufacturing a fin fet
10/29/2009WO2009130442A1 Method of applying a bump to a substrate
10/29/2009WO2009130416A2 Method for forming porous material in microcavity or micropassage by mechanochemical polishing
10/29/2009WO2009130148A1 Method for manufacturing workpieces with ion-etched surface
10/29/2009WO2009130058A1 Method for producing a semiconductor device with an insulating layer applied in situ
10/29/2009WO2009130011A1 Robot for in-vacuum use
10/29/2009WO2009129989A1 Device and method for processing silicon wafers or planar objects
10/29/2009WO2009129668A1 Solar silicon wafer detection machine and detection method
10/29/2009WO2009129575A1 Device characterisation utilising spatially resolved luminescence imaging
10/29/2009WO2009111395A3 Method for depositing an amorphous carbon film with improved density and step coverage
10/29/2009WO2009110749A3 Low impedance gold electrode and apparatus for fabricating the same
10/29/2009WO2009108438A3 Semiconductor constructions, and methods of forming semiconductor constructions
10/29/2009WO2009108366A3 A semiconductor device comprising a metal gate stack of reduced height and method of forming the same
10/29/2009WO2009102502A3 Apparatus and method for batch non-contact material characterization
10/29/2009WO2009097505A3 Method of forming a probe pad layout/design, and related device
10/29/2009WO2009094275A3 Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
10/29/2009WO2009085694A4 Protective layer for implant photoresist
10/29/2009US20090271140 Semiconductor device
10/29/2009US20090270017 Slurryless Mechanical Planarization for Substrate Reclamation
10/29/2009US20090269942 Multi-functional cyclic siloxane compound and process for preparing dielectric film by using siloxane-based polymer prepared from the compound
10/29/2009US20090269941 Plasma-enhanced deposition process for forming a metal oxide thin film and related structures
10/29/2009US20090269940 Method for nitriding substrate and method for forming insulating film
10/29/2009US20090269939 Cyclical oxidation process
10/29/2009US20090269938 Chemical vapor deposition apparatus
10/29/2009US20090269937 Substrate processing apparatus and method of manufacturing semiconductor device
10/29/2009US20090269936 Substrate Processing Apparatus
10/29/2009US20090269935 Method of Forming Pattern of Semiconductor Device
10/29/2009US20090269934 Plasma treatment method for preventing defects in doped silicon oxide surfaces during exposure to atmosphere
10/29/2009US20090269933 Substrate Processing Apparatus and Semiconductor Device Manufacturing Method
10/29/2009US20090269932 Method for fabricating self-aligned complimentary pillar structures and wiring
10/29/2009US20090269931 Electronic device and method for making the same
10/29/2009US20090269930 Thermal annealing method for preventing defects in doped silicon oxide surfaces during exposure to atmosphere
10/29/2009US20090269929 Non-plasma capping layer for interconnect applications
10/29/2009US20090269928 Method for manufacturing phase change memory device
10/29/2009US20090269927 Method for pitch reduction in integrated circuit fabrication
10/29/2009US20090269926 Polygrain engineering by adding impurities in the gas phase during chemical vapor deposition of polysilicon
10/29/2009US20090269925 Semiconductor device manufacturing method
10/29/2009US20090269924 Method for Forming Fine Pattern by Spacer Patterning Technology
10/29/2009US20090269923 Adhesion and electromigration improvement between dielectric and conductive layers
10/29/2009US20090269922 Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate
10/29/2009US20090269921 Method for growing carbon nanotubes, and electronic device having structure of ohmic connection to carbon element cylindrical structure body and production method thereof
10/29/2009US20090269920 Method of forming interconnection line and method of manufacturing thin film transistor substrate
10/29/2009US20090269919 Split gate type non-volatile memory device
10/29/2009US20090269918 Methods for fabricating memory cells having fin structures with smoot sidewalls and rounded top corners and edges
10/29/2009US20090269917 Method for manufacturing recess gate in a semiconductor device
10/29/2009US20090269916 Methods for fabricating memory cells having fin structures with semicircular top surfaces and rounded top corners and edges
10/29/2009US20090269915 Method for manufacturing semiconductor device preventing loss of junction region
10/29/2009US20090269914 Process for forming a dielectric on a copper-containing metallization and capacitor arrangement
10/29/2009US20090269913 Junction formation on wafer substrates using group iv nanoparticles
10/29/2009US20090269912 Edge seal for a semiconductor device and method therefor
10/29/2009US20090269911 Non-volatile memory and method of manufacturing the same
10/29/2009US20090269909 Nitride based semiconductor device using nanorods and process for preparing the same
10/29/2009US20090269908 Manufacturing method of a semiconductor device
10/29/2009US20090269907 Semiconductor device and method of manufacturing the same
10/29/2009US20090269906 Method for manufacturing semiconductor substrate
10/29/2009US20090269905 Tapered Through-Silicon Via Structure
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